1F
531 Chung-Cheng Rd
Hsin-Tien
Taipei 231
Taiwan
Phone
+886-2-2218-5452
Fax
+886-2-2218-5453
Web Address
http://www.via.com.tw
1F
531 Chung-Cheng Rd
Hsin-Tien
Taipei 231
Taiwan
Phone
+886-2-2218-5452
Fax
+886-2-2218-5453
Web Address
http://www.via.com.tw
VIA Technologies today announced it will be showcasing the full range of VIA Vantage digital signage solutions at Digital Signage Expo (DSE) 2013, in the Las Vegas Convention Center, booth #1248, this February 27-28.
VIA Technologies today announced the VIA ARMTiGO A800, the world's smallest ARM system for embedded applications, including hotel automation, digital signage and, surveillance as well as for medical and healthcare applications.
VIA Technologies announces the VIA ARMOS-800, an ultra-compact, fanless system designed around the tiny VIA VAB-800 Pico-ITX board. The VIA ARMOS-800 provides embedded customers with a ruggedized system that delivers advanced multimedia features in an extremely power efficient design for a diversified range of embedded applications.
VIA Labs today announced that the VIA Labs VL811+ 4-port SuperSpeed USB Hub controllers has achieved SuperSpeed USB certification from the USB Implementers Forum (USB-IF). The VIA Labs VL811+ is among the first USB 3.0 hubs to achieve USB-IF certification.
VIA Technologies today announced the world's smallest x86 quad core system, the VIA ARTiGO A1250 slim system, featuring a 1.0GHz VIA QuadCore processor and the latest VIA VX11H media system processor (MSP), in chassis the size of a paperback novel.
Here is an introductory video looking at the VIA ARTiGO A1250. The World's smallest x86 quad core system on the market to date.
VIA Technologies today announced net sales for September 2012 of NT$ 280.76 million (US$ 9.58 million approximately).
VIA Technologies today announced the VIA EPIA-M920 Mini-ITX board, the first VIA Mini-ITX board to feature the latest VIA VX11H media system processor enabling DirectX 11 and 3D stereoscopic display capabilities for immersive environments.
VIA Technologies today announced VIA Magic Box, a complete hardware and software solution for dynamic digital signage. VIA Magic Box integrates the user friendly VIA Magic View content management software optimized for a range of VIA x86 hardware platforms to provide a high performance, scalable digital signage solution ideal for a wide range of user scenarios.
VIA has unveiled the VIA EPIA-P910 Pico-ITX board, the first VIA board to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-Series processor. Providing superior performance and outstanding display capabilities, the VIA EPIA-P910 Pico-ITX provides the ideal platform for a wide array of next-generation ultra compact devices for applications in health-care, logistics, fleet management and other vertical market segments.
VIA have unveiled the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications.
VIA Technologies, Inc announced the VIA ARTiGO A1200 slim PC kit, featuring a VIA Eden X2 dual core processor. The fanless, ultra-compact VIA ARTiGO A1200 is suitable for a myriad of applications in the home or office, including home server, home automation, hotel management, media streaming, digital signage and surveillance applications.
VIA Technologies, Inc today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly interconnected world. Join VIA at Computex 2012, 4F Nangang Exhibition Hall, Booth MO311.
VIA Technologies, Inc today announced the latest VIA COMe-8X90 module, featuring a 1.2GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.
VIA Technologies, Inc has announced the its latest Em-ITX form factor board, the VIA EITX-3002, which combines rich I/O with outstanding multimedia capabilities. Partnered with the new VIA AMOS-5002 industrial chassis kit, the VIA EITX-3002 provides the ideal solution for a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.
VIA Technologies announced net sales for September 2011 of NT$ 324.44 million (US$ 10.64 million approximately). This sales revenue represents a 1.68% month-on-month increase over revenues of NT$ 319.09 million (US$ 10.47 million) in August 2011.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M900 Mini-ITX board, the world's first Mini-ITX board to feature a VIA Nano X2 E-Series dual core processor.
VIA Technologies, Inc. (VIA) today announced the signing of definitive agreement to sell all of its shareholding in S3 Graphics Co., Ltd. (S3 Graphics) to HTC Corporation (HTC). S3 Graphics is a leading provider of innovative graphics visualization technologies used in PCs, game consoles and, more recently, mobile devices.
VIA announced the low power VIA VB8004 Mini-ITX board. Coupling the VIA VX900 media system processor with a choice of 1.2GHz and 1.6GHz VIA Nano Processors, the VIA VB8004 provides a high performance and highly scalable solution for advanced digital signage and gaming systems.
VIA vice-president of international marketing, Richard Brown discusses VIA's role in Powering the China Cloud and VIA's platforms for PC, mobile and Smart TV spaces at the Technode Collide Conference.
VIA Technologies, Inc today announced the VIA VID series of industrial-class touch screen displays designed for a range of modern interactive kiosk, POI and POS embedded systems, extending VIA's position as a total system and embedded component provider.
VIA Technologies, Inc today announced the new VIA Eden X2 processor, the industry's lowest power dual-core processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at the annual Lunch@Piero's media event, to be held during CES in Las Vegas on January 6th and 7th.
VIA Labs, Inc, a leading supplier of USB 3.0 integrated chip controllers, today announced its participation at CES 2011 where it will demonstrate a comprehensive suite of USB3.0 controller products in a cutting edge zero client application. Join VIA Labs, Inc. at the USB Tech Zone, Booth No. 36505, South Hall, CES 2011, Jan 6-9.
VIA Technologies announced its latest VIA Nano X2 processor for mainstream PC markets. Based on a 40 nanometer fabrication process, the VIA Nano X2 delivers better computational performance and improved multi-tasking ability without consuming more power.
VIA Technologies today announced the world's first graphics card designed specifically for the embedded market with the VIA eH1, a DX10.1 compliant, multi-display card that thrusts any system with a PCI Express slot into a new realm of graphics and video capability.
VIA Technologies announced the VIA EPIA-P830 Pico-ITX board for advanced portable and network connected embedded applications. The VIA EPIA-P830 features the VIA Nano E-Series processor and the latest VIA VX900 media system processor with additional support for dual Mini-PCIe modules, bringing a wealth of 3G and wireless connectivity options.
VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced that the VIA Labs VL750 USB 3.0 to NAND Flash Controller is the first in the world to be certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality multimedia and more immersive and compelling applications.
VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today announced net sales for September 2010 of NT$ 493.62 million (US$15.79 million approximately).
VIA Technologies demos its latest VIA EPIA-M850 Mini-ITX board, the first to feature the new VIA VX900 chipset which takes the latest HD video codecs in its stride.
This document defines the new Mobile-ITX form factor, the embedded industry's smallest Computer-on-module form factor specification, developed by VIA Technologies, Inc. Mobile-ITX continues VIA's efforts to shrink the x86 platform to inspire innovative system design and to make x86 computing accessible for next generation of ultra-compact devices.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today's HD-intensive, commercial multimedia-centric devices.
VIA Technologies, Inc today announced the launch of its the VIA ARTiGO A1100 for the India market. The VIA ARTiGO A1100 is an extremely compact mini PC that combines the latest technologies and features in the smallest of form factors.
VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the addition of the VIA COME8X80 module to its COM Express™ portfolio; the world's first COM Express type product to take advantage of the high performance, 64-bit VIA Nano E-Series processor.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced device development kits for the VIA AMOS-5000 series, facilitating a more rational design infrastructure for a broad range of application-specific and fanless Em-ITX-based devices.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it latest Mini-ITX board, the VIA EPIA-M840, designed for a range of embedded device designs including advanced industrial and factory management applications.
VIA Technologies announced the VIA EITX-3001, its latest Em-ITX form factor board and the ideal solution for a range of durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its attendance at Computex 2010, showcasing a range of exciting platform, board and system level designs that are set to revitalize the embedded industry for years to come. Join VIA at Computex 2010, Nangang TWTC, Booth L1018.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced how it's working with Logitec to implement next-generation security encryption on its latest range of NAS products.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA EPIA-M830 Mini-ITX board. Designed specifically to meet the needs of next generation kiosk, POI and POS applications, the VIA EPIA-M830 places the latest 64-bit, high performance VIA Nano E-Series processor in a streamlined, application specific Mini-ITX form factor board.
IA Technologies, Inc today announced the latest additions to its VIA VIPRO range of fanless touch screen panel PCs with the 6.5 inch VIA VIPRO VP7806 and 15 inch VIA VIPRO VP7815. Created using the flexible and modular Em-ITX form factor, these new VIA VIPRO panel PCs offer the perfect solution for the latest HMI applications.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Nano E-Series processor, bringing native 64-bit software support, virtualization capabilities and extended longevity support to embedded markets.
VIA Technologies announced the launch of its latest DIY PC kit, the VIA ARTiGO A1100, a sub-liter DIY PC kit for enthusiasts who want to taste the most extreme, ultra-compact desktop computing experience.
VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced the certification of its VL700 USB 3.0-SATA Controller by the USB Implementers Forum (USB-IF). The comprehensive suite of tests conducted as part of the USB-IF Compliance and Certification Program ensures that certified products are interoperable with existing USB devices, while also offering all the speed and power enhancements of the new USB 3.0 (SuperSpeed) specification.
VIA Technologies, announced the VIA ART-3000, a complete, fanless and ruggedized embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its participation at Digital Signage Expo 2010, Feb. 24 - 25, Las Vegas. Join VIA at the Las Vegas Convention Center, Hall C1-2, Booth 1240 and experience the latest technologies for next-generation signage systems, including a demonstration of the forthcoming S3 Graphics Chrome 5400E x2; a dual GPU add-in-board aimed at advanced, multi-display digital signage applications.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest technology platform for fleet management device designs. The VIA EPIA-P710-D is a Pico-ITXe expansion module that allows system integrators to easily create cutting-edge fleet management devices that incorporate a range of the latest communication and intelligent management technologies.
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-T700: the first product based on the recently announced Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.
VIA Technologies announced the VIA M'SERV S2100: a compact and versatile server system suitable for a range of applications for SOHO and SMB customers. Available to OEM customers, the VIA M'SERV S2100 is a mere 10.2 long by 4.7 high and provides up to four terabytes of storage in a stylish, compact, low power and low noise system.
VIA Technologies, Inc., a leading provider of PC and prosumer audio silicon, today unveiled the VIA Vinyl Envy VT1730 USB 2.0 Audio Controller, the industry's first highly-integrated single chip solution that leverages the broad USB 2.0 bandwidth (480 Mb/s) to deliver uncompromised audio quality.