Company Details
Tensilica
3255-6 Scott Blvd.
Santa Clara
CA 95054
United States of America
Phone
(408) 986-8000
Fax
(408) 986-8919
Web Address
www.tensilica.com
Tensilica adds FLAC Decoder to HiFi Audio Codec Library
Tensilica today announced that it has added the Free Lossless Audio Codec (FLAC) decoder to its ever-growing library of software for its HiFi Audio DSP family of IP (intellectual property) cores for SOC (system-on-chip) design. FLAC is an audio format similar to MP3, but lossless so the audio is compressed without any loss in quality. Because it is not a proprietary format, is not encumbered by patents, and has an open-source reference implementation, FLAC has become increasingly popular. More information on FLAC is available at http://flac.sourceforge.net.
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Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS10 Multistream Decoder
Tensilica Inc. today announced that it is the first IP (intellectual property) company with an audio core for system-on-chip (SOC) designs approved for using the Dolby® MS10 Multistream Decoder, a multi-format audio decoding technology, that supports Dolby Digital Plus and Dolby Pulse in a single package for next-generation HDTVs (high-definition televisions), STBs (set-top boxes) and DMPs (digital media players).
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Tensilica Expands Wireless Baseband Business Unit, Hires Texas Instruments Veteran Eric Dewannain as Vice President/General Manager
Tensilica today announced that it has expanded its baseband business unit and hired Eric F. Dewannain as vice president and general manager. Dewannain was previously general manager of the custom ASIC business unit at Texas Instruments, Incorporated (TI) and, prior to this, general manager of the cable broadband communications business unit. Dewannain has extensive business experience in mobile wireless infrastructure and broadband communications.
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Tensilica and Iberium Partner for Solutions for DTV Market
Tensilica, Inc. and Iberium Communications, Inc. today announced that they have established a partnership to develop solutions for digital television (DTV). Tensilica is the leading provider of dataplane processors (DPUs) for system-on-chip (SOC) designs. Iberium is a leader in semiconductor IP cores for DTV.
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Express Logic ThreadX Available for Tensilica's New Third-Generation Diamond Standard Dataplane Processor Cores
Tensilica, Inc. and Express Logic, Inc. today announced that Express Logic's ThreadX real-time operating system (RTOS) is now available for Tensilica's new third-generation Diamond Standard dataplane processor (DPU) cores. A free demo download of the ThreadX RTOS is available on the Tensilica web site at http://www.tensilica.com/partners/operating-systems/express-logic/threadx.htm. Designed for small-footprint, demanding real-time control, the ThreadX RTOS is a perfect match for the Diamond Standard family of general-purpose, low-power cores aimed at deeply embedded control and signal processing functions.
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Tensilica Introduces Third Generation ConnX 545CK 8-MAC VLIW DSP Core
Tensilica, Inc. today introduced its third generation ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP (digital signal processor) core for system-on-chip (SOC) designs. Improvements in this third generation dataplane processor (DPU) core deliver up to 20 percent faster clock speed, 11 percent smaller die and up to 30 percent lower power consumption.
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Tensilica Showcases Growth in Japan, Moves to New Location, And Hosts Customer Seminar
Tensilica, Inc. today announced that its Japan office has moved to a larger, more easily accessible office building and is celebrating the move and its success in the Japan market with a customer seminar on May 24. Highlights of the seminar include presentations by NTT DOCOMO and Epson, as well as discussions of Tensilica's popular HiFi audio DSPs (digital signal processors) and ConnX Atlas LTE (long-term evolution) reference architecture.
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Wolfson licenses Tensilica HiFi Audio to provide a high quality, power efficient sound platform
Wolfson Microelectronics plc and Tensilica, Inc., today announced a licence agreement to create a low power, high definition (HD) sound platform. Combining Wolfson's world-leading mixed-signal technology and audio expertise with Tensilica's innovative HiFi audio digital signal processor (DSP) cores, this licence agreement will bring HD sound to multimedia platforms, including mobile handsets, netbooks, smartbooks, digital TVs and other multimedia devices.
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Tensilica Introduces Third Generation ConnX 545CK
Tensilica Inc. today introduced its third generation ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP (digital signal processor) core for system-on-chip (SOC) designs. Improvements in this third generation dataplane processor (DPU) core deliver up to 20 percent faster clock speed, 11 percent smaller die are and up to 30 percent lower power consumption.
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Express Logic ThreadX Available for Tensilica's New Third-Generation Diamond Standard Dataplane Processor Cores
Tensilica Inc. and Express Logic Inc. announced that Express Logic's ThreadX® real-time operating system (RTOS) is now available for Tensilica's new third-generation Diamond Standard dataplane processor (DPU) cores. A free demo download of the ThreadX RTOS is available on the Tensilica web site at http://www.tensilica.com/partners/operating-systems/express-logic/threadx.htm. Designed for small-footprint, demanding real-time control, the ThreadX RTOS is a perfect match for the Diamond Standard family of general-purpose, low-power cores aimed at deeply embedded control and signal processing functions.
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IntegrIT Joins Tensilica's Xtensions Partner Network for DSP Software Services
Tensilica announced that IntegrIT DSP Design House, a leading supplier of DSP (digital signal processing) software solutions, has joined Tensilica's Xtensions™ partner network to provide vital software components, including the high-performance Nature DSP Signal+ library, for the ConnX Baseband Engine, HiFi Audio DSPs and the ConnX D2 communications DSP. The IntegrIT Nature DSP Signal+ is a collection of signal processing functions that assist the implementation of typical DSP algorithms. All functions are optimized for and utilize the full data bus bandwidth and computing power of each of the ConnX DSPs. The IntegrIT Nature DSP Signal+ library features over 30 common math and signal functions and is designed to be useful in practical real-time DSP applications.

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Multiple Tensilica IP Cores Power NEC, Fujitsu and Panasonic Mobile Communications Fully Functional LTE Handset SOC for Major Japanese WirelessCarrier
Tensilica announced that NTT DOCOMO has confirmed that several Tensilica Xtensa LX dataplane processor cores (DPUs) are used in the latest LTE (Long-Term Evolution) mobile handset system-on-chip (SOC) design demonstrated in February at the Mobile World Congress (Barcelona, Spain). NTT DOCOMO previously exhibited the device developed under a collaborative project among DOCOMO, Fujitsu, NEC and Panasonic Mobile Communications (Panasonic Mobile), who will deploy the chip for their LTE handsets and datacards.
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Tensilica Introduces Third Generation Diamond Standard Controllers Optimized for Low Power, High Performance Applications
Tensilica Inc. today introduced its third generation of Diamond Standard controllers. This family of five upward-compatible processor cores is based on a common Xtensa architecture and provides the price/performance/low-power required for a wide range of embedded control functions in today's compute-intensive dataplane functions. Improvements in this third generation of Diamond Standard controllers deliver up to 15 percent faster clock speed, up to 20 percent smaller die area and up to 15 percent less power consumption.
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mimoOn Joins Roster of Tensilica's Rapidly Expanding Xtensions Program for Fast LTE/4G Development
Tensilica announced that its ConnX Baseband Engine comes with the broad ecosystem support of Tensilica's Xtensions(TM) Partner Network , including the newest Xtensions member, mimoOn. (see separate press release). Tensilica's Xtensions Partner Program brings its LTE (Long Term Evolution) baseband handset and base station design customers a robust infrastructure of top-tier partners in SOC (system-on-chip) design-critical areas such as LTE physical layer software solutions, system level modeling, real time operating systems emulation, and design services.
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Tensilica and mimoOn Partner for LTE Baseband Handset Solutions
mimoOn, a pioneer in LTE software implementations for programmable radio platforms, and Tensilica® Inc., a leader in programmable and efficient IP cores for advanced mobile wireless SOCs (system-on-chips), today announced a partnership to offer best-in-class LTE solutions for mobile wireless radios based on mimoOn's mi!MobilePHY software and Tensilica's newly announced ConnX Baseband Engine (BBE16) and ConnX Atlas LTE Reference Design.
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Tensilica: HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores
Tensilica announced today that HiSilicon Technologies has licensed Tensilica's Xtensa® customizable dataplane processors (DPUs) and ConnX(TM) DSP (digital signal processing) semiconductor IP cores. HiSilicon will use Tensilica's DPUs and DSPs in network equipment chip design.
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Tensilica Introduces ConnX Atlas Reference Architecture for LTE
Tensilica introduced its ConnX Atlas LTE (Long-Term Evolution) reference platform, a heterogeneous seven-core reference architecture for a complete multi-standard programmable radio for advanced mobile devices. Atlas is designed to support the 3GPP (3rd Generation Partnership Project) LTE standard, as well as other complementary standards such as HSPA+ (Evolved High-Speed Packet Access), in a single platform. No additional hardwired hardware blocks are required, even for the computationally complex turbo decoder at 154 Mbps downstream data rates.
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Tensilica - Second Generation ConnX BaseBand Engine DSP for Demanding Algorithms for LTE/4G Wireless Handsets and Base Stations
Tensilica introduced ConnX BBE16, its second generation baseband engine for LTE and 4G baseband SOC designs. ConnX BBE16's 16-way MAC architecture is optimized for the most demanding wireless DSP tasks, including OFDM algorithms and FFT, FIR, IIR, and matrix computation.

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Tensilica Introduces HiFi EP DSP Core for High Quality Audio in Home Entertainment and Smartphone Applications
Building on the success of its HiFi 2 Audio DSP, the leading architecture for audio in system-on-chip (SOC) designs, Tensilica today introduced HiFi EP, a superset of the HiFi 2 architecture that is optimized for simultaneous multichannel codec support and/or continuously expanding audio pre and post processing in home entertainment products such as Blu-ray Disc players, digital television (DTV), and Smartphones.
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Tensilica Demonstrates Success in Audio/Video and Broadband Communications at CES 2010
A host of products based on Tensilica's dataplane processors will be demonstrated at this year's Consumer Electronics Show, January 7-10 in Las Vegas. These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including Blu-ray Disc players, Bluetooth-enabled devices, LCD TVs, cellular phones, WiFi- and W-USB-enabled notebook computers, wireless HDMI, handheld games, and inkjet and laser printers. Tensilica will showcase its leading-edge audio, video and baseband communication IP cores, including the popular HiFi 2 Audio Engine running on the Android platform in collaboration with MIPS Technologies, in the South Hall of the Las Vegas Convention Center, suite South 4 35567MP. To schedule an appointment to see the demo, please contact paula@tensilica.com.
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Tensilica Delivers New Design Flow Support for Synopsys' Galaxy Implementation Platform Technologies
Tensilica, Inc. today announced that it now provides out-of-the-box automated design flow support for key technologies within Synopsys' Galaxy Implementation Platform, including DC Ultra RTL synthesis and IC Compiler place-and-route, for Tensilica's new Xtensa 8 and Xtensa LX3 dataplane processors (DPUs). This latest design flow provides up to 15% improvement in processor speed, area and power, in addition to faster design closure over previous Synopsys-based design flows, thus offering immediate benefits to Tensilica customers.
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Top EDA Companies Endorse Tensilica's Pin-Level SystemC Models
Tensilica has announced that it has expanded the range of processor modeling options with the introduction of pin-level SystemC models of its Xtensa customizable dataplane processors (DPUs). With this novel feature, Tensilica now offers the widest array of modeling choices of any provider of licensable microprocessor or DSP (digital signal processing) IP cores.
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Tensilica Announces Enhanced Tools for Dataplane Processor Design and Software Development
Tensilica has announced its eighth generation tools that further automate customized Xtensa dataplane processor (DPU) design and speed software development. Improvements cover improved compiler technology, better multi-core system simulation and profiling, an upgraded integrated development environment (IDE), and pin-level co-simulation with RTL.
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Tensilica DPU Family Delivers 10 GigaMAC/sec DSP Performance, Tops 1 GHz Mark
Tensilica has introduced the Xtensa LX3 high-performance dataplane processor (DPU) core optimized for digital signal processing (DSP) and control in the system-on-chip (SOC) dataplane. The Xtensa LX3 DPU offers the industry's widest range of pre-verified DSP options ranging from a simple floating point accelerator to a 16-MAC (multiply accumulator) vector DSP powerhouse.
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Ultra-Low Power Dataplane Processor Core for Deeply Embedded Control
Tensilica has introduced the Xtensa 8 customizable processor, the eighth generation of its low-power dataplane processor cores (DPUs). The Xtensa 8 processor core starts at a size of just 15,000 gates, consuming less than 0.05mm2 in 40nm process technology - making it one of the smallest licensable controller cores on the market. With power dissipation starting at just 12 µW/MHz, it's also one of the lowest power licensable 32-bit architectures.
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Tensilica - New DSP Engine Combines Outstanding Performance, Compact Size, and Easy Programmability
Tensilica has introduced the high-performance, small, low-power ConnX D2 16-bit dual-MAC (Multiply Accumulator) DSP (Digital Signal Processor) engine for its proven Xtensa LX dataplane processor cores for SOC (System-on-Chip) designs. The ConnX D2 DSP engine provides uncompromised performance from C code, unlike many other DSPs that require time consuming assembly coding for maximum performance. This means that virtually any C program, including those written with C intrinsic functions for the TI C6x family or ITU (International Telecommunications Union) reference code, can run unmodified and with excellent performance on the ConnX D2 DSP engine.
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Blue Wonder Communications to Develop LTE Baseband IP Using Multiple Optimized Tensilica Dataplane Processors
Tensilica has announced that Blue Wonder Communications has licensed Tensilica's Xtensa dataplane processors (DPUs) for an LTE (Long-Term Evolution) embedded broadband modem design. Blue Wonder Communications is an independent design house developing mobile broadband solutions for the telecommunications and semiconductor industries. Many of the employees at Blue Wonder Communications previously were employed by NXP's wireless division and have extensive expertise in high-data-rate wireless design.
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Tensilica - High-Performance ConnX Baseband Engine for LTE and 4G Wireless DSP Handsets and Base Stations
Tensilica has announced the first member of its new ConnX family of DSP cores for system-on-chip design. The ConnX Baseband Engine enables efficient baseband processing for 3G, LTE (Long-Term Evolution) and 4G wireless equipment with its scalable, high-performance DSP architecture that provides industry leading computational throughput of 16 18-bit MACs per cycle. The ConnX Baseband Engine features an optimized instruction set, high memory bandwidth, scalable clustering, and efficient compiler support with an easy programming model for SIMD (Single Instruction, Multiple Data) vectorization and other DSP functions. This high performance core is also an effective solution for multi-standard fixed and mobile DTV broadcast demodulators.
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High-Performance ConnX Communications DSP Family for LTE and 4G SOC Designs
Tensilica has introduced a family of high-performance communications DSP IP cores – the ConnX DSP family – that include standard cores, click-box configurable options or a starting point for customized Xtensa LX DPUs (dataplane processor units) for SOC designs. The newest member of the family, the ConnX Baseband Engine – see separate press release – provides industry leading computational throughput (sixteen 18-bit MACs per cycle) due to its application-specific instruction set optimized for compute-intensive LTE (Long-term Evolution) and 4G wireless base stations. Tensilica plans other ConnX family members for the low-power requirements of the handset market.
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TranSwitch Integrates Xtensa Processors
Tensilica has announced that TranSwitch Corporation has integrated two Xtensa customizable Dataplane Processor Units (DPUs) into its recently introduced Atlanta 2000 gigabit-rate communications processor product family. Atlanta 2000 offers robust gateway routing, security and VoIP capabilities with unmatched performance and power efficiency, enabling customers to develop the next generation of high-performance green networking products and services for residential, small office/home office, and small-to-medium-sized business CPE (customer premise equipment) applications.
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SiliconXpress is latest Tensilica Design Center
Tensilica has announced that SiliconXpress has become its newest authorized design center. SiliconXpress is a fabless chip provider, headquartered in Lubbock, Texas, offering one-stop design, fabrication, test, and packaging services. Tensilica is a major semiconductor IP supplier specializing in dataplane processor cores which are a combination of CPU and DSP that can be rapidly customized to provide 10-100x the performance of standard CPUs and DSPs.
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HiFi 2 Audio DSP from Tensilica supports HE AAC by Dolby
Tensilica has announced the immediate availability of the Digital Radio Mondiale (DRM) decoder on its popular HiFi 2 Audio DSP, which can be easily integrated into system-on-chip (SOC) designs. The implementation is based on software developed by Dolby and has passed Dolby's certification procedure. Now designers of digital radio systems can use one processor core -- Tensilica's HiFi 2 Audio DSP -- to run all decoders required throughout the world for digital radio, enabling a universal worldwide digital radio receiver. Tensilica's HiFi 2 Audio DSP already has support for four other terrestrial and satellite standards: DAB, DAB+, HD Radio, and XM Radio.
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Tensilica Adds Mahesh Venkatraman as New VP of Marketing Vertical Segments
Tensilica has announced that Mahesh Venkatraman has joined Tensilica as vice president of marketing, vertical segments. In this new position, Venkatraman will report to company president and CEO, Jack Guedj, and is responsible for the marketing, strategic business development, and partnerships for audio, video, and baseband digital signal processing vertical segments.
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Tensilica Enables Easy Addition of Bluetooth Audio to Portable Devices
Tensilica has announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP, which can easily be integrated into system-on-chip (SOC) designs. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HiFi 2 Audio DSP.
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Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP in Barcelona
Tensilica will demonstrate its audio, video and baseband DSP (digital signal processing) processor cores for wireless mobile devices and base station systems at the Mobile World Congress (MWC) exhibition in Barcelona next week, February 16-19. Major systems and semiconductor companies will be showcasing products using Tensilica's technology, and many 4G/LTE, PicoCell and FemtoCell, WiFi, mobile digital radio, and mobile digital TV baseband communications SOC (system-on-chip) designs are now in progress based on Tensilica's customizable dataplane processors.
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UpZide Becomes Tensilica Authorized Software Design Center
Tensilica has announced that UpZide Technologies AB is now an authorized Tensilica Software Design Center. Over the past three years, UpZide has worked extensively on designs with Tensilica's Xtensa customizable processors, and have strong expertise in optimizing these processors for VDSL2 (very high bit rate digital subscriber line), the most advanced standard for DSL communications. UpZide is now available to help other companies with their wireless datapath or baseband designs, including LTE (long-term evolution) and UWB (ultra wideband).
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Tensilica's Diamond Standard 330HiFi Audio DSP Licensed by Fujitsu
Tensilica has announced that its Diamond Standard 330HiFi Audio DSP (digital signal processor) has been licensed by Fujitsu Microelectronics Limited for use in a customer's portable consumer electronics design.
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Tensilica Enables Single Audio Core Blu-ray Disc Player SOCs
Tensilica has announced that it will demonstrate DTS-HD Master Audio Lossless decoding on the HiFi 2 Audio DSP (digital signal processor), the industry's lowest power, most area efficient audio processor core, at the Consumer Electronics Show in Las Vegas, January 8-11, 2009. The HiFi 2 DSP offers significant cost savings and a simplified programming model, as all Blu-ray audio processing can be done in one core, unlike other solutions that require two or more cores.
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Tensilica Adds RealAudio Decoder Support for HiFi 2 Audio DSPs
Tensilica has announced that it has it has ported the RealAudio 8, 9, and 10 decoders from digital entertainment services company RealNetworks, Inc. to the HiFi 2 Audio DSP, the industry's leading licensable audio DSP. RealAudio utilizes advanced audio compression techniques to allow users to achieve high quality sound in a wide bandwidth range, and is the preferred media format for many users of cellular phones, portable media players, and mobile Internet devices.
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MegaChips Becomes Tensilica Authorized Design Centre
Tensilica has announced that MegaChips Corporation, of Osaka, Japan, has become an authorized Tensilica design center. Companies needing SOC design services in Japan can take advantage of MegaChips' expertise in the design of video and imaging products as well as communications products.
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Sibridge Technologies Becomes Tensilica Authorized Design Centre
Tensilica has announced that Sibridge Technologies has become an authorized Tensilica design center, supporting customers of both the Xtensa configurable processors and the Diamond Standard processor cores. Sibridge has offices in Fremont, CA, and Ahmedabad, India, and supports a number of global electronics companies.
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P-Product Becomes Tensilica Authorized Software Design Center
Tensilica has announced that P-Product, of Needham, MA, has joined Tensilica's Xtensions Partner network as an authorized software design center, specializing in efficient implementations of digital signal processing (DSP) software. P-Product has extensive expertise in audio and video as well as in WiMAX and LTE. P-Product has already ported multiple audio software modules to Tensilica's popular HiFi 2 Audio Engine.
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Tensilica HiFi 2 Audio DSP Supports aacPlus by Dolby
Tensilica has announced that it has added the aacPlus by Dolby for Digital Audio Broadcasting (DAB+) decoder to its audio codec library for its Xtensa® HiFi 2 Audio DSP, one of the most popular commercial audio cores for system-on-chip (SOC) designs.
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Tensilica Ports RealVideo Codec to 388VDO Video Engine
Tensilica®, Inc. announced that it has ported the RealVideo codec from digital entertainment services company RealNetworks®, Inc. (RNWK) to the 388VDO Video Engine, increasing the versatility of this popular video chip subsystem. The RealVideo codec expands the applicability of Tensilica's 388VDO video processor to products that efficiently display Internet content on everything from mobile devices to extended standard definition DTV.
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Tensilica's Xtensa Customisable Processor Used in Panasonic Mobile's Wireless Baseband Processor
Tensilica,® Inc. today announced that Panasonic Mobile Communications Co. Ltd. has licensed the Xtensa® LX2 customisable processor core for a baseband processor integrated circuit for mobile phones. Now Panasonic Mobile will develop several different configurations of the Xtensa processor.
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Tensilica's Xtensa Customizable Processor Used in Panasonic Mobile's Wireless Baseband Processor
Tensilica,® Inc. today announced that Panasonic Mobile Communications Co. Ltd. has licensed the Xtensa® LX2 customizable processor core for a baseband processor integrated circuit for mobile phones. Now Panasonic Mobile will develop several different configurations of the Xtensa processor.
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Fujitsu Adopts Tensilica¹s Xtensa Processor
Tensilica has announced that Fujitsu has licensed the Xtensa LX2 customizable processor core as the baseband processor for Fujitsu's mobile phone.
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Tensilica Adds AMR WB+ Audio / Speech Decoder and Encoder to HiFi 2 Audio Processor Software Library
Tensilica has announced that it has added the AMR WB+ audio / speech decoder and encoder to the software library for its HiFi 2 audio processor. The AMR WB+ (Adaptive Multi Rate Wideband plus) speech codec improves on the available AMR Wideband speech codec by adding support for stereo signals and higher sampling rates, providing higher quality at low bit rates.
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Tensilica's Xtensa Processor Core Adopted by NEC For Mobile Phone SOC
Tensilica has announced that NEC Corporation of Tokyo, Japan, has licensed the Xtensa LX2 customizable processor core for NEC's Mobile Phone SOC (system-on-chip). NEC will develop Mobile Phone SOCs using several different configurations of the Xtensa processor.
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Tensilica Confirms New Intel Media Processor for Consumer Electronics Devices Uses Company's HiFi 2 Audio Processor
At the Intel Developer Forum in San Francisco yesterday, Tensilica announced that the new Intel Media Processor CE 3100 (formerly codenamed "Canmore") for Internet-connected CE devices includes Tensilica's HiFi 2 audio processor. Tensilica's HiFi 2 processor is specifically optimized to efficiently run over 50 audio software packages, including AACPlus, MP3, SRS TruSurround HD, WMA, and G.7xx Voice codecs, along with the complete suites of Dolby and DTS codecs required for set-top box and Blu-ray Disc applications.
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