Design

Displaying 1 - 10 of 5002

Evaluation kit accelerates IoT designs

Evaluation kit accelerates IoT designs
The WICED CYW43907 evaluation kit from Cypress Semiconductor is now being shipped by Mouser Electronics. Enabling device evaluation through production, the evaluation kit offers engineers a viable solution that will greatly reduce time to market, risk and cost when producing production-ready Internet of Things (IoT) designs.
17th October 2017

Long-term support for embedded industrial Linux developers

Long-term support for embedded industrial Linux developers
Renesas Electronics has announced the Renesas RZ/G Linux Platform featuring the industrial-grade Civil Infrastructure Platform (CIP) Super Long-Term Support (SLTS) Linux kernel, which enables Linux-based embedded systems to be maintained for more than 10 years. The new Renesas RZ/G Linux Platform provides a verified Linux package with cloud-maintenance and development options that makes it easy for embedded developers to leverage Linux for high-performance industrial equipment.
16th October 2017

Digital and signoff flow supports body-bias interpolation

Digital and signoff flow supports body-bias interpolation
Provider of system design tools, software, IP, and services, Cadence Design Systems, has announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX process technology. The Cadence tools enable advanced-node customers across a variety of vertical markets - including automotive, mobile, IoT and consumer applications - to use GF’s fully depleted silicon-on-insulator (FD-SOI) architecture to optimise the power, performance and area (PPA).
16th October 2017


UVC reference design with dual Sony sensors

UVC reference design with dual Sony sensors
  Embedded camera company specialising in the development of advanced camera solutions, e-con Systems, a Cypress Design Partner, has announced the launch of Tania, an USB3.1 Gen1(5Gb/Sec) UVC reference design kit with dual camera, along with the Cypress Semiconductor and Socionext.
13th October 2017

Simulator improves performance speedup on mixed-signal design

Simulator improves performance speedup on mixed-signal design
In order to accelerate ASIC development for delivery of its automation equipment for test and industrial applications, Cadence Design Systems has announced that Teradyne has standardised its simulation tasks using the Xcelium Parallel Logic Simulator. With the Xcelium simulator, Teradyne achieved a two times performance speedup with production-use single-core, mixed-signal ASIC verification when compared with its previous simulation solution.
13th October 2017

It’s time to overdesign for flexibility

It’s time to overdesign for flexibility
Tired of the countless articles talking about the Industrial Internet of Things (IIoT)? Surely all of the pundits, industry leading companies, and technology providers excited to share their perspective on the growing impact of the IIoT have exhausted the topic. By Jeffrey Phillips, Section Manager - Software, NI
13th October 2017

Modular laptop teaches the skills of tomorrow, today

Modular laptop teaches the skills of tomorrow, today
Launched today, the latest-generation pi-top modular laptop features enhancements to assist learning and boost usability, and is available through RS Components (RS), the trading brand of Electrocomponents.  
13th October 2017

Next-gen instrumentation enabled by high speed converter

Next-gen instrumentation enabled by high speed converter
Analog Devices has announced a 14-bit, 2.6 GSPS dual A/D converter which enables IF/RF sampling with superior speed and linearity. The AD9689 A/D converter features power dissipation of 1.55W per channel, half the dissipation of comparable solutions in the market, thus further increasing suitability for many of its targeted design situations.
12th October 2017

Visual inspection platform streamlines manufacturing process

Visual inspection platform streamlines manufacturing process
Provider of 3D measurement and imaging solutions for factory metrology, construction BIM/CIM, product design, public safety forensics, and 3D solutions applications, FARO, has announced the availability of the FARO Visual Inspect product family. This platform enables large, complex 3D CAD (computer-aided design) data to be transferred to an iPad and then used for mobile visualisation and comparison to real world conditions.
12th October 2017

Free software enables code for faster and cost effective devices

Free software enables code for faster and cost effective devices
  Now avaliable to download from Microchip is the MPLAB Harmony 2.0, the fully featured firmware development framework for PIC32 microcontrollers. The significant update to the software platform enables customers to create smaller and more efficient code for faster and more cost effective devices.
12th October 2017


Design documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Engineering Design Show 2017
18th October 2017
United Kingdom Ricoh Arena, Coventry
ELIV 2017
18th October 2017
Germany Bonn World Conference Center
European Smart Homes 2017
25th October 2017
United Kingdom London
TU-Automotive Europe 2017
6th November 2017
Germany Munich
Productronica 2017
14th November 2017
Germany Messe Munchen