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+32 16 28 12 11
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Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology. The first IC manufacturer to join imec's R&D program on emerging memory technologies, GLOBALFOUNDRIES completes the value chain of imec's research platform, which fuels industry collaboration from technology up to the system level.
Imec have today reported financial results for fiscal year ended December 31, 2012. Revenue for 2012 totalled €320 million, a 6.7 percent increase from the previous year. The 320 million Euro figure includes the revenue generated through collaborations with more than 600 companies and 200 universities worldwide, a yearly grant from the Flemish government totalling 48.2 million Euro, and a 8.2 million Euro grant from the Dutch government to support the Holst Centre.
CardioNet today announced a multi-year development agreement with the Belgium-based nanoelectronics research centre imec and its Dutch affiliate Holst Centre. Over the next 18 months, the Companies will work to develop two revolutionary cardiac monitoring products. The new products are expected to greatly improve the patient experience during monitoring, and to be a major advance in the field of remote cardiac monitoring.
At this week's International Solid State Circuits Conference, imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages. The processor delivers clock speeds up to 1MHz at voltages down to 0.4 V. In tests based on a Fast Fourier Transform use case, it consumed only 79 µW – a fraction of the power consumption at standard voltages.
At the European 3D TSV Summit in Grenoble, imec have today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence Encounter Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.
Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.
Imec and Altera Corporation announced today a broadening of their strategic research collaboration in the framework of imec's INSITE program. Initially focusing on technology insight into 3-D process technologies, collaboration between imec and Altera will now be broadened toward pathfinding process development kits for logic technology.
The collaboration builds on extensive work done at 14-nm and several other process geometries, and will calibrate Synopsys' Sentaurus TCAD models to support the next-generation FinFET devices. The collaboration will include 3-D modeling of new device architectures and materials that will enable the semiconductor industry to continue to deliver products with higher performance and lower power consumption.
Imec announces that it has developed an ultra-thin hybrid floating gate cell with demonstrated functionality. The results, which are presented at this week's 2012 IEEE International Electron Devices Meeting in San Francisco, USA, December 10-12, 2012, are an important step for further scaling of NAND Flash technology towards the 10nm half pitch node and beyond.
Imec and Holst Centre announced today that they will present nine papers at the 60th International Solid-State Circuits Conference, February 20-24, 2013 in San Francisco. ISSCC is the foremost global forum on advancements in solid-state circuits and systems on a chip.
CANON ANELVA and the Belgian nanoelectronics research centre imec will collaborate on advanced STT-MRAM (spin-transfer torque magnetoresistive random access memory) research and development. The collaboration will run in the framework of imec's R&D program on advanced emerging memory technologies.
Imec announced today that Tokyo Electron and imec have further extended their collaboration. The new agreement comprises joint R&D on advanced STT-MRAM (spin-transfer torque magnetoresistive random access memory) within imec's research and development program on emerging memory technologies.
Imec and Nantero have announced a joint development program. The collaboration will focus on the carbon-nanotube-based memory developed by Nantero, NRAM, and its application in high-density next-generation memories with a size under 20nm. NRAM arrays will be manufactured, tested and characterized in imec's advanced nanoelectronics facilities.
Imec announced today that it has integrated an ultra-thin, flexible chip with bendable and stretchable interconnects into a package that adapts dynamically to curving and bending surfaces. The resulting circuitry can be embedded in medical and lifestyle applications where user comfort and unobtrusiveness is key, such as wearable health monitors or smart clothing.
Imec announced today a high number of engagements at this year's IEEE International Electron Device Meeting in San Francisco, December 8-12, 2012.Solidifying its leading position as a global R&D center solving key challenges of the International Technology Roadmap for Semiconductors, imec will present one plenary talk, feature two invited presentations, deliver one tutorial, and present 9 papers from imec researchers as first authors and 5 papers as co-author.
Pacific Biosciences and imec have revealed a multi-year research collaboration focused on the development of advanced microchips for highly multiplexed single molecule genetic analysis. This research and development project will build on Pacific Biosciences' proprietary zero-mode waveguide technology and imec's world-leading expertise in nanophotonics, CMOS sensors, technology integration and fabrication.
Imec and Tokyo Electron announce that they will accelerate their Directed Self-Assembly activities at imec's recent 300 mm fab-compatible DSA process line. Over the past two years, both companies have been actively engaged in DSA development.
In the effort to enhance the advanced metal-high-k gate stack for next-generation logic devices, imec successfully demonstrated higher-k dielectric with Replacement Metal Gate (Metal-Gate-Last) transistors that achieved 200x-1000x reduction in gate leakage relative to leading-edge logic devices in the industry with HfO2 high-k gate dielectric.
At this week's VLSI Technology Symposium (Honolulu, Hawaii, USA), imec presents significant improvements in performance and reliability of RRAM cells by process improvements and clever stack-engineering, and imec introduces a new modeling approach increasing the fundamental understanding of RRAM process technology.
Today, imec and Panasonic Inc. have entered into the next phase of a comprehensive and broadened collaboration agreement for joint R&D on healthcare, wireless communication, flexible electronics and advanced CMOS process technologies. The signing ceremony at the Panasonic Headquarters in Osaka (Japan) today was endorsed by the presence of His Royal Highness Prince Philippe of Belgium.
Imec is successfully testing and evaluating various options for further transistor scaling using high-k dielectrics and metal gates in a replacement metal gate integration schema. Although RMG technology is inherently more complex than gate-first integration, it has a number of advantages that allow increasing the device performance and that widen the choices in terms of high-k and metal gate materials.
Today Tohoku University and imec signed a collaboration agreement in the presence of his Royal Highness Prince Philip of Belgium during the Belgian economic mission to Japan. Under the agreement, Tohoku University and imec will work closely together in various common areas of research, learning from each other's expertise and leveraging each other's strengths.
Imec and Holst Centre have demonstrated a single-chip electrochemical sensor for ethylene monitoring with a detection limit of 200-300ppb (parts per billion). Imec and Holst Centre's solution enables small-size and low-cost ethylene detection systems applicable in the fruit distribution and retail sector.
Imec today publishes its results of 2011. Despite a challenging economic climate, the imec board today concluded at the annual general assembly that imec realized a 5% positive growth to a revenue of 300 million euro.
At this year's Symposia on VLSI Technology and VLSI Circuits (June 12-15, 2012 - Honolulu, USA,), imec and its partners will present 10 papers on memory and logic scaling technology and circuits. With 4 RRAM (resistive RAM) papers accepted, the VLSI reviewing committee endorses the value of imec's R&D program on emerging memory devices. And 5 papers will address logic device scaling and characterization for next-generation CMOS technologies.
Imec today announces that it has released an early-version PDK (process development kit) for 14nm logic chips. This PDK is the industry's first to address the 14nm technology node. It targets the introduction of a number of new key technologies, such as FinFET technology and EUV lithography. The PDK is made available to imec's partners, and will be followed by incremental updates. Imec and its partners are developing a 14nm test chip to be released in the 2nd half of 2012 using this PDK.
At next week's International Solid-State Circuits Conference (February 19-23, 2012, San Francisco, USA), imec and Holst Centre present 14 papers on low power design for wireless communication and wireless sensor networks, and organic electronics. Over the week, imec and Holst Centre will issue several news releases showcasing recent important breakthroughs in these different research domains.
At next week's SPIE Advanced Lithography conference, imec announces the successful implementation of the world first 300mm fab-compatible Directed Self-Assembly (DSA) process line all-under-one-roof in imec's 300mm cleanroom fab. The upgrade of an academic lab-scale DSA process flow to a fab-compatible flow was realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Electron Ltd. Imec's DSA collaboration aims to address the critical hurdles to take DSA from the academic lab-scale environment into high-volume manufacturing.
At SPIE Photonics West 2012, imec demonstrates a hyperspectral camera solution based on a system-on-chip image sensor with an integrated hyperspectral sensor. Imec's solution is fast and enables small and cost-efficient camera-solutions. It targets multiple industrial vision applications.
Pepric, a spin-off of imec, successfully concluded a EURO 1.4 million capital round. Pepric develops and commercializes equipment for quantitative molecular detection and imaging to monitor biological processes evolving slowly over time.
Imec and Genalyte announce that they have successfully developed and produced a set of disposable silicon photonics biosensor chips to be used in Genalyte diagnostic and molecular detection equipment. The chips combine imec's standard silicon photonic waveguide devices with bio-compatible modifications jointly developed by imec and Genalyte. These chips allow for high levels of multiplexed biosensing due to the high integration level of Si photonics.
At SPIE Photonics West 2012, imec presents its R&D into next generation vision systems, high-end CMOS imagers and silicon photonics. Imec combines its expertise in heterogeneous integration of CMOS chip technology with new functionalities such as image sensors and MEMS, with multimedia application & design expertise, to develop solutions for next-generation high-quality, low-cost vision systems, focusing on the development of the optimal solution for the entire system (lens, sensor, read-out electronics, ....).
IMEC together with its silicon photovoltaic industrial affiliation program partners Schott Solar, Total, Photovoltech, GDF-SUEZ, Solland Solar, Kaneka and Dow Corning, have demonstrated an excellent conversion efficiency of 23.3% on interdigitated back-contact (IBC) silicon solar cells.
Imec and its 16 project partners announce that they have launched the European FP7 project X10D, a project aiming at developing tandem organic solar cells with an increased conversion efficiency and lifetime, and a decreased production cost. The ultimate goal of the X10D project is to bring organic photovoltaic technologies towards introduction into the competitive thin-film PV market.
Imec and Holst Centre announce an innovative body patch that integrates an ultra-low power electrocardiogram (ECG) chip and a Bluetooth Low Energy (BLE) radio. This unique combination fuses power-efficient electronics and standardized communication, opening new perspectives for long-term monitoring in health, wellness and medical applications. The system integrates components from imec and Holst Centre's Human++ R&D program.
Imec realized an integrated poly-SiGe-based piezoresistive pressure sensor directly fabricated above 0.13 µm copper (Cu) -backend CMOS technology. This represents not only the first integrated poly-SiGe pressure sensor directly fabricated above its readout circuit, but also the first time that a poly-SiGe MEMS device is processed on top of Cu-backend CMOS.
Imec realized a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, a key enabler for future high-volume millimeter-wave low-power circuits to be used in automotive radar applications. These HBT devices also pave the way to silicon-based millimeter wave circuits penetrating the so-called THz gap, enabling enhanced imaging systems for security, medical and scientific applications
Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field, improving the tools' overlay and critical dimension (CD) tool performance. With this milestone achievement, imec confirms that its CMORE business line is ready to provide its partners with custom specialty chip solutions.
Imec has signed a new agreement with ASML for a period of 5 years (2011-2015). The agreement enables imec and the world's leading semiconductor players which are part of imec's advanced IC technology scaling program, to stay at the forefront of next generation technologies.
Belgian research centre imec, together with Plextronics and Solvay, present this week at the European Photovoltaic Solar Energy Conference and Exhibition (PVSEC) in Hamburg an organic polymer-based single junction solar cell with 6.9% performance in an innovative inverted device stack. Combining imec's scalable inverted device architecture and Plextronics' polymers, new levels of cell efficiency were achieved. The polymer was also integrated into a module resulting in excellent module level efficiencies of 5% for an aperture area of 25cm².
Imec and Solliance announce that imec will be a full partner of Solliance and will integrate its thin film PV R&D efforts in Solliance. With imec as a partner, Solliance aims to be an R&D cluster bringing thin film solar energy technology to excellence. The announcement will be celebrated at the annual imec booth reception at PVSEC in Hamburg on 7 September at the imec booth, hall B4G booth C11, at 16.30 o'clock.
In addition, the Nagoya University, KULeuven and imec will organize the 2nd workshop "GeSn developments and future applications" as a satellite event on Friday September 2 in the same location.
Imec, a world-leading nanoelectronics research institute based in Belgium, and Cadence Design Systems announced new technology that delivers an automated test solution for design teams deploying 3D stacked ICs (3D-ICs). The technology addresses the test challenges involved as electronics companies increasingly turn to 3D-ICs as a way to increase circuit density and achieve better performance at lower power dissipation for mobile and other applications where space is at a premium.
Today imec and Target Compiler Technologies present a C-programmable flexible FEC (forward error correction) solution fit for future cellular, connectivity and broadcasting standards. This so-called "flex FEC" solution competes in area and throughput with dedicated fixed-function hardwired implementations, yet offers the flexibility to support multiple standards thanks to software programmability. The C-programmable flex FEC ASIP (application-specific instruction-set processor) template supports LDPC (low-density parity check), Turbo and Viterbi decoding. Imec designed and optimized the ASIP architecture and generated a matching software development kit, using IP Designer, Target's tool-suite for ASIP design.
Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools.
Imec today announced it entered into a three-year research collaboration with Altera Corporation to develop advanced CMOS scaling technologies. Altera joins a growing number of fabless semiconductor companies that are part of imec's INSITE program, which provides member companies insight into near-term and future IC technology options. The initial collaboration between imec and Altera will focus on the development of 3-D process technologies targeting Altera's product families.
Imec today announced the establishment of imec India in Bangalore, Karnataka, making a first step towards the Indian market with the signing of an R&D partnership agreement with Wipro Technologies, the Global Information Technology, Consulting and Outsourcing business of Wipro Limited (NYSE: WIT). Imec is a leading independent applied research organization that carries out research activities in semiconductor, nanotechnology and nanoelectronics, delivering industry relevant technology solutions.
NVIDIA, a world-leader in visual computing technologies, signed a 3-year research collaboration agreement with imec on advanced CMOS scaling.By joining imec'score CMOS program as INSITE member,NVIDIA will get early insight in the impact of future process and design technology options on its next-generationproducts.
Atrenta Inc., a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec's 3D integration IIAP (industrial affiliation program), have jointly developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs. Imec and Atrenta will be demonstrating this flow at the Design Automation Conference (DAC) in San Diego, CA from June 6 – 8, 2011.
Today, Flanders' ambitious brain research that may lead to better diagnosis and treatment of brain disease, new prosthesis technologies for patients with a disability, a new generation of more intelligent robots, etc. switches into higher gear.