Events News

Displaying 1691 - 1700 of 2005

Chipset powers Gigabit performance over cable into home

Broadcom has introduced a new chipset that will enable operators and service providers to deliver Gigabit performance over currently installed twisted pair copper cabling. The BCM65200 DSP and BCM65900 analogue front end family of chipsets are a high density G.fast solution, providing a critical step in paving the path to Gigabit-speed services over copper to the home.
21st October 2014

Broadband World Forum debuts Wi-Fi conectivity upgrade

Qualcomm subsidiary, Qualcomm Atheros is putting high performance Wi-Fi connectivity in consumers’ hands and homes with the only end-to-end ecosystem of 802.11ac 2.0 solutions with multi-user multi-input/multi-output (MU-MIMO). Home networking manufacturers such as AVM are introducing products based on Qualcomm VIVE 802.11ac chipsets with Qualcomm MU | EFX MU-MIMO technology, which Qualcomm Atheros introduced to improve Wi-Fi performance for the growing number of connected devices on home, business and public networks.
21st October 2014

China event beckons HD surveillance chip sets

Semtech will take its next generation of high performance, low cost transmitter and quad receiver chip sets for HD surveillance applications to the Security China 2014 Conference in Shanghai (Oct 28-31). The new chipsets, the GV7700 and GV7704, are based on Semtech’s High-Definition Visually Lossless CODEC (HD-VLC) technology, providing unprecedented levels of cable reach performance and enabling long-distance transmission of high-quality HD digital video.
21st October 2014


Boundary scan I/O modules enhance test coverage

Boundary scan I/O modules enhance test coverage
GOEPEL electronics has launched the CION-LX Module/FXT96, a new Boundary Scan module with high functionality and dynamics for test of analogue, digital and mixed signals at the ITC International Test Conference 2014 in Seattle. The module allows the extension of Boundary Scan test to non scannable circuit components such as connectors, clusters or analogue interfaces.
21st October 2014

67GHz test setup presented at 5G Global Summit

67GHz test setup presented at 5G Global Summit
Rohde & Schwarz has presented a compact test setup for generating and analysing signals up to 67 GHz at the 5G Global Summit in Busan, South Korea. The test setup consists of the up to 20 GHz R&S SMW200A high-end vector signal generator, a harmonic mixer from subsidiary Radiometer Physics GmbH (RPG) and the R&S FSW67 high-end signal and spectrum analyser.
20th October 2014

LED event garners praise from all sides

The LED professional Symposium + Expo 2014 (LpS 2014), sponsored by UL, Auer Lighting, Tridonic and Osram, has drawn plaudits from many participants that attended the event which showcases the area of design and engineering for future LED lighting systems. “In my opinion, the LpS is one of the most important global LED events. It is really one of the only places where you get all aspects related to the LED”, said Heinz Seyringer, Head of Research Collaborations at Zumtobel and board of stakeholders at Photonics 21.
20th October 2014

Automotive capacitors park up in Munich

Automotive capacitors park up in Munich
There can’t be a more suitable place show an automotive capacitor than Munich, home to BMW, so distributor TTI has chosen electronica to feature capacitors for high temperature automotive applications from Kemet. The devices are ideal for automotive applications above +125°C and up to +200°C, electric and hydraulic steering systems, electronic braking systems, engine and transmission control, as well as stop/start micro hybrid.
17th October 2014

Innovative medical solutions on show at electronica 2014

At electronica 2014, 11th to 14th November in Munich, exhibitors will present new technologies and products in the medical-electronics sector. These will focus on the ongoing miniaturisation, increased efficiency and increased networking of components that make it easier to recognise diseases early and cure them.
17th October 2014

Add value to your application designs

Add value to your application designs
At the Infineon stand (A5.506), visitors can expect to see a raft of live demos, exhibits and 'product to system' innovations which add value to application designs. Company CEO, Dr. Reinhard Ploss, will discuss the IoT at the CEO round table and other speakers from the company have slots at the Embedded Platform Conference, Automotive Conference and Embedded Forum.
17th October 2014

Welcome to the PCB jungle!

Welcome to the PCB jungle!
Visit the Würth Elektronik stand (A2.602) where attendees will be guided quickly and flexibly through the PCB jungle. Product highlights on the Würth booth include SKEDD PCB connecting technology, which enables cables, plug connectors, boards and components to be connected directly to the PCB.
17th October 2014


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