Am Campeon 1-12
Am Campeon 1-12
Infineon Technologies highlights its 650V TRENCHSTOP 5 at the PCIM Europe 2013 in Nuremberg. Since the introduction of this next generation thin wafer IGBT (Insulated Gate Bipolar Transistor) in the autumn of 2012, the TRENCHSTOP 5 has attained strong market attention and is recognized as a game changing technology.
Next week at the PCIM 2013 trade show for power electronics, Infineon Technologies will present the new 2EDL EiceDRIVER Compact half-bridge gate driver, which is intended for applications with a blocking voltage of 600 Volts.
Infineon Technologies expands its High Voltage portfolio with CoolMOS C7, introducing a new 650V Superjunction MOSFET technology. The new C7 product family provides Best-in-Class R DS(on) for all standard packages and - thanks to its low switching losses - efficiency improvements over the full load range.
Thanks to a predictable set of requirements, OEMs are now able to prescribe system-on-chip (SoC) solutions that can reduce BOM costs and simplify production for emerging medical applications. By Dr Christian Obermüller, Product Marketing Manager, Medical Platform, at Infineon Technologies.
Infineon Technologies and Globalfoundries announce a joint technology development and production agreement for 40 nanometre embedded flash process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers with 40nm process structures.
Infineon Technologies is hosting a two-day meeting at its Villach site to kick-off one of the largest European research projects focused on advancing industrial production capability. The research project, "Enhanced Power Pilot Line", is aimed at further strengthening Europe as a high-technology industrial production site.
Infineon Technologies was selected by Visa as a preferred supplier of security controllers for new GlobalPlatform compliant payment cards issued in the Latin America and Caribbean region. Infineon will supply its SOLID FLASH security controllers for both contact-based as well as Dual Interface debit and credit cards including VISA approved Visa Smart Debit Credit applets. Infineon supports the payment industry with the latest VSDC applets to provide scheme compatibility and to enable regional card manufacturers to better serve their markets.
Infineon Technologies AG introduced DrBlade – the first integrated DC/DC driver and MOSFET VR power stage implemented in an innovative chip-embedded package technology. DrBlade contains the latest generation low voltage DC/DC driver technology and OptiMOS MOSFET devices.
Today at the Applied Power Electronics Conference & Exposition (APEC) 2013, Infineon Technologies introduced the highly efficient, fast recovery 650V 650V Rapid 1 and Rapid 2 silicon diode families. Combining Infineon's ultrathin wafer manufacturing expertise for a low loss vertical structure plus unique cell design, the Rapid diodes provide outstanding performance.
Infineon and Bundesdruckerei have developed a new security smart card with an LED display and a one-time password. This new technology is centred around a security chip in the card which generates a one-time password for each transaction and displays this on the integrated LED display. Requesting the one-time password in addition to the static password boosts the security of authentication and payment applications and protects against attacks on e.g. company networks and against card manipulation.
At the Embedded World Exhibition & Conference 2013, Infineon Technologies presents samples of its new XMC1000 industrial 32-bit microcontroller family which provides system designers with strong incentive to switch from 8 to 32 bit MCU architecture. With XMC1000, Infineon offers a fully-featured 32-bit alternative for hitherto 8-bit users by combining the ARM Cortex-M0 processor core with powerful peripherals, high productivity design tools and costs typical of 8-bit devices based on production using state-of-the-art, 65nm embedded Flash technology on 300mm wafers.
Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.
Infineon Technologies today presented its new 32-bit microcontroller family XMC1000, which uses the ARM Cortex-M0 processor. With the XMC1000, Infineon is the first semiconductor provider to offer 32-bit microcontrollers at 8-bit prices that are supported with an advanced, 32-bit peripheral set. The breakthrough price/performance of the device family is achieved by using state-of-the-art 65nm embedded flash production technology on 300mm wafers and combining an ARM 32-bit processor with advanced peripheral functions designed for target application requirements – specifically low-end 8-bit industrial applications.
Infineon Technologies is presenting three new performance classes in its XMC4000 microcontroller family, which was specially developed for industrial applications and uses ARM Cortex M4 processors, this week at the SPS IPC DRIVES 2012 trade show. The new XMC4400, XMC4200 and XMC4100 are the world's first Cortex-based microcontrollers to offer a high-resolution PWM unit.
Infineon Technologies AG introduces the new 600V CoolMOS P6 MOSFET product family, designed to enable higher system efficiency while being easy to use, the new products address the gap between technologies that focus on delivering ultimate performance (CoolMOS CP), and those that concentrate more on ease of use (e.g. CoolMOS C6 or E6).
Infineon Technologies today announced that its Trusted Platform Module solution supports and secures the recently introduced Microsoft Windows 8 operating system. Infineon provides a complete solution based on Common Criteria certified TPM hardware and the corresponding software suite aiming at use in communication and office applications.
Infineon Technologies expands its portfolio of the 3rd generation Reverse Conducting (RC) Soft Switching IGBT (Insulated Gate Bipolar Transistor) introducing 1200V and 1350V devices in 30A and 40A, thus responding to the growing demand for higher reliability.
Infineon announce that its new Flash-based security controllers have been awarded with the highest security certificate (Common Criteria EAL 6+ (high)) by the Federal Office for Information Security (BSI). They are the world's first Flash-based security controllers fulfilling these currently highest security standards.
Infineon Technologies is global market leader in power semiconductors for the ninth consecutive year. According to the most recent report from IMS Research (an IHS company), Infineon held an 11.9 percent share of the total US Dollar 17.6 billion market for power semiconductors, in 2011.
Infineon today announces the expansion of its SiC portfolio with the introduction of the 650V thinQ! SiC Schottky Barrier Diodes Generation 5. Infineon's proprietary diffusion soldering process, already introduced with Generation 3, is now combined with a new, more compact design as well as latest advancements in thin wafer technology bringing improved thermal characteristics and a Figure of Merit (Q c x V f) in the order of 30% lower with respect to the preceding Infineon SiC diode families.
Infineon and NXP Semiconductors are investigating how future generations of electronic identification documents can be made more secure and efficient. The three companies form the German consortium of the "New P@ss" research project funded by the Federal Ministry of Education and Research, in which a total of 15 companies from five EU countries are taking part.
In the real-time MCU world, cost-effective complex motor control designs have been dominated by specialized cores. In many cases dual-core systems have been used, with the main core handling the control algorithm and a second "mini" core managing the real-time I/O and data manipulation. By Mike Copeland, Senior Staff Applications Engineer, Infineon Technologies.
Infineon Technologies presents the EconoPACK + D family, the latest generation of power semiconductor modules in the 1200V and 1700V voltage classes with up to 450A nominal current, at the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany. Infineon has developed the new EconoPACK™ + D series based on the well-known and established EconoPACK™+ platform to master the ever-growing demands in applications such as renewable energies, commercial vehicles, elevators, industrial drives or power supplies. Thanks to numerous improvements and innovations, such as ultrasonic welded power terminals, an optimized base plate structure or reliable and innovative PressFIT control pin technology, the new modules open the door to implementing rugged and efficient power converter concepts on a small footprint.
At PCIM Europe (May 17-19) in Nuremberg, Germany, Infineon expanded its family of Reverse Conducting (RC) 600V IGBT with two new switching power devices that achieve up to 96% efficiency in target applications. The new RC-Drives Fast devices allow design of energy efficient, electric-motor driven consumer appliances that use smaller components and thus have a lower overall cost compared to alternative systems.
With its latest generation of high-voltage CoolMOS MOSFETs Infineon is rolling out another innovation setting new standards in the field of energy efficiency. At the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany, Infineon presents the new 650V CoolMOS™ CFD2 – the world`s first high-voltage transistor with both a drain-source voltage of 650V and an integrated fast body diode. The new CFD2 devices succeed the 600V CFD products, enabling not only improved energy efficiency but also softer commutation behavior and therefore reduced EMI (electromagnetic interference) giving these products a clear competitive advantage.
Infineon's 4.5kV IHV modules integrate IGBT3/EC3 chips optimized for use in traction drives and high-voltage DC transmission (HVDC). HVDC technology delivers the capability for extremely efficient long-distance electric power transmission. Thanks to the elevated current density of modules incorporating IGBT3/EC3 chips, more power can be transmitted and higher output can be achieved without altering the existing design or needing a more powerful cooling.
Infineon Technologies has developed the first marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency, while significantly reducing the material costs. Infineon's solution IFX90ATX300W is based on the latest generation of three ICs (Integrated Circuits) and meets the industry's highest energy efficiency standard: "80 PLUS® Platinum". Efficiency indicates what share of the power drawn is actually used. The difference between power input and power output is the power loss, which is converted into heat. High efficiency, therefore, translates into a reduction in power consumption and lowering of electricity bills.
The high-tech company Infineon Technologies AG, headquartered in Neubiberg near Munich, Germany, offers semiconductor and system solutions for security, energy efficiency and mobility. In our digital world security is more essential than ever. Infineon's latest innovation, the Integrity Guard security technology, sets the global benchmark in this segment.
Infineon Technologies AG today announced that in future the Volkswagen AG Business Unit Braunschweig will use Infineon's Hall sensors in electric power steering systems for vehicles. Infineon's TLE4998C4 programmable linear Hall sensor will be used for various model ranges. Infineon has already started to deliver the chips.
Infineon Technologies AG today opened a new facility in China called Infineon Integrated Circuits (Beijing) Co., Ltd., located in the Beijing Economic and Technological Development Area. In addition to sales and marketing, application R&D and central functions, the new entity houses an IGBT stack manufacturing facility and a technical center for automotive solutions. IGBTs (Insulated Gate Bipolar Transistors) are power semiconductors used to drive electric motors both in automotive applications and in trains. Motor speed and torque can be regulated along a gradual scale. They also play an important role in the use of renewable energies: here IGBTs enable the efficient conversion of variable frequency output such as from a wind turbine or solar plant to a fixed frequency appropriate for the grid in the region concerned.
With today's portable storage media, anyone can take their own media library with them wherever they go – everything from the latest album release by their favorite band to last summer's vacation photos and even HD-quality movies that can be played back in an instant on end-user equipment like televisions and laptop computers. The better the picture and audio quality, though, the greater the quantity of data to be transferred between the devices and the faster the device interfaces need to be.
Six partners from the semiconductor and solar industries are joining forces in the NEULAND project funded by the Federal Ministry of Education and Research (BMBF) to explore new avenues for the efficient use of electricity from renewable sources. NEULAND stands for innovative power devices with high energy efficiency and cost effectiveness based on wide bandgap compound semiconductors. The project aims to reduce the losses in feeding electricity into the grid, e.g. in photovoltaic inverters, by as much as 50 percent – without significantly increasing system costs. This is to be achieved using innovative semiconductor devices based on silicon carbide (SiC) and gallium nitride on silicon (GaN-on-Si).
Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe's biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issued each year.
Infineon today at the "Cartes & Identification" Trade Show in Paris announced the introduction of 90nm SOLID FLASH™ technology for its new generation of security ICs. With SOLID FLASH, Infineon is the worldwide first supplier of security products combining the advantages of highly flexible and reliable Flash with outstanding and secure contactless performance, targeting applications like payment, government ID, high-end mobile communications and transport. Leveraging its proven, longstanding expertise in automotive Flash and the comprehensive history from selling more than three billion chip card devices using EEPROM/Flash-based non-volatile memory, Infineon now offers its customers a variety of SOLID FLASH products with both high flexibility and ROM-like security. Dedicated security features enable a secure and reliable product usage, which has already been officially acknowledged by EMVCo and Common Criteria EAL 5+ (high) certifications for the first SOLID FLASH products.
Infineon Technologies announced its new SLI 76 "in Car" family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry's first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 "in Car" chips offer long lifetime, high data retention, extended temperature range, and cycle endurance.
Infineon Technologies and Xinjiang Goldwind Science and Technology Co., Ltd., the Chinese leader in R&D and manufacturing of wind power equipments, today signed a license agreement for core components needed in manufacturing of wind turbines. According to the agreement, Goldwind gains the license to produce Infineon IGBT (Insulated Gate Bipolar Transistor) stacks used in converters of MW (Megawatt)-grade wind turbines. Furthermore, Infineon will supply IGBT stacks to Goldwind. IGBTs are power semiconductors which enable the efficient conversion of the variable frequency output from the generator to a fixed frequency appropriate for the grid in the region concerned.
Infineon Technologies announced the release of a design evaluation kit for development of communication systems supporting the IO-Link V1.1 standard, using the company's 16-bit XE166 and 8-bit XC800 microcontrollers. The industry first solution leverages the real-time performance of the XE166 MCU and the cost-effective XC800 device for system designs that support up to eight IO-Link channels on the master with a FIFO buffer for each channel. Developed in cooperation with highly experienced partners in industrial automation, the Infineon IO-Link evaluation kit allows equipment manufacturers to easily evaluate the functionality of a complete IO-Link-based master-device combination.
Infineon Technologies has won the Bavarian State Award for Electric Mobility. Martin Zeil, Bavarian Minister of Economics, Infrastructure, Transport and Technology, presented the award to Peter Bauer, CEO of Infineon Technologies AG, yesterday evening. The ceremony at which the awards were conferred in altogether seven categories was held alongside the eCarTec International Trade Fair for Electric Mobility in Munich. The award went to Infineon in the "Drive Technology" category for the company's microcontrollers ensuring smooth and hence efficient operation of the motor in electric bicycles, the so-called e-bikes. In addition, Infineon was also nominated for its active battery balancing solution in the "Storage Technology/System Integration" category.
Three German partners from industry and research are joining forces in a quest to curb one of the worst energy guzzlers in the household and to introduce energy efficiency to the kitchen. Use of the induction cooking method – where only pots and pans are heated and not the stovetop – could save up to 25 percent electricity. Today, about ten to 15 percent of German households are equipped with an induction cooker. The initial price difference from an electric cooker seems to be deterring consumers from making the buy.
Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon's Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately US Dollar 1.4 billion. WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel's strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.
In a joint effort to secure the future of Altis Semiconductor and its employees, IBM (NYSE:IBM) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today closed a transaction to sell 100% of the share capital of Altis Semiconductor to the new corporation Altis International. IBM and Infineon said this completes the divestment of their joint venture Altis Semiconductor in France.
Peter Bauer, former Spokesperson of the Management Board, has been appointed Chairman of the Board with immediate effect. Chief Financial Officer and Labor Director Dr. Marco Schröter has left the Management Board of Infineon Technologies AG with immediate effect. This was caused by differences in opinion over future company policy.
Infineon Technologies AG is in discussions with interested parties about a transaction concerning Infineon's segment Wireless Solutions (WLS). A significant progress has been made within these discussions. The objective of a potential transaction is the strategic development of the segment Wireless Solutions (WLS). With an annual revenue of Euro 917 million, WLS has contributed approx. 30 per cent to Infineon Technologies AG's total annual revenue of Euro 3,027 million in the past financial year. Infineon views the positive development and position of the profitable segment as the main reason for the display of a strategic interest in the segment by several companies.
The biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions has been launched. Working together on the ESiP project (Efficient Silicon Multi-Chip System-in-Package Integration) are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leadership of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) the research project will run until April 2013. System-in-Package means that several different chips are embedded side by side or stacked above one another in one chip package.
Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed interfaces like SENT and FlexRay™, and comprehensive support for advanced safety engineering by using the PRO-SIL™ features of the devices. Furthermore, the new MCUs are suited for use at temperatures of up to 170 °C*. The AUDO MAX family is based on the TriCore™ processor architecture and manufactured in 90-nm process technology.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a 30V Power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with the world's lowest R DS(on) for high current automotive applications. The new OptiMOS™-T2 30V MOSFET is a N-channel device with drain current of 180A and R DS(on) of just 0.9mΩ at 10V gate-to-source voltage. The IPB180N03S4L-H0, which comes in a D2PAK-7 package, addresses customer needs for Power MOSFETs in standard packages offering both high nominal currents and lowest R DS(on) at lowest cost.
Infineon introduced an enhanced family of three wireless control receivers offering highest available sensitivity and low power consumption. The TDA5240, TDA5235 and TDA5225 devices provide multi-band support (315MHz, 434MHz, 868MHz and 915MHz) for worldwide coverage and are well-suited for use in various automotive applications, including Remote Keyless Entry (RKE) systems, Tire Pressure Monitoring Systems (TPMS), remote start, control, status and alarm functions. In addition, industrial and consumer systems such as short range radio data transmission, garage door openers, cordless alarm systems, remote metering and low-power telemetry will benefit from the high-integrated wireless control devices. The receivers also are capable of taking over some of the tasks that are typically performed by the system's microcontroller.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it has settled its patent infringement claim against Elpida Memory Inc., and both Infineon and Elpida have agreed to seek dismissal of all pending patent infringement cases. Infineon initiated proceedings in February 2010, when it filed a complaint against Elpida and Elpida's customers in the U.S. International Trade Commission (ITC). Elpida subsequently filed two lawsuits in the U.S. District Court, Eastern District of Virginia.
Infineon Technologies and Fairchild Semiconductor today announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages.
Infineon Technologies today introduces the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64mm² (vs. 150mm² for the D2PAK) and a very low profile with only 1mm height (vs. 4.4mm for the D2PAK). The significantly smaller package size, combined with benchmark low parasitic inductances, provides designers with a new and effective way to decrease system solution size in power density driven designs.