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Rogers Corporation

One Technology Drive
Rogers, CT 06263-0188

06263-0188
United States of America

Phone
860/779-5597

Fax
860/779-5509

Web Address
www.rogerscorporation.com

Rogers Corporation Soars With Advanced Materials at SATELLITE 2010

Rogers Corporation will present a sampling of its microwave materials solutions at the upcoming SATELLITE 2010 (March 16-18, 2010, at the Gaylord National Convention Center, MD) located minutes from Washington D.C.

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Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010

Rogers Corporation will showcase three of its advanced materials for microelectronics packaging at this year's International Microelectronics and Packaging Society (IMAPS) Device Packaging 2010 event (March 9-10, 2010, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers Corporation to Present Practical Materials Solutions at IMAPS Device Packaging 2010

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Rogers Corporation to Showcase Advanced Materials Solutions at DesignCon 2010

Rogers Corporation to Showcase Advanced Materials Solutions at DesignCon 2010

Rogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA (February 2-3, 2010, Santa Clara Convention Center). Members of Rogers Advanced Circuit Materials (ACM) Division will be available at booth 811 to discuss a number of innovative electronic materials, including Theta printed circuit materials, ULTRALAM 3000 laminates, RO2808 laminates, and RO4000 LoPro circuit board materials.

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Rogers to Feature Advanced Circuit Materials & Thermal Solutions at IMAPS 2009

Rogers to Feature Advanced Circuit Materials & Thermal Solutions at IMAPS 2009

Rogers Corporation will display a number of its innovative and practical materials solutions for microelectronics packaging and production at the upcoming IMAPS 2009 Conference and Exhibition in San Jose, CA (November 3-5, 2009, at the San Jose Convention Center). Rogers will be represented by both its Advanced Circuit Materials Division (ACM) and its Thermal Management Solutions (TMS) Division at IMAPS 2009 (www.imaps.org), a leading event devoted to microelectronics packaging solutions.

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Rogers Corporation to Showcase Innovative Advanced Materials at Productronica 2009

Rogers Corporation will highlight some of its latest material advances at the upcoming Productronica in Munich, Germany (November 10-13, 2009, www.productronica.com), a major international trade fair for innovations in electronics production. Rogers Advanced Circuit Materials Division will display many of its recent innovations in materials for low-cost, high-volume production lines. These materials include RO4730™/RO3730™ antenna grade laminates, RO4360™ 6.15 Dk laminates, and RT/duroid® 5880LZ advanced materials.

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Rogers Corp - Laminates for Lightweight, Low-Cost Antenna Designs

Rogers Corp - Laminates for Lightweight, Low-Cost Antenna Designs

The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730 laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.

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Rogers Introduces Low-Noise EL Lamp Driver IC

The Durel Division of Rogers Corporation has announced the latest addition to its high-performance electroluminescent (EL) lamp driver ICs - D392A. The D392A EL lamp driver delivers the programmable output voltages needed to power a wide range of EL lamps, including in portable applications such as cellular telephones, data organizers and PDAs, remote controls, monochrome LCDs, and DFLX EL keypad lamps.

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Rogers Introduces Low Z-Axis Material for Airborne Antenna Applications

Rogers Introduces Low Z-Axis Material for Airborne Antenna Applications

The Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced its latest patent-pending innovation in high frequency materials, RT/duroid 5880LZ laminate. Rogers Introduces Low Z-Axis Material for Airborne Antenna Applications

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Rogers’ RT/DUROID Laminate Wins New Award

Rogers' RT/DUROID Laminate Wins New Award

Rogers Corporation's newly introduced RT/duroid 5880LZ laminate has been recognized by a leading electronics publication– Printed Circuit Design & Fabrication magazine (PCD&F) – as one of Recognition for the RT/duroid 5880LZ laminate, a product of Rogers Advanced Circuit Materials Division, comes in the form of the New Products Introduction Award (NPI), presented at the IPC Expo/Apex trade show held earlier this year.

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Rogers' DUREL Division Introduces EL System Finishing Center Model

Rogers Corporation's Durel Division has introduced an innovative Finishing Center model for use by graphics printers. The new Finishing Center model, employing Rogers' thermal transfer and screen printing technologies, allows printers to produce thin, flexible, bright and animated backlit signs for a wide range of advertising needs.

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Rogers Corporation Announces Strategic Investment in Solicore, Inc.

Rogers Corporation announced today it has made a strategic investment of $5 million in Solicore, Inc., headquartered in Lakeland, Florida. Solicore is the world leader for embedded power solutions, offering its patented Flexion™ advanced ultra-thin, flexible, lithium polymer batteries for smart cards, controlled access cards, RFID tags, and medical devices.

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Rogers Introduces Laminates with reverse-treated copper foil

Rogers Introduces Laminates with reverse-treated copper foil

Rogers Advanced Circuit Materials (ACM) Division announced its new reverse-treated copper foil option on RO4000® series laminates. The RO4000 LoPro™ laminates are enabled by special interface technology to be made with very low profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. RO4000 LoPro laminates combine the best in class electrical and thermo-mechanical reliability of RO4000 laminates with improved insertion loss and outstanding passive intermodulation (PIM) characteristics.

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Rogers will Showcase Advanced Circuit Materials at IPC Midwest 2007

Rogers Corporation will feature several high performance solutions from its family of advanced circuit materials at IPC Midwest 2007 in Schaumburg, Ill., Sept. 26-28 (Booth #728). These products are used in a wide range of high frequency applications, including advanced packaging, wireless and high speed digital markets.

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Rogers Corporation New RO4500(tm) High Frequency Circuit Laminates Enable Cost-Effective Antenna Designs

Rogers Corporation New RO4500(tm) High Frequency Circuit Laminates Enable Cost-Effective Antenna Designs

Rogers Corporation announced today, its RO4500(tm) laminates, a new addition to Rogers' RO4000(r) product family of high performance antenna-grade materials. RO4500 glass reinforced hydrocarbon/ceramic laminates provide the controlled dielectric constant, low loss and passive intermodulation (PIM) response required by the wireless infrastructure market. They are designed for high volume commercial antenna applications, including communications cellular base stations and Wi-MAX networks.

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New R/flex JADE™ A Series From Rogers Corporation Integrates Green Technology

New R/flex JADE™ A Series From Rogers Corporation Integrates Green Technology

In response to global demand for environmentally friendly solutions, Rogers Corporation has developed a halogen-free, transparent epoxy polyimide laminate system that is safe for the environment and delivers superior performance in an all-inclusive package for flexible circuit designs. An extension of the Rogers R/flex CRYSTAL® product line, the new R/flex JADE™ A epoxy adhesive system is ideal for a wide range of applications including hard disk drives, cellular phones, laptop computers, personal digital assistants and semiconductor packaging applications.

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Rogers Corp Celebrates 175th Anniversary by Ringing The Closing Bell at The NYSE

Rogers Corp Celebrates 175th Anniversary by Ringing The Closing Bell at The NYSE

Rogers Corporation's president and CEO Robert Wachob rang The Closing Bell at The New York Stock Exchange Friday, May 11 in celebration of the company's 175th anniversary. Rogers is a global technology leader providing solutions for a number of markets, including portable communication infrastructure, consumer products, computer and office equipment, ground transportation, and aerospace and defense. "We are honored to commemorate Rogers' 175th anniversary by ringing The Closing Bell at The NYSE," said Wachob. "We look forward to the future as we continue to build on a strong tradition of innovation with ongoing expansion into new geographies, products and markets."

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Rogers Corp. to Showcase New RO4230™ High Frequency Circuit Material at Antenna Systems Show '06

Rogers Corporation will be introducing its RO4230™ high frequency circuit material at this year's Antenna Systems Show.

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Rogers Corp. to Present RO4450B™-dx Bondply at EUMW

Rogers Corp. to Present RO4450B™-dx Bondply at EUMW

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