3D PLUS Announces A New 32 Mb PROM Memory

It is organized as 4M x8b, and can operate in either a serial or byte wide mode. The 3DPO32M08VS1419 guaranteed 20 years life data retention and is also used as processors Boot and Program PROM in a variety of high performance and high reliability computer boards.



“3D PLUS is a recognized leader in packaging for Rad-Hard and Rad-Tolerant memory products. We have a longstanding relationship with Xilinx, Inc. as one of their preferred Alliance Members for die packaging and are very excited to be able to offer our new 64 Mbit PROMs specifically targeted for Xilinx’s Virtex-5QV FPGAs,” said Timothee Dargnies, CEO at 3D PLUS USA. “The Virtex-5QV, which is Rad-Hard by design, is being rapidly adopted by the Space community. By coupling Xilinx Virtex-5QV FPGAs with 3D Plus’ 64 Mbit PROM, our mutual customers are achieving the best performance/board area ration for space qualified electronics”.



“The Virtex-5QV device is the first of its kind reprogrammable Single-Event-Upset hardened FPGA specifically designed to withstand the harshest radiation environments. Since introduced in July 2011, the Virtex-5QV FPGAs are being adopted by many space programs utilizing the resource rich devices to build complex, high-performance space systems that can be reprogrammed and updated even after launch.” said, Yousef Khalilollahi, Xilinx Senior Director, Segments Marketing. “We are very pleased that our Alliance Member has introduced these 64 Mbit PROMs, which increases the design flexibility of our space-grade FPGAs and provide our customers with one of the most miniaturized space qualified configuration memory devices.”



Here are the main features of this product:

- Organized as 4M x 8b

- One-time-programmable Read-Only-Memory

- Power supply +3.3 +/- 0.3V

- Simple interface for FPGA configuration Memory

- Serial or Parallel configuration modes

- 20 year life data retention

- Available with military temperature Range -55°C to +125°C

- Radiation tolerance:

o TID > 50 kRad

o Latch-Up and SEU Immune to LET>120 MeV/cm2/mg

- Small form factor with SOP-44 footprint

- Light weight: 2.1 gr



Benefits:

- SEU Immune Radiation Harden Die

- Space Qualified

- No Glue Logic needed to interface with FPGA

- Cascadable for storing longer or multiple Bitstreams

- Small Form Factor

- High mechanical resistance

- High electrical performance