Memory

Displaying 1 - 10 of 594

Memory sub-system combines NOR flash with self-refresh DRAM

Memory sub-system combines NOR flash with self-refresh DRAM
The S71KL512SC0 HyperFlash and HyperRAM Multi-Chip Package (MCP) from Cypress Semiconductor is available at Mouser Electronics. This memory subsystem solution combines high-speed NOR flash memory for fast-boot and instant-on with a self-refresh DRAM for expanded scratchpad memory in a reduced footprint, low-pin-count package that suits space-constrained and cost-optimised embedded designs.
21st August 2017

NVMe over Fabric solutions displayed at Flash Memory Summit

NVMe over Fabric solutions displayed at Flash Memory Summit
Provider of semiconductor products that enable secure and intelligent processing for enterprise, data centre, cloud, wired and wireless networking, Cavium, showcased a broad range of NVMe over Fabric solutions including FC-NVMe on Gen 6 Fibre Channel and NVMe over Fabrics concurrently over RoCE and iWARP on Cavium FastlinQ 45000/41000 series Ethernet NICs at the Flash Memory Summit 2017 at booth 815 from 8th to 10th August, at the Santa Clara Convention Center.
15th August 2017

OctaFlash memory powers instant-on applications

OctaFlash memory powers instant-on applications
Integrated device manufacturer in the Non-Volatile Memory (NVM) market, Macronix International, has announced the new Ultra-OctaFlash, following its initial launch in 2015. The new ultra-high performance OctaFlash Memory can perform at an operational frequency of 250MHz with 500MB/s read throughput, which it claims to be the fastest in the industry. This new ultra-high performance solution is designed to meet the growing demand for 'instant-on' performance and real time system responsiveness in automotive, industrial and consumer applications.
11th August 2017


Memory controller offers 3D Flash memory support

Memory controller offers 3D Flash memory support
Fabless semiconductor company, Hyperstone, has introduced its new F9 - CompactFlashT memory controller. The F9 is targeting industrial and high-end CompactFlash cards and embedded IDE disk-on-modules. In conjunction with Hyperstone's hyMap Flash translation layer (FTL) and hyReliabilityT firmware features, the F9 provides enhanced endurance and data retention management, as well as rigorous power fail-safe features.
10th August 2017

Enterprise-class SSDs with 64-layer 3D flash memory

Enterprise-class SSDs with 64-layer 3D flash memory
Two new enterprise solid state drive (SSD) solutions have been developed by Toshiba Electronics Europe, the TMC PM5 12Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC’s latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH, making it possible for today’s demanding storage environments to expand the use of flash with cost-optimised 3D flash memory.
10th August 2017

Next-gen client SSD optimised for notebook PCs

Next-gen client SSD optimised for notebook PCs
Delivering better transfer speeds and power efficiency, Toshiba Electronics Europe has announced the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH. This family of SSDs is designed for mainstream desktops and notebooks, consumer upgrades, as well as applications needing data security.
9th August 2017

Flash controllers feature high capacity SSDs

Provider of semiconductor solutions, Microsemi, has announced the production release of its Flashtec NVM Express (NVMe) 2108 eight-channel controllers, enabling enterprises and data centres worldwide to realise cost and power efficient high capacity Solid State Drives (SSDs).
8th August 2017

Single package SSDs reduce size of IoT devices

Single package SSDs reduce size of IoT devices
Based on its latest 64 layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, Toshiba Electronics Europe has announced the availability of the BG3 series, its next-gen single-package ball grid array (BGA) solid state drive (SSD) product line. Designed to fuel the future of mobile devices, Toshiba claims that the BG3 SSDs deliver better performance and a smaller footprint than traditional SATA-based drives.
8th August 2017

A new record for magnetic tape storage

A new record for magnetic tape storage
Research scientists have achieved a new world record in tape storage – their fifth since 2006. The new record of 201 Gb/in2 in areal density was achieved on a prototype sputtered magnetic tape developed by Sony Storage Media Solutions. The scientists presented the achievement today at the 28th Magnetic Recording Conference (TMRC 2017) here.
3rd August 2017

Storage solutions for networks in the era of the IIoT

Manufacturer of flash memory solutions, Swissbit, will be exhibiting its latest memory innovations at the Flash Memory Summit 2017 in Santa Clara, California (8-10th August, 2017).
27th July 2017


Memory documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPE Offshore Europe 2017
5th September 2017
United Kingdom Aberdeen Exhibition & Conference Centre
EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
ON Semiconductor Power Seminars 2017
11th September 2017
United Kingdom
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham