Design

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ATPG cuts costs, reduces patterns by 50 per cent

A substantial reduction in test generation time from more than a week to days has been achieved by Socionext using Synopsys’s TetraMAX II ATPG. It has also resulted in 50% fewer patterns, compared to the previous TetraMAX ATPG solution and is planned for usage on a 28-nanometer (nm) SoC design.
16th January 2017

Making the most of your installed CATIA V5 licenses

Making the most of your installed CATIA V5 licenses
The release of V19.3, the latest version of Theorem’s Creo to CATIA V5 Multi-CAD product, has been announced by Theorem Solutions. Integrated within the CATIA V5 application, V19.3 supports from CATIA V5-6R2013 up to and including CATIA V5-6R2016, as well as Creo 2.0 and 3.0, providing the user with the highest levels of interoperability.
16th January 2017

Raspberry Pi dives deeper into embedded design

Raspberry Pi dives deeper into embedded design
Three new products – Raspberry Pi Compute Module 3, Raspberry Pi Compute Module Lite and Raspberry Pi Compute Module Development kit have been launched by Farnell element14. The Raspberry Pi Compute Module 3 (CM3) and Compute Module 3 Lite (CM3L) are DDR2-SODIMM-mechanically-compatible System on Modules (SoMs) containing processor, memory, eMMC Flash (CM3 only) and support power circuitry.
16th January 2017


Raspberry Pi adds embedded design ingredient

Raspberry Pi adds embedded design ingredient
Seen at its launch as an educational tool, Raspberry Pi is now flexing its muscles in the industrial arena and today (January 16) added extra punch with the launch of the Raspberry Pi 3 Compute Module aimed at embedded systems designers. It is available now at RS Components in Europe and Asia/Pacific and Allied Electronics in the Americas.
15th January 2017

How the shift towards virtual emulation is reinvigorating

Mentor and Ixia recently announced an integration that bridges the gap between pre-silicon verification and post-silicon validation. Ixia’s IxVerify virtual test tool for pre-silicon testing – working in collaboration with the Veloce Virtual Network (VN) App – aims to catch logic errors and thus identify and resolve defects during the system on chip (SoC) verification flow.
13th January 2017

Update to PCB software shifts focus back to creating designs

Update to PCB software shifts focus back to creating designs
Having experienced record user growth in the past year, Altium has launched the latest version of their PCB design software with Altium Designer 17. This release further embodies Altium’s commitment to passionate design by significantly reducing the time spent on non-design related tasks. 
13th January 2017

Just how safe is your confidential data?

Just how safe is your confidential data?
There are well-known cases in the health, education and financial sectors where the electronic storage of private information has come under attack. However, this threat should also concern the electronics design industry.
13th January 2017

Test solution slashes design convergence time

AltaSens has adopted the Cadence Design Systems Modus Test Solution for its mixed-signal next-generation image sensors. By using the Modus Test Solution in conjunction with other Cadence digital and verification tools on a 90nm process technology, AltaSens has met its aggressive test coverage goals while saving several weeks on design convergence.
11th January 2017

Electronic design house announce the top five projects from 2016

Electronic design house announce the top five projects from 2016
Lithuanian electronic design house, Promwad, has announced its top five projects from 2016 that it has completed for European customers in various industries - telecommunications, medical devices and mobile gadgets.
11th January 2017

Bluetooth 5 Verification IP speeds up time to market

The availability of Cadence's Cadence Verification IP (VIP) for Bluetooth 5 has been announced, which it claims to be the industry’s first VIP for the latest version of Bluetooth technology. Bluetooth 5 increases data broadcasting capacity by 800%, quadruples the range and doubles the connection speed of low-energy devices to deliver seamless, short-range mobile connectivity.
10th January 2017


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