No. 100, Huanhe St., Sijhih City,
Taipei County
22154
Taiwan
Phone
+886-2-26942986-813
Fax
886-2-26943221
Web Address
http://www.dfi.com.tw/
DFI Company Details
DFI Unveil High Performance, Low Power Consumption COM Express Module
DFI announce a new Type of 2 COM Express basic form factor, the CR902-B, in its mobile Intel QM77 product line. This module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel Core/Celeron processor family, the next generation of 64-bit, multi-core processors built on 22/32-nanometer process technology delivering up to 15% CPU performance increase from previous generations.
DFI's Complete Line of Computer-On-Module Products
Due to the increasing demand of Computer-On-Module products, aside from Type 2, DFI completed its COM Express product line by adding Type 6, Type 10, and Mini form factor. In addition, we added several COM Express products that use BGA-package processor to satisfy vertical markets that require product stability. We now offer Type 2, Type 6, and Type 10 in Mini, Compact and Basic form factors.
Cost-Effective Full-Size PCIe CPU Card With Intel H61 Chipset From DFI
DFI has announced the PIC-H61, a new Full Size PICMG 1.3 board in its cost-reduced Intel H61 product line. It is powered by the 3rd/2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. PIC-H61 is cross compatible with the new 3rd Gen Intel Core processors built on 22-nanometer process technology and with the 2nd Gen Intel Core processors built on 32-nanometer process technology. This cost-effective board is powerful and yet energy-efficient.
DFI Unveil Cost-Effective microATX Motherboard Supporting 10 COM Ports
DFI has today introduced a new desktop microATX industrial motherboard, the SB332-C, which supports 10 Serial COM ports. This microATX form factor board supports the 2nd and 3rd generation Intel CoreTM i7, i5 and i3 processors that feature 32/22-nanometer process technology with the low-cost Intel H61 chipset. These processors provide higher performance at lower power than previous processors.
DFI Announces the CD101-N Series Mini-ITX Motherboard
DFI today releases the new Mini-ITX Industrial Motherboard – CD101-N Series, offering high efficiency with low-power consumption in its Intel Atom product line. The CD101-N Series is based on Intel Cedar Trail platform. These new dual core processors are built on Intel's 32-nanometer process technology providing low-power consumption and yet higher clock frequencies and faster memory access than their predecessors that are built on 45-nanometer technology.
DFI Announce Wide Temperature Qseven Module
DFI today announces the QB702-B, a new wide temperature Qseven form factor module in its Intel Atom E6x0T product line. This new Qseven module supports the Intel Atom E620T, E640T, E660T, and E680T processors that feature 45-nanometer process technology with integrated system memory and graphics processing to provide higher performance.
DFI Rugged Industrial Touch Panel PC for Industrial Control Automation
DFI introduces a series of IP65 rated Panel PCs – the TPC series. Available in 3 LCD sizes (12.1", 15", 17"), all models support the 2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. From the dual-core i3 processor to the quad-core i7 processor, the Panel PC is cross compatible with the new 3rd Gen Intel Core processors. And with the 3rd Gen processors built on 22-nanometer process technology, it makes the Panel PC's powerful and energy-efficient design suitable for industrial control automation.
DFI today announced the SB102-D Low-Cost Mini-ITX Board Powered by 3rd/2nd Gen Intel Core Processor Family
DFI today launches SB102-D, a new Mini-ITX motherboard in its cost-reduced Intel H61 product line. It features the 2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. From the dual-core i3 processor to the quad-core i7 processor, SB102-D is cross compatible with the new 3rd Gen Intel CoreTM processors.
Mini-ITX motherboard supporting the new mobile Intel HM76 Express chipset
DFI has today announced the launch of the most cost-effective Mini-ITX motherboard, CR101-D, in its 3rd generation Intel Core processor-based product line. It is DFI's first Mini-ITX board supporting the new mobile Intel HM76 Express chipset. This low power board supports a range of mobile-based 3rd generation Intel Core processors built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.
Industrial Grade Fanless Embedded System Supporting Wide Temperature/Voltage Range
DFI has today announced the industrial grade EC200 T series system, the latest addition to DFI's fanless embedded system family. Its unique modular-concept construction provides several I/O variations targeted for industrial automation applications. Virtually unlimited systems configurations are possible using low-cost OEM I/O modules designed to meet custom OEM specification requirements.
New Low Power Mini-ITX Supporting 3rd Generation Intel Core Processors
DFI brings the mobile-based 3rd generation Intel Core processor to the CR100-CRM Mini-ITX embedded board. It is DFI's first Mini-ITX board supporting the new mobile Intel QM77 Express chipset. This low power board supports a range of mobile-based 3rd generation Intel Core processors built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.
AMD Embedded G-Series APU-based COM Express Compact Modules
DFI is pleased to announce today a new COM Express Compact module, the OT905-B series, which is one of the few in the industry that is powered by the dual-core AMD Embedded G-series APUs. It is the perfect solution for applications that require low power and significant graphics performance in a small form factor module.
7 ARM Touch Panel PC aimed at Marine and Retail Applications
DFI has today announced the release of a new series of IP65 rated Panel PCs - the KS200 series. The three 7 Panel PCs are powered by the TI AM3517 Sitara ARM Cortex-A8 microprocessor with speed up to 600 MHz. Based on the ARM architecture, the system is fanless with low power consumption.
COM Express Compact Module with 3rd Generation Intel Core Processor Supports 3 Independent Displays
DFI today announces the CR908-B, the first COM Express Compact module in DFI's product line based on the new Mobile Intel QM77 Express chipset. This Type 6 module supports the 3rd generation Intel Core processors in BGA 1023 package.
DFI 3rd Generation Intel Core Processor-Based Embedded System Targets Industrial Automation Applications
DFI today launches the industrial grade EC300 series system, the latest addition to DFI's embedded system family. Its passive cooling and anti-shock drive bay mounting is designed for factory floor environments. The unique modular-concept construction supports 12 system configurations using three riser cards and three I/O module options in a cable-free assembly.
DFI Introduces 2 New COM Express Basic Modules with 3rd Generation Intel Core Processors
DFI today launches 2 new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel Core processors. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors.
DFI Introduces 2 New microATX Embedded Boards with 3rd Generation Intel Core Processors
DFI today announces 2 new embedded boards in its product line based on the new Intel Q77 Express chipset. The 2 microATX form factor boards support the 3rd generation Intel Core processor family which is the next generation of 64-bit, multi-core processor built on 22-nanometer process technology.
AMD Embedded R-Series based COM Express Module Supports 3 Independent Displays
DFI today launches a new COM Express Basic form factor module – CM901-B Type 6, powered by the AMD Embedded R-Series APUs. The supported processors are built on AMD's 32-nanometer process technology and boast exceptional high graphics performance combined with enhanced energy efficiency.
DFI Features Graphics-Rich AMD Embedded G-Series System Targeting Digital Signage Applications
DFI today announces a new compact design system, DS912-OT, offering low power consumption for digital signage applications. This embedded system is powered by the dual-core AMD T56N/T40N APU and AMD A50M Controller Hub. The low-profile heavy duty steel chassis accepts VESA, wall, or rack mounting using optional mounting kits.
DFI Combines Power and Performance using the Intel Xeon Processor E3-1200v2 Family-Based ATX Board that Supports 3 Independent Displays
DFI brings the latest Intel Xeon processor to the CL630-CRM ATX board. It is DFI's first ATX board supporting the new Intel C216 Express chipset. This ATX board supports the Intel Xeon processor E3-1200v2 family built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.
Intel Atom E6x0T Wide Temperature Solution on Qseven Module
DFI today announced its wide temperature Qseven form factor module, QB701-B Series. The new module offers low power consumption, integrated memory, improved graphic processing support, I/O interface flexibility and wide temperature support from -20ºC to 70ºC making it suitable for various environments. This cutting-edge module pairs the Intel EG20T PCH with the low power Intel Atom processor E6x0T series.
DFI Announces COM Express Compact Module CD905 Series Based on the Next Generation Intel Atom Processors
DFI today launches a new Type 2 COM Express Compact form factor module, CD905 Series, offering the next generation Intel Atom processors. These low power module boards pair an Intel NM10 Express chipset with a range of Intel Atom processors, from the power efficient Intel Atom N2600 processor to the enhanced Intel Atom D2700 processor. These new dual-core processors are built on Intel's 32-nanometer process technology providing low power consumption and yet higher clock frequencies and faster memory access than their predecessors that are built on 45-nanometer technology.
Low-Cost microATX Embedded Board Supports 10 Serial COM for ATM/POS Solution
DFI today announces the SB336-Ni, the first microATX board that supports 10 Serial COM. This microATX form factor board pairs the cost-reduced Intel H61 Express Chipset with the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors. For cost sensitive applications, the embedded board also supports the economical Intel Pentium processor G850.
DFI CD951 Series 3.5 SBC Supports the Next Generation Intel Atom Processors
DFI today launches the 3.5 Single Board Computer CD951 Series, offering the next generation Intel Atom processors. These SBC boards pair an Intel NM10 Express chipset with a range of Intel Atom processors, from the power efficient Intel Atom processor. These new dual core processors are built on Intel's 32-nanometer process technology providing low power consumption and yet higher clock frequencies and faster memory access than their predecessors that are built on 45-nanometer technology.
DFI Introduces the DS910-CD Fanless Embedded Computer Featuring Dual Independent 1080p HD Display Support
DFI today launches a new compact design system, DS910-CD, offering low power consumption and fanless cooling for digital signage applications. This embeddedc system is powered by the 1.60GHz dual-core Intel Atom processor N2600 and Intel NM10 I/O Express chipset with 5W system TDP.
DFI Announces New ATX Industrial Motherboard with 2nd Generation Intel Core Processor Support
DFI has announced the SB630-CRM, the first ATX motherboard in its Intel Q67 product line. This ATX form factor board supports the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors.
DFI SB600-C ATX Embedded Board Supports 2nd Generation Intel Core Processor
DFI has announced the SB600-C, a new addition to its ATX embedded board line. This ATX form factor board utilizes the low-cost Intel B65 Express chipset and supports the 2nd generation Intel Core i7-2600, i5-2400, and i3-2120 processors that feature 32-nanometer process technology providing higher performance at lower power than previous processors.
EC200 Series System Features Modular Construction Targeting Industrial Computing Applications
DFI today launches the industrial grade EC200 series systemwith passive cooling and anti-shock drive bay mounting designedfor factory floor environments. The unique modular-concept construction supports 12 system confi gurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems confi gurations are possible using low-cost OEM I/O modules designed to meet custom OEM specifi cation requirements.
EL620-C ATX Motherboard Supports ISA Bus Applications
DFI, a leading provider of embedded x86 products, today launches the EL620-C ATX form factor motherboard utilizing a low-cost Intel® G41 Express chipset with Intel® I/O Controller Hub 7. This new embedded board supports the 45nm Intel® Core™2 Quad processor Q9400 with up to 6MB of shared L2 cache and up to 1333MHz Front Side Bus (FSB), delivering high-performance computing in multi-threaded and multitasking environments. Embedded Intel® Architecture Core™2 Duo, Pentium®, and Celeron® processors are also supported, providing a broad range of price/performance options with long-term availability.
DFI Announces Mini-ITX Embedded Board SB100-NRM Supporting 2nd Generation Intel Core Processors
DFI today launches the Mini-ITX form factor SB100-NRM scalable desktop platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® Q67 chipset supporting the quad core Intel® Core™ i7-2600 and i5-2400 processors, and dual core Intel® Core™ i3-2120 processor utilizing 32-nanometer process technology.
DFI Announces COM Express Module HR900-B Supporting 2nd Generation Intel Core i7-2710QE Processor
DFI today launches the COM Express basic type 2 form factor HR900-B mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded module uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core™ i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.
DFI Announces Mini-ITX Embedded Board HR100-CRM Supporting Mobile 2nd Generation Intel® Core i7-2710QE Processor
DFI today launches the Mini-ITX form factor HR100-CRM mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.
DFI Announces microATX Embedded Board SB330-NRM Supporting 2nd Generation Intel Core Processor
DFI launched the Mini-ITX form factor SB330-CRM scalable desktop platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded board uses an Intel® Q67 chipset supporting the quad core Intel® Core™ i7-2600 and i5-2400 processors, and dual core Intel® Core™ i3-2120 processor utilizing 32-nanometer process technology. The graphics and processor cores are integrated on a single monolithic die and provide Intel® HD graphics support for DVI-I and VGA display interfaces. The new 32-nanometer Intel® Core™ microarchitecture provides higher performance at lower power than previous generation processors, and includes the first quad-core Intel processor with an integrated graphics core. Performance is further increased through the introduction of Intel® Advanced Vector Extensions (Intel® AVX) to the instruction set, providing acceleration of complex audio, video, and image processing.
DFI Releases Qseven™ Module QB700-B Based on New Intel® Atom™ Processor E6xx Series and Intel® Platform Controller Hub EG20T
DFI today launches a new Qseven form factor computer-on-module product, QB700-B, offering low power consumption, integrated memory, improved graphic processing support and I/O interface flexibility. This cutting-edge module pairs the Intel Platform Controller Hub EG20T with a low power processor form the Intel Atom processor E6xx series. This Intel Atom processor series is built on 45-nanometer process technology with integrated memory controller and graphics engine which eliminates the need to have a northbridge or southbridge to deliver these functions. This two-chip solution creates a tightly coupled system architecture providing higher performance than three-chip platform solutions.
DFI Releases New Mobile Intel QM57 chipset Mini-ITX Industrial Motherboard – CP100-NRM
DFI today launches a new Mini-ITX form factor motherboard, CP100-NRM, offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This next-generation embedded board utilizes the latest two-chip platform with the Intel QM57 chipset supporting Intel Core i7-620M (SV), Intel Core i5-520M (SV), Intel Celeron P4500 (SV) processors.
DFI LANParty Provides Great Audio Experience
In order to bring consumers the best and amazing audio experience, DFI LANParty launched it's the latest DK P55-T3eH9 with the Sound Blaster X-Fi technology, which comes from Creative and offers surround sound. Instead of spending almost $100 for extra X-Fi audio card, users can still obtain the same audio effect with DK P55-T3eH9. No matter which kind of music, movies, or games you are listening, watching, or playing, DK P55-T3eH9 can deliver premium audio effect and bring you the most realistic and immersive experience.
DFI Releases Intel Atom Based Fanless Embedded System
DFI releases the new ES951 fanless embedded system equipped with the 3.5" subcompact NP951-B16C SBC. Featuring an Intel Atom N270 Processor and Intel® 945GSE / ICH7M chipset with low power consumption, the ES951 is ideal for embedded computing applications requiring a compact passively-cooled platform.
DFI - Low Power Intel GM45 Mini-ITX Industrial Motherboard
DFI has launched a new mini-ITX form factor motherboard offering lower power consumption and higher performance for compact embedded systems. This new model utilizes the Intel GM45 Graphics Memory Controller Hub and Intel ICH9M Southbridge, supporting second-generation Intel Core 2 Duo processors and the Intel Celeron 575 processor with up to 1,066 MHz FSB and Intel 45nm transistor technology.
EL339-B - DFI Launches New Intel® G41 uATX Industrial Motherboard
DFI introduces a new industrial uATX form factor motherboard utilizing the Intel G41 Express chipset with Intel ICH7 I/O controller hub. This new embedded board supports 45nm Intel Core2 Quad and Intel Core2 Duo processors with 800/1066/1333 MHz Front Side Bus (FSB), delivering high-performance computing in multi-core enabled application environments.
BI 785G-M35 - High Performance MicroATX Motherboard
Possessing industrial grade technology, DFI LANParty is going to launch the newest Blood Iron series product, 785G-M35 Micro ATX motherboard. Accommodating AMD 785 chipset, BI 785G-M35 incorporates integrated ATI Radeon HD 4200, which supports DirectX10.1, Shader Model 4.1, and UVD 2.0. With 128MB DDR3 Sideport Memory, graphics performance of BI 785G-M35 can be improved up to 10%~15%. What is more, it comes with LANParty exclusive "ABS II" CPU Auto Upgrade technology and leading-edge digital PWM so as to let users enjoy the ultimate high performance and simultaneously save a huge amount of budget and electric pay.
