Design

IC Validator certified for signoff physical verification

24th October 2014
Nat Bowers
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Synopsys' IC Validator product has been certified by SMIC for signoff physical verification of their 28nm PolySiON (PS) manufacturing process. This provides mutual customers with access to a wider selection of signoff tools for physical verification. Fully qualified Design Rule Checking (DRC) and Layout-Versus-Schematic (LVS) runsets are available for download from the SMIC website.

Part of the Synopsys Galaxy Design Platform, IC Validator is a comprehensive solution for all physical verification tasks, including DRC, LVS, manufacturability enhancement, Electrical Rule Checking (ERC) and metal fill insertion. Multi-core scalability and a modern architecture make IC Validator a suitable signoff tool choice for a growing number of customers who are working on small analogue designs, or large digital SoC designs. Enabling coding at higher levels of abstraction, IC Validator allows SMIC to streamline design rule development and deployment. It also enables them to provide mutual customers with the high accuracy and excellent scalability needed for designs done on leading-edge process nodes.

Antun Domic, Executive Vice President and General Manager, Design Group, Synopsys, comments: "As manufacturing complexity places increased pressure on designers to deliver within tighter schedules, it is important that we continue to collaborate closely with foundries like SMIC. SMIC's certification demonstrates how designers with the most demanding designs are driving the market towards better signoff verification solutions that are also closely integrated into their design flows."

"Formalising our certification of IC Validator is a big step forward in supporting a number of our mutual customers for signoff verification. We are expanding our 28nm pilot production through the end of 2014. We expect that the 28nm product life cycle longevity will exceed previous nodes, and we are pleased to include IC Validator as part of our signoff infrastructure."

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