MSC joins Intel’s Embedded Building Blocks initiative

25th May 2011

ES Admin

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MSC Vertriebs GmbH has joined the new Embedded Building Blocks initiative launched by Intel®. The objective of this initiative is to offer system integrators and resellers the opportunity to easily enter the embedded computing market using existing standardized modules with baseboard kits and suitable housings. Compact and robust industrial computer systems for various requirements, such as in industrial automation, can be constructed with the prefabricated Embedded Building Blocks. In this way, integrators can construct individual systems that are quick to deliver and cost-effective, can be used flexible and can be extended at any time.

The Embedded Building Blocks provides scalable platforms: MSC Vertriebs GmbH offers its COM Express™ modules and standard baseboards as well as Mini-ITX enclosures from DSM Computer GmbH. A total of seven COM Express™ module variations, based on various Intel® processor types, are currently offered by MSC. These range from powerful second generation Intel® Core™ i3, i5 and i7 processors, each with dual-core, to power-saving Intel® Atom™ Z5x0 processors. MSC Vertriebs GmbH provides the Embedded Building Blocks and can also deliver memory modules, SSDs from Intel® and accessories. Development and manufacturing of the embedded components as well as the logistics and support in Germany ensure a fast and flexible project implementation.
Martin Engelhardt, Manager Strategic Sales Development at Intel said: “The cooperation with MSC is especially interesting for us because MSC, as an established distributor, has an extensive network of sales offices throughout Europe. Furthermore, for many years, MSC develops and manufactures high-quality and recognized COM Express™ product solutions based on our processor families.”
Wolfgang Eisenbarth, Marketing Manager Embedded Computer Technology at MSC Vertriebs GmbH, added: “Based on our many years of experience in the embedded computer market, we offer an extremely broad range of COM Express™ platforms in combination with a variety of baseboards. All components – even in large quantities – are manufactured here in Germany. Resellers can select the optimum devices for their customer’s application from our scalable COM Express™ modules, similar to a building block system.”

MSC Vertriebs GmbH and DSM Computer GmbH will also participate in the Intel® Roadmap Update & Embedded Device Workshop, which begins in Munich on May 25, 2011 and will be held afterwards in Stuttgart, Zurich, Düsseldorf, Leipzig and Vienna.