Design

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Win a Microchip MCP6N16 evaluation board

Win a Microchip MCP6N16 evaluation board
  Win a Microchip MCP6N16 Evaluation Board (ADM00640) from Electronic Specifier Product. The MCP6N16 evaluation board is designed to provide an easy and flexible platform when evaluating the performance of the MCP6N16, a Zero-Drift instrumentation amplifier designed for low voltage operation featuring rail-to-rail input and output performance.
23rd October 2017

RNCS kits for prototyping precision anti-moisture applications

RNCS kits for prototyping precision anti-moisture applications
Stackpole Electronics offers engineering sample kits for their popular RNCS Series of anti-moisture thin film chip resistors. The RNCS0603BKE kit offers 20 pieces each of the 45 most popular 0603 values ranging from 49.9 ohms up to 249K in 0.1% tolerance and 25 ppm TCR. The RNCS0805BKE kit offers 20 pieces each of the 47 most popular 0805 size values from 10 ohms to 499K also in 0.1% tolerance and 25 ppm TCR. Parts are packaged in cut tape and provided in a compact binder for convenience.
23rd October 2017

Computer ‘assistant’ simplifies complex chip design challenges

Computer ‘assistant’ simplifies complex chip design challenges
With applications in devices such as lasers and solar panels, or as alternatives to the curved lenses in powerful microscopes or telescopes, metasurfaces — flat optical chips — offer unparalleled control of light. Created through a monolithic process, each tiny feature on a metasurface can perform its own unique light-scattering task — yet all of those features work together to perform a unified optical function.
20th October 2017


Can you hear me now?

Can you hear me now?
By unveiling the Ezairo Preconfigured Suite (Pre Suite), a development toolkit enabling turnkey solutions based on ON Semiconductor's Ezairo 7100 Digital Signal Processor (DSP), the company continues to grow its portfolio of ultra-low-power solutions for the hearing health industry. The wireless-enabled Ezairo 7150 SL is the first hybrid module to be supported by the Ezairo Pre Suite, with a firmware bundle that makes it easier to build wireless-enabled hearing aids.
18th October 2017

Evaluation kit accelerates IoT designs

Evaluation kit accelerates IoT designs
The WICED CYW43907 evaluation kit from Cypress Semiconductor is now being shipped by Mouser Electronics. Enabling device evaluation through production, the evaluation kit offers engineers a viable solution that will greatly reduce time to market, risk and cost when producing production-ready Internet of Things (IoT) designs.
17th October 2017

Long-term support for embedded industrial Linux developers

Long-term support for embedded industrial Linux developers
Renesas Electronics has announced the Renesas RZ/G Linux Platform featuring the industrial-grade Civil Infrastructure Platform (CIP) Super Long-Term Support (SLTS) Linux kernel, which enables Linux-based embedded systems to be maintained for more than 10 years. The new Renesas RZ/G Linux Platform provides a verified Linux package with cloud-maintenance and development options that makes it easy for embedded developers to leverage Linux for high-performance industrial equipment.
16th October 2017

Digital and signoff flow supports body-bias interpolation

Digital and signoff flow supports body-bias interpolation
Provider of system design tools, software, IP, and services, Cadence Design Systems, has announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX process technology. The Cadence tools enable advanced-node customers across a variety of vertical markets - including automotive, mobile, IoT and consumer applications - to use GF’s fully depleted silicon-on-insulator (FD-SOI) architecture to optimise the power, performance and area (PPA).
16th October 2017

UVC reference design with dual Sony sensors

UVC reference design with dual Sony sensors
  Embedded camera company specialising in the development of advanced camera solutions, e-con Systems, a Cypress Design Partner, has announced the launch of Tania, an USB3.1 Gen1(5Gb/Sec) UVC reference design kit with dual camera, along with the Cypress Semiconductor and Socionext.
13th October 2017

Simulator improves performance speedup on mixed-signal design

Simulator improves performance speedup on mixed-signal design
In order to accelerate ASIC development for delivery of its automation equipment for test and industrial applications, Cadence Design Systems has announced that Teradyne has standardised its simulation tasks using the Xcelium Parallel Logic Simulator. With the Xcelium simulator, Teradyne achieved a two times performance speedup with production-use single-core, mixed-signal ASIC verification when compared with its previous simulation solution.
13th October 2017

It’s time to overdesign for flexibility

It’s time to overdesign for flexibility
Tired of the countless articles talking about the Industrial Internet of Things (IIoT)? Surely all of the pundits, industry leading companies, and technology providers excited to share their perspective on the growing impact of the IIoT have exhausted the topic. By Jeffrey Phillips, Section Manager - Software, NI
13th October 2017


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European Smart Homes 2017
25th October 2017
United Kingdom London
TU-Automotive Europe 2017
6th November 2017
Germany Munich
Productronica 2017
14th November 2017
Germany Messe Munchen
Future Armoured Vehicles Survivability 2017
14th November 2017
United Kingdom London
POWER & ENERGY 2017
22nd November 2017
Rwanda Kigali