Memory

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EERAM memory offers unlimited endurance

EERAM memory offers unlimited endurance
With the I2C EERAM memory, Microchip presents a new low-cost, low-risk memory solution offering unlimited endurance and safe data storage at power loss. The EERAM memory is available at distributor Rutronik as of now. The new I2C EERAM memory is an easy to implement, non-volatile SRAM (NVSRAM) that offers a robust and dependable data solution thanks to compromising the two reliable memory technologies, EEPROM and SRAM, on a single chip.
23rd February 2017

Piezoelectric-MEMS actuators offer better sound

STMicroelectronics and USound GmbH announced their collaboration on the industrialisation and production of the world's first miniature piezoelectric MEMS (Micro-Electro-Mechanical Systems) actuators for smart audio systems in portable devices. The patented micro-speaker technology from USound aims to replace commonly used balanced-armature and electrodynamic receivers for handsets with a small piezo-MEMS actuator.
22nd February 2017

Software-free USB memory key delivers enhanced feature set

The Aegis Secure Key 3z hardware-encrypted flash drive and the Aegis Configurator have been announced by Apricorn. Building on the success of its predecessor (the Aegis Secure Key 3.0), the Aegis Secure Key 3z is a feature-rich USB drive that includes FIPS-level security and eliminates the vulnerabilities found in software-managed systems.
14th February 2017


First-pass silicon success for storage SoC with Synopsys

Synopsys has announced that Starblaze has achieved first-pass silicon success for its MB1000 enterprise SSD controller using Synopsys' DesignWare ARC HS38 processor as well as DDR4 and PCI Express controller and PHY IP.
1st February 2017

Storage platform delivers fast performance across expanse of data

Pure Storage has announced that FlashBlade is now available and is shipping in both 8.8TB and 52TB blade capacities with the Elasticity 1.2 software.
26th January 2017

Enhanced security for automotive with flash memories

Enhanced security for automotive with flash memories
Cypress Semiconductor introduced 64Mb and 128Mb densities to its family of NOR Flash memories with a Quad Serial Peripheral Interface (Quad SPI). The new FL-L NOR Flash devices provide the utmost reliability and security for high-performance embedded systems that store critical data and operate at extended temperatures. The FL-L devices also offer low power consumption and AEC-Q100 automotive-grade qualification with high read bandwidth and fast program time at an extended temperature range.
26th January 2017

Carbon-based memory to speed up computing

Carbon-based memory to speed up computing
Carbon-based memory materials promise to revolutionise how data is stored and to take computing to a new age in terms of speed, efficiency and power. Improved data storage represents the backbone of the knowledge economy, as well as modern industry, business and multimedia. Creating non-volatile data storage can be accomplished through new carbon-based memory materials, which was the aim of the EU-funded CARERAMM (Carbon resistive random access memory materials) project.
18th January 2017

Acquisition promises an increased chip offering

Acquisition promises an increased chip offering
In April 2016, Microchip completed the acquisition of Atmel Corporation. At electronica, Electronic Specifier Editor Joe Bush caught up with Lucio Di Jasio, Microchip’s European Business Development Manager, to get an update on what the company has been doing since.
13th January 2017

Macronix memory incorporated in reference design

Macronix International announced that the NAND MCP memory solution has been adopted and incorporated by Qualcomm Technologies, a subsidiary of Qualcomm Incorporated as a part of the reference design for a Qualcomm Technologies’ LTE Cat. M1/NB-1 chipset, the MDM9206 modem. Macronix’s industry-standard multichip packages (MCPs) combine RAM and Flash memories into one package, satisfying the demands of today’s consumers on their mobile and connected devices.
13th January 2017

Products integrate NAND chips to manage basic control functions

Products integrate NAND chips to manage basic control functions
  The launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products has been announced by Toshiba Corporation’s Storage and Electronic Devices Solutions Company, with an enhanced operational temperature range of -40 to 105°C.
10th January 2017


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Wearable Technology Show 2017
7th March 2017
United Kingdom ExCel, London
embedded world 2017
14th March 2017
Germany Nürnberg Messe
electronica China 2017
14th March 2017
China Shanghai New International Expo Centre
Southern Manufacturing
21st March 2017
United Kingdom FIVE, Farnborough
Microwave & RF 2017
22nd March 2017
France Paris expo Porte de Versailles