Auwiesenstr. 5
Deggendorf
94469
Germany
Phone
+49 991 27000
Fax
Web Address
www.congatec.com
congatec Company Details
congatec presents first x86 quad-core SOC Type 6 COM Express Compact Module
congatec extends its COM Express product range with processors from the AMD Embedded G-Series SoC family. This single-chip solution is based on AMD technology and integrates the next-generation computing power of the "Jaguar" based processor and AMD Radeon graphics cores in a compact package.
Qseven Tablet PC Demonstration Platform Heralds New Age of Flexible Design
congatec AG is demonstrating a Tablet PC Technology Demonstration Platform targeting industrial applications at embedded world 2013, Hall 1, Stand 350. This Qseven Pad Demonstration Platform vividly illustrates the flexibility of modular programming and its ability to drastically reduce the design time and complexity of compact equipment, such as an industrial Tablet PC.
congatec presents Windows Embedded Compact 7 Qseven module based on Freescale's i.MX6 ARM Cortex A9 CPU
congatec introduces a Windows Embedded Compact 7 version of the conga-QMX6 Qseven module based on the Freescale i.MX6 ARM Cortex A9 processor. Windows Embedded Compact 7 (WEC7) is the latest generation of Windows CE operating systems designed for innovative embedded applications such as those based on the Qseven form factor.
congatec Announce Qseven Starter Kit For Mobile Embedded Applications
congatec presents the Qseven Mobility Kit, a complete starter package for the rapid prototyping of battery-powered embedded systems. Qseven embedded computer modules are an ideal solution for virtually any low-power or ultra mobile embedded PC application thanks to their compact size and minimum power consumption. To minimize development costs of such systems, congatec has combined all necessary components in a comprehensive starter kit.
congatec Announce COM Express Entry Modules With Intel Celeron Dual-Core Processors
congatec has announced Intel Celeron Dual-Core processors with 3rd Generation Intel Core technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point. The modules come with the new mobile Intel HM76 Express Chipset, offers up to 16GB of dual-channel DDR3 memory (1600 MT/s) plus direct support for USB 3.0 and Intel Hyper-Threading Technology.
congatec 22nd fastest growing German technology company
congatec has been ranked the 22nd fastest growing technology company in Germany in this year's Deloitte Technology Fast 50 awards. Rankings are based on the percentage of revenue growth over the last five years, 2007-2011. congatec achieved a growth of 293 percent during this period.
congatec announces record quarterly earnings for Q3/2012
congatec has concluded the third fiscal quarter of 2012 with record results. Sales rose to €16.7 million, corresponding to an increase of 43% compared with Q3/2011. congatec's growth is not limited to financial performance; the number of employees has also increased by 11 in the current year, bringing the worldwide total to 135.
congatec presents reference board for powerful video wall system design
congatec AG introduces a new reference board for video wall system design. Video wall systems increasingly rely on high-quality videos and (3D) graphics and therefore require a maximum number of graphics interfaces. The congatec reference board offers up to nine independent DisplayPort connectors in combination with an MXM graphics module and a COM Express CPU module.
congatec delivers broadest COM Express scalability with three new module versions for 3rd generation Intel Core processors
congatec AG demonstrates the broad scalability of its modules for 3rd generation Intel Core on the COM Express standard. Offering a choice of three module versions, congatec now provides maximum graphics and processing power for both Type 2 and Type 6 Pin-out.
congatec enters software partnership with Adeneo Embedded to offer BSPs for ARM modules
congatec has entered into partnership with Adeneo Embedded to deliver ready-to-use board support packages for the Freescale ARM Cortex A9 i.MX 6 Series based modules. Thanks to this new software partnership, congatec's worldwide customer base can now benefit from a cost-effective end-to-end solution enabling them to speed up the development of Windows Embedded and embedded Linux devices.
congatec Qseven Starter Kit – the quickest way to ARM-based designs
congatec has introduced a new Qseven Starter Kit providing developers with a complete package to rapidly prototype embedded systems for ARM designs. Thanks to their compact size and extremely low power, Qseven embedded computer modules based on ARM architectures are an ideal solution for virtually any low-power or ultra mobile embedded PC application.
conga-TFS COM Express Type 6 module leverages AMD Embedded R-Series platform
congatec sets another milestone offering support of the AMD Embedded R-Series platform with the new conga-TFS COM Express module based on Type 6 pinout. The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.
congatec opens office in Australia as next step in global expansion plan
congatec AG is widening its sales presence in Australia and New Zealand with the opening of a new subsidiary in Queensland. Following on the heels of last month's office opening in Japan, congatec is now directly represented with six offices on four continents – Asia, Australia, Europe and North America.
congatec Opens new Japan Office
congatec AG announced that it has officially opened a Japanese subsidiary in Tokyo on 1 July 2012. Eric Hsu has been appointed as office manager of congatec Japan Ltd. Japan is one of congatec's most important markets in Asia.
congatec's COM Express Type 2 module featuring 3rd generation Intel Core processor
congatec has today announced the addition of the conga-BP77 to its portfolio of 3rd generation Intel Core modules. This version is based on the COM Express Type 2 connector pin-out and supports the PCI Express graphics port for high-performance external graphics.
congatec AG increases its turnover to around €48M
congatec AG has succeeded in posting sales for FY 2011 of €47.7 million. Compared with turnover for 2010, this represents an increase of around 4.2%, even though the year was economically hard and characterised by upward and downward trends in the market. The profit on sales halved accordingly, to 1.3% (previous year: 2.6%).
congatec presents the conga-TS77 COM Express Module with support for new Intel Core processor variants
congatec AG releases the conga-TS77 which supports the latest 3rd generation Intel Core processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel VT and optional Intel AMT 8.0 support.
Standardization Group for Embedded Technologies (SGET) Inaugurated
A group of embedded computing manufacturers have formed a registered association to drive standardization of embedded computing technologies called The Standardization Group for Embedded Technologies e.V. The proclaimed aim of the association is to speed up the development of new standards for embedded hardware and software. 23 companies signed up to support the founding principles during the inaugural meeting, among them Advantech, congatec, Data Modul, Kontron, MSC and Seco.
congatec leverages AMD Embedded R-Series platform in COM Express Type 6 module featuring unprecedented graphics
congatec AG sets another milestone offering support of the AMD Embedded R-Series platform with the new conga-TFS COM Express module based on Type 6 pinout. The integration of AMD Embedded R-Series APU expands the COM Express standard with a new module that combines power efficient high-performance x86 processing, unprecedented integrated graphics performance and high performance parallel processing support.
congatec introduces new COM Express type 6 module with quad core, 3rd generation Intel Core processors
congatec AG has just introduced conga-TM77, a new module with a significant improvement in computing performance combined with enhanced energy efficiency. The crucial innovations in the 3rd generation Intel Core processors relate to the construction, with 3D Tri-Gate transistors and 22 nanometer technology, plus a more powerful integrated graphics core. The type 6 pinout and 3x digital display interfaces provide better display options and increased bandwidths with extra PCI Express lanes.
congatec introduces entry-level module for COM Express Type 6 with new Intel Atom dual-core processors
congatec AG announces the conga-TCA, an entry-level model of its Type 6 Pin-out COM Express module range. The conga-TCA is available in three variants of the new Intel Atom dual-core processor generation, which are manufactured in 32nm technology – the Intel Atom N2600 processor with only 3.5W TDP (1M Cache, 1.6 GHz); the Intel Atom N2800 processor (1M Cache, 1.86 GHz) with 6.5W TDP; and the Intel Atom D2700 processor (1M Cache, 2.13 GHz) with 10W TDP and up to 4GB single-channel DDR3 memory (1066 MHz).
AMD Fusion based congatec COMs support OpenCL for flexible task distribution
congatec AG supports OpenCL (Open Computing Language) for its Computer-on-Modules (COMs) with AMD Fusion technology across the popular module standards ETX, XTX, COM Express and Qseven. OpenCL is an Application Programming Interface (API), which enables developers to take full advantage of the high performance graphics cores of AMD's Accelerated Processing Unit (APU) for a variety of non-graphical computing tasks
congatec presents COM Express Type 6 module with low-power Intel processors
congatec AG announces the conga-TS67, a new low-power module for advanced designs. It supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, super low-power Intel processors soldered on in a BGA package, the module is suitable for vibration-resistant applications.
congatec AG set to expand its product strategy with ARM architecture
congatec AG is set to expand its product portfolio with the addition of ARM technology. This will allow the company to offer products with extremely low power requirements in the future. As a first step in that direction, congatec is expanding its Qseven product family with Freescale processors. Up until now, congatec has focused exclusively on x86-based COMs (Computer-on Modules). As part of its new product strategy, the company now plans to increasingly use ARM technology. Processor technology, which in the past only offered a choice between Intel and AMD, will now be extended to include Freescale and its ARM-based i.MX portfolio of products.
congatec unveils Qseven mini carrier baseboard for accelerated design-in
congatec AG presents the conga-QMCB, a new mini carrier baseboard for space-critical applications based on the Qseven standard. The baseboard is ideal for fast prototype design and compact, mobile applications. Measuring just 145x95 mm, the easy-to-integrate mini carrier board is packed with a wide range of state-of-the-art interfaces and is designed to accelerate the evaluation process in the design-in phase, thereby facilitating faster time-to-market.
COM Express Type 6 module from congatec with Intel Quad-Core processor
congatec AG has unveiled the conga-TM67, a new high-performance module for future designs. The Type 6 Pin-out and digital display interfaces ensure improved display options and increase bandwidth with additional PCI Express Lanes availability.
Congatec offers AMD dual core power on Qseven
Congatec AG, , announces the expansion of its Qseven product line. The conga-QAF Qseven module, which is based on the AMD Embedded G-Series, is the first module to combine high graphics performance, dual core processing power and low power consumption in such a small form factor. It is therefore a perfect solution for cost-sensitive low-power control and visualization applications. The conga-QAF is available in two processor variants: AMD G-Series G-T40E 1.0 GHz Dual Core (6.4 W); and AMD G-Series G-T40R 1.0 GHz Single Core (5.5 W) with up to 4 GB of low power onboard DDR3 memory.
New conga-EAF module from congatec provides broad scalability for ETX standard
congatec AG, a leading manufacturer of embedded computer modules, is guaranteeing a sustainable future and broad scalability for the ETX standard with the launch of the conga-EAF Computer-on-Module (COM). With a choice of seven AMD G-Series processors, the conga-EAF also offers the best price/performance ratio. Ranging from the AMD T56N 1.6 GHz Dual Core (L1 cache 64KB, L2 Cache 512KB x2, 18 W) multi-core processor to the AMD G-T40R 1.0 GHz (L1 cache 64KB, L2 cache 512KB, 5.5W) single-core processor with extremely low power consumption, the conga-EAF provides a perfect form-fit function setup for ETX. congatec is thereby granting all ETX applications a life-time extension into a second generation.
Building Blocks Initiative Drives Embedded
High performance computers with dedicated applications for specific purposes include industrial PC operation. Christian Eder looks at embedded computing power for SMEs.
congatec AG achieved a new record of 45.6 million Euros in 2010
congatec AG, a leading manufacturer of embedded computer modules, recorded an annual revenue of 45.6 million euros in 2010, a record win. With its embedded computer modules and accessories, the company increased sales by 75% from the previous year. In 2009, the annual turnover rate totaled 26 million euros.
congatec presents a COM Express Compact mini carrier board for quick design-in
congatec AG introduces the new conga-MCB, a mini carrier board for COM Express Compact modules that is perfect for space-critical applications. It is ideal for the quick construction of prototypes but can also be used for high performance mobile applications.
congatec presents new COM Express Compact module based on Intel® Atom(tm) E6xx processor series
congatec AG introduces the conga-CA6 module, which is based on the new Intel Atom E6xx processor series and the Intel Platform Controller Hub EG20 for COM Express Type 2. All components of this embedded design are specified for the industrial temperature range of -40 to +85°C, making the conga-CA6 an ideal solution for extreme applications.
congatec future-proofs ETX and XTX standard
congatec AG is giving the ETX and XTX form factors a viable future with the integration of AMD Fusion technology. Modules based on AMD Fusion processors deliver significant improvements with regard to performance and scalability.
congatec - COM Express Basic Module with AMD Fusion Technology
congatec AG, a leading manufacturer of embedded computer modules, introduces a new COM Express product line based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performance-per-watt ratio and flexible task allocation on the CPU and GPU.
congatec - COM Express small form factor module based on 2nd Generation Intel Core processor family
congatec AG extends its Intel® processor-based COM Express product family with the new highest performance module conga-BM67. It features the latest 2nd Generation Intel® Core™ processors such as the Intel® Core™ i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core™ i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte dual channel DDR3 memory (1333 MHz).
congatec unveils new COM Express Basic Module with AMD Fusion Technology
congatec AG, a leading manufacturer of embedded computer modules, introduces a new COM Express product line based on the AMD Embedded G-Series platform. The integration of AMD Fusion technology expands the COM Express standard with a completely new processor architecture that combines processors and graphics cores in a compact package. System designers benefit from a powerful CPU and an even more powerful graphics performance, excellent performance-per-watt ratio and flexible task allocation on the CPU and GPU.
congatec announces new COM Express small form factor module based on 2nd Generation Intel Core processor family
congatec AG extends its Intel® processor-based COM Express product family with the new highest performance module conga-BM67. It features the latest 2nd Generation Intel® Core(tm) processors such as the Intel® Core(tm) i7-2710QE processor (2.1 GHz, 45W, PGA) and the dual-core Intel® Core(tm) i5-2510E processor (2.5 GHz, 35W, PGA) with up to 8 GByte dual channel DDR3 memory (1333 MHz).
congatec to showcase new COM Express module with high performance graphics at the ICE gaming show in London from 25-27 January 2011
congatec AG, a leading manufacturer of embedded computer modules, is expanding its COM Express line with a new module featuring powerful graphics performance that stands out in many ways. Both high-definition multimedia content, as well as the latest 3D games, can be played seamlessly with a processor TDP (thermal design power) of under 10 watts.
congatec COM Express modules at the heart of Intel's Embedded Building Blocks initiative
Under the auspices of Intel Corporation and in cooperation with TQ-Group and apra-norm, congatec AG has launched the Embedded Building Blocks initiative to make it easier for small and medium-sized businesses (SMEs) to gain access to embedded computer technology and entry into the industrial computer market.
congatec Ultra compact embedded Qseven Starter Kit for industrial automation
congatec AG, a leading manufacturer of embedded computer modules, presents the first Qseven Starter Kit for automation. Low power consumption makes the Qseven an ideal platform for building small computer units and terminals within the automation industry. To accelerate the development of such applications, congatec has introduced the Qseven Mobility Kit as a complete design solution.
congatec conga-QA6 supports CAN bus in accordance to the Qseven 1.2 specification
congatec AG, a leading manufacturer of embedded computer modules, announces CAN (Controller Area Network) bus support on the conga-QA6 small form factor (SFF) Qseven module. This is the first congatec Qseven module to support this interface.
congatec provides full DisplayPort Support for COM Express Type 2
congatec AG, a leading manufacturer of embedded computer modules, announces support of up to three DisplayPort video interfaces for the current Type 2 COM Express modules conga-BM45 and conga-BM57.
congatec AG presents UEFI support on Qseven with new Intel® Atom™ Processor E600 Series
congatec AG, a leading manufacturer of embedded computer modules, announces UEFI support for the new conga-QA6 small form factor module. UEFI stands for Unified Extensible Firmware Interface.
congatec Unveils New COM Express Basic Module with ECC Support
congatec AG, a leading manufacturer of embedded computer modules, adds the conga-BE57 to its COM Express product family. Designed for DDR3 ECC SODIMM memory modules and equipped with extremely low power Intel® processors in a BGA package, the conga-BE57 is particularly suitable for mission critical applications.
congatec records significant third quarter growth
congatec AG continues its upwards trend recording a significant sales increase for the third quarter of 2010. In the first nine months of 2010 the company achieved overall revenue of 32 million Euro from the sales of embedded computer modules and accessories. This represents an increase of 86% over the same period last year.
congatec opens office in Scandinavia as part of its European growth initiative
congatec AG, a leading manufacturer of embedded computer modules, announces the appointment of Lars Hallberg as Territory Manager for Sweden, Denmark, Finland and Norway. Based at congatec's new Nordic sales and marketing office, Mr Hallberg will be responsible for the multi-channel distribution strategy that includes both partner and direct sales.
congatec presents conga-QA6, an ultra-mobile module featuring the new Intel Atom Processor E6xx series
congatec AG, a leading manufacturer of embedded computer modules, presents conga-QA6, an extended temperature range small form factor module. The conga-QA6 is based on the Qseven® mobile standard and is equipped with the new Intel® Atom(tm) processor E6xx series as well as the Intel® Platform Controller Hub EG20T. All components of this design are specified for an industrial temperature range of -40°C to +85°C.
congatec AG sales up by a staggering 61%
congatec AG, a leading manufacturer of industrial computer modules, reports sales of Euro 18.9 million for the first six months of 2010. When compared to 2009 revenue, which stood at Euro 11.7 million after the first six months, congatec has so far achieved an overall increase of 61.5% in revenue for 2010.
congatec continues to expand its sales organization in Europe
congatec AG, a leading manufacturer of embedded computer modules, announces the appointment of Bob Pickles as Business Development Manager for the UK. Based at congatec's new UK sales and marketing office, Mr Pickles will be responsible for the multi-channel distribution strategy that includes both partner and direct sales.
Tough terminals – PC requirements for harsh logistics environments
DLoG GmbH, a leading provider of rugged industrial computers headquartered in Germany, with offices in the UK, Sweden, NL and USA, is currently developing particularly robust and mobile industrial PCs for use in forklift trucks and other vehicles. High demands are made on computers used in the transport and logistics sector due to the harsh environmental and operating conditions. In order to meet these challenges and to be able to react flexibly to changing customer requirements, DLoG uses congatec AG's embedded computer modules for its current MPC 6 and IPC 7 product range.
Page 1 2
