Memory

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HDD delivers high mission critical disk drive performance

HDD delivers high mission critical disk drive performance
A family of 15,000rpm enterprise performance hard disk drives for mission critical servers and storage has been announced by Toshiba Electronics Europe (TEE). With a new 900GB capacity model, the AL14SX series HDD series features a 50% capacity increase and superior performance and power savings compared to Toshiba’s prior AL13SX generation. The AL14SX series is available in 300, 600 and 900GB capacities in a compact 2.5", 15mm form-factor, saving rack space and reducing mission critical storage footprint as well as operational burden.
16th June 2017

Die revisions provide new memory chip source

Die revisions provide new memory chip source
A new die revision (B die) for Alliance Memory's 2Gb and 4Gb devices in the 96-ball FBGA package has been announced, in order to address the memory market's shortage of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs. TJ Mueller, Vice President of Marketing at Alliance Memory, said: "Market demand for DDR3 and DDR3L SDRAMs is extremely high due to their increased functionality and speed, but their availability is becoming more and more limited as demand exceeds supply and suppliers move capacity to Flash and other products.
13th June 2017

Imec demonstrates breakthrough in ferroelectric memory

Imec demonstrates breakthrough in ferroelectric memory
Imec has announced at the 2017 Symposia on VLSI Technology and Circuits the world’s first demonstration of a vertically stacked ferroelectric Al doped HfO2 device for NAND applications. Using a new material and a novel architecture, imec has created a non-volatile memory concept with attractive characteristics for power consumption, switching speed, scalability and retention.
8th June 2017


Power management IC for car audio systems

Power management IC for car audio systems
A new system regulator IC has been launched by Toshiba Electronics Europe (TEE) that is designed to handle the increasing sophistication of car audio systems. The TCB010FNG is a fully-featured solution, incorporating the required power supply and all essential detection functions. TCB010FNG incorporates a multi-rail microcontroller power supply that retains power during minor interruptions in the battery supply. The device also includes multiple variable power supplies for flexibility, as well as a fixed power supply.
8th June 2017

Low-power embedded SRAM achieves battery-free operation

Low-power embedded SRAM achieves battery-free operation
The successful development of a new low-power SRAM circuit technology has been announced by Renesas Electronics. The technology can be embedded in application specific standard products (ASSPs) for Internet of Things (IoT), home electronics, and healthcare applications. The new technology provides a function for switching dynamically, with a low power overhead, between active operation, in which the CPU core performs read and write operations of the embedded SRAM, and the standby mode, in which the stored data is retained.
8th June 2017

Module suitable for low power embedded applications

Module suitable for low power embedded applications
A Qseven Rel. 2.1 compliant module has been released by SECO. The Q7-B03 is based on the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 SoCs. This solution can merge its high graphics performance and extreme temperature with power efficiency. and is available from Rutronik. The graphics of the Q7-B03 module include an integrated Gen9-LP graphics controller with 18 execution units, as well as 4K HW decoding and encoding of HEVC (H.265), H.264, VP8, SVC and MVC.
6th June 2017

Multimedia card suitable for embedded applications

Multimedia card suitable for embedded applications
Manufacturer of flash memory solutions, Swissbit, has announced its latest technology for the industrial market: the embedded multimedia card EM-20. The eMMC combines an industrial controller with reliable multi-level cell (MLC) flash in a BGA153 package making it possible to solder the memory directly onto the printed circuit board of the target application. With capacities from 8-64GB, all typical applications are covered. EM-20 replaces thus far commonly used NAND memory chips, which depend on elaborate operating system resources.
5th June 2017

Compact NVMe SSDs offer up to 1TB capacity

Compact NVMe SSDs offer up to 1TB capacity
A new line of NVM Express (NVMe) SSDs have been launched by Toshiba Electronics Europe (TEE). Integrating 64-layer, 3D flash memories, the XG5 series offers up to 1TB capacity in a compact M.2 form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.
31st May 2017

RoHS-compliant SRAMs offer low power consumption

RoHS-compliant SRAMs offer low power consumption
To meet the demand for high-density fast CMOS SRAMs, Alliance Memory has introduced new 8Mb and 16Mb x32 devices in the 90-ball 8x13mm TFBGA package. Providing space-saving alternatives to solutions in larger 119-ball packages, the devices are optimised for networking routers and switchers, test and medical equipment, and automotive applications. Featuring access times of 10ns and data retention voltages of 1.5V minimum, the 8Mb AS7C325632-10BIN and 16Mb AS7C351232-10BIN are configured as 256Kx32 and 512Kx32, respectively.
22nd May 2017

A better data storage in the making

A better data storage in the making
Techniques and coding theories in information sciences have helped to design new concepts for faster and better data storage. Rapid and reliable data storage is crucial for the success of businesses, online platforms, information repositories and research centres. The EU-funded INFO-STORE (Novel data storage by advancing information sciences) project investigated how to overcome challenges and limitations in emerging data storage applications.
15th May 2017


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EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham
Productronica India 2017
14th September 2017
India Pragati Maidan, New Delhi
Industry of Things World 2017
18th September 2017
Germany Berlin Congress Center