The new M58BW32F is manufactured with an advanced 0.11-micron technology and benefits from ST's experience in standalone and embedded Flash memory products. Automotive-Grade certified, and qualified to the AEC-Q100 standard (revision F) as defined by the Automotive Electronics Council, the new device uses a state-of-the-art architecture to reduce access times to as low as 45nsec over the full automotive temperature range (-40 degrees C to +125 degrees C for the packaged device, -40 degrees C to +150 degrees C in bare die form). Maximum burst frequency is 75MHz across the full temperature range.
The M58BW32F features a wide 32-bit data bus and operates on a nominal 3.3V memory core supply. Enhanced protection techniques include flexible hardware/software protection, a secured command set for Modify operations, a Bank Erase command and a one-shot program from an internal buffer (loaded up to an 8 x Double word maximum). For security, each die embeds a unique device ID to allow the use of cryptographic algorithms to protect against illegal software modifications.
The new automotive Flash memory is offered in an LBGA80 package, which uses ST’s ECOPACK RoHS-compliant lead-free technology, as well as in Certified Bare Die form. All devices are manufactured in ST facilities qualified to ISO/TS 16949:2002, and use ST’s volume-proven state-of-the-art manufacturing and testing technologies to offer reliable solutions for automotive applications.
Engineering samples are available for evaluation now, with volume production planned for Q3 2006. A 16-Mbit device is planned for the second half of 2006.