Design

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Computer ‘assistant’ simplifies complex chip design challenges

Computer ‘assistant’ simplifies complex chip design challenges
With applications in devices such as lasers and solar panels, or as alternatives to the curved lenses in powerful microscopes or telescopes, metasurfaces — flat optical chips — offer unparalleled control of light. Created through a monolithic process, each tiny feature on a metasurface can perform its own unique light-scattering task — yet all of those features work together to perform a unified optical function.
20th October 2017

Can you hear me now?

Can you hear me now?
By unveiling the Ezairo Preconfigured Suite (Pre Suite), a development toolkit enabling turnkey solutions based on ON Semiconductor's Ezairo 7100 Digital Signal Processor (DSP), the company continues to grow its portfolio of ultra-low-power solutions for the hearing health industry. The wireless-enabled Ezairo 7150 SL is the first hybrid module to be supported by the Ezairo Pre Suite, with a firmware bundle that makes it easier to build wireless-enabled hearing aids.
18th October 2017

Evaluation kit accelerates IoT designs

Evaluation kit accelerates IoT designs
The WICED CYW43907 evaluation kit from Cypress Semiconductor is now being shipped by Mouser Electronics. Enabling device evaluation through production, the evaluation kit offers engineers a viable solution that will greatly reduce time to market, risk and cost when producing production-ready Internet of Things (IoT) designs.
17th October 2017


Long-term support for embedded industrial Linux developers

Long-term support for embedded industrial Linux developers
Renesas Electronics has announced the Renesas RZ/G Linux Platform featuring the industrial-grade Civil Infrastructure Platform (CIP) Super Long-Term Support (SLTS) Linux kernel, which enables Linux-based embedded systems to be maintained for more than 10 years. The new Renesas RZ/G Linux Platform provides a verified Linux package with cloud-maintenance and development options that makes it easy for embedded developers to leverage Linux for high-performance industrial equipment.
16th October 2017

Digital and signoff flow supports body-bias interpolation

Digital and signoff flow supports body-bias interpolation
Provider of system design tools, software, IP, and services, Cadence Design Systems, has announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX process technology. The Cadence tools enable advanced-node customers across a variety of vertical markets - including automotive, mobile, IoT and consumer applications - to use GF’s fully depleted silicon-on-insulator (FD-SOI) architecture to optimise the power, performance and area (PPA).
16th October 2017

UVC reference design with dual Sony sensors

UVC reference design with dual Sony sensors
  Embedded camera company specialising in the development of advanced camera solutions, e-con Systems, a Cypress Design Partner, has announced the launch of Tania, an USB3.1 Gen1(5Gb/Sec) UVC reference design kit with dual camera, along with the Cypress Semiconductor and Socionext.
13th October 2017

Simulator improves performance speedup on mixed-signal design

Simulator improves performance speedup on mixed-signal design
In order to accelerate ASIC development for delivery of its automation equipment for test and industrial applications, Cadence Design Systems has announced that Teradyne has standardised its simulation tasks using the Xcelium Parallel Logic Simulator. With the Xcelium simulator, Teradyne achieved a two times performance speedup with production-use single-core, mixed-signal ASIC verification when compared with its previous simulation solution.
13th October 2017

It’s time to overdesign for flexibility

It’s time to overdesign for flexibility
Tired of the countless articles talking about the Industrial Internet of Things (IIoT)? Surely all of the pundits, industry leading companies, and technology providers excited to share their perspective on the growing impact of the IIoT have exhausted the topic. By Jeffrey Phillips, Section Manager - Software, NI
13th October 2017

Modular laptop teaches the skills of tomorrow, today

Modular laptop teaches the skills of tomorrow, today
Launched today, the latest-generation pi-top modular laptop features enhancements to assist learning and boost usability, and is available through RS Components (RS), the trading brand of Electrocomponents.  
13th October 2017

Next-gen instrumentation enabled by high speed converter

Next-gen instrumentation enabled by high speed converter
Analog Devices has announced a 14-bit, 2.6 GSPS dual A/D converter which enables IF/RF sampling with superior speed and linearity. The AD9689 A/D converter features power dissipation of 1.55W per channel, half the dissipation of comparable solutions in the market, thus further increasing suitability for many of its targeted design situations.
12th October 2017


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