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Cadence Design Systems Energy Micro Uses Cadence Low-Power Solution to Develop its Latest Energy-Efficient MicrocontrollerCadence Design Systems today announced that Energy Micro, the energy friendly microcontroller company, deployed Cadence Low-Power Solution, to develop a highly power efficient ARM Cortex M3-based microcontroller that significantly saves battery life. Cadence Europe Expands Its Academic NetworkCadence Design Systems announced that three additional universities will take on active roles in its academic network in Europe. The network promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. The latest additions to the Cadence Academic Network are the CETTI/TU Bucharest, which will focus on PCB design; the KTH Stockholm, which will concentrate on wireless radio design; and the TU Braunschweig, with the focus on digital low power design methodology. Chipsbank Adopts Cadence Incisive Xtreme III System to Boost SoC Verification PerformanceCadence Design Systems announced that Chipsbank Microelectronics Co., Ltd., a leading fabless IC design company based in Shenzhen, China, has adopted the Cadence Incisive Xtreme III system to accelerate the RTL design process with a verification flow for its next-generation digital consumer and networking chips. Cadence Encounter Digital Implementation System 9.1 Addresses Industry Productivity Crisis for Complex System-on-Chip DesignCadence Design Systems has released Cadence Encounter Digital Implementation (EDI) System 9.1, a complete and integrated digital design, implementation, and verification environment for the development of large-scale, complex SoCs. The new and expanded suite of capabilities in EDI System 9.1 answers the industry call for improved designer productivity in developing advanced low power and mixed signal SoCs at leading-edge process nodes – such as 32- and 28-nanometer - with hundreds of millions of gates, including hundreds of IP elements and embedded processors. Cosmic Circuits Adopts Cadence Virtuoso 6.1 for Complex Analog and Mixed-Signal DesignsCadence Design Systems (I) Pvt Ltd., a subsidiary of Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that Cosmic Circuits, a leading provider of differentiated analog IP cores, has adopted the Cadence® Virtuoso® IC 6.1 custom design platform. After extensive and rigorous testing, Cosmic selected Virtuoso IC 6.1 for its complex analog and mixed-signal layout flow, and immediately gained 30 percent improvement in productivity and turnaround time over its previous flow. Zoran Deploys Cadence Virtuoso Software for Complex, Advanced Technology, Mixed-Signal ChipCadence Design Systems today announced that Zoran Corp., a leading provider of digital solutions in the digital entertainment and imaging markets, taped out a complex, advanced technology mixed-signal chip using the Cadence® Virtuoso® suite of design and simulation products. Zoran adopted the Virtuoso technology to address the growing complexities and challenges its engineers faced moving to advanced nodes. Fairchild Semiconductor Selects Cadence as Primary EDA PartnerCadence has announced that Fairchild Semiconductor, a leading global provider of energy-efficient semiconductor technology, has named Cadence as its primary EDA partner following the signing of a multi-year agreement for key Cadence mixed-signal technology. AppliedMicro Standardizes on Cadence Encounter Digital Implementation SystemCadence Design Systems today announced that Applied Micro Circuits Corporation has selected the Cadence Encounter Digital Implementation (EDI) System for its large, complex advanced-node designs. EDI System joins other multiprocessing-capable offerings in the AppliedMicro methodology to form a standardized design infrastructure based set of tools. AppliedMicro Standardizes on Cadence Encounter Digital Implementation SystemCadence Design Systems today announced that Applied Micro Circuits Corporation has selected the Cadence® Encounter® Digital Implementation (EDI) System for its large, complex advanced-node designs. EDI System joins other multiprocessing-capable offerings in the AppliedMicro™ methodology to form a standardized design infrastructure based set of tools. Cadence Strengthens Virtuoso Custom IC Design LeadershipCadence Design Systems today extended its leadership position in analog and mixed-signal chip design technologies with the introduction of dramatic improvements to its leading Virtuoso IC design platform. Cadence announced powerful performance, capacity and usability enhancements in Virtuoso IC6.1.4 that reduce overall design time while ensuring high-quality production ICs. IC Plus Standardizes Verification Process with Cadence Incisive SolutionCadence Design Systems today announced that IC Plus, a communication and networking IC design company in Taiwan, has adopted the Cadence Incisive verification solution with the Open Verification Methodology (OVM) and Cadence verification IP (VIP) to optimize development time while simplifying and standardizing its verification process. Exar Selects Cadence as Mixed-Signal EDA ProviderCadence Design Systems announced today that Exar Corporation has signed an expanded business agreement to establish Cadence® as its leading chip planning and mixed-signal design solutions provider. As a result of the new multi-year agreement, the Cadence Virtuoso® and Encounter® platforms, as well as the Cadence Chip Planning Solution, will make up Exar's key mixed-signal design environment for designs at 65 nanometers and below. Cadence Marks Annual Innovation Day with Honors for its Top Technology LeadersCadence Design Systems today is celebrating Innovation Day, honoring the contributions Cadence employees have made to the company and the electronics industry as a whole. Having garnered more than 800 U.S. patents and an additional 150 international patents, Cadence has a long legacy of technology innovation that has enabled EDA customers to successfully create some of the world's most recognized consumer and business products for over 20 years. Silicon Hive Utilizes Cadence Palladium III Solution for Highest Quality IP for Multi-Core Multi-Million Gate DesignsCadence Design Systems has announced that Silicon Hive, a worldwide supplier of semiconductor intellectual property (IP), achieved the highest quality for its HiveGo mobile imaging and video decoding solutions using the Cadence Palladium III Accelerator/Emulator. Palladium technology enabled Silicon Hive to meet aggressive IP quality requirements for multi-core, multi-million-gate designs targeting mass-market consumer products. Cadence Reports Q3 2009 Financial ResultsCadence reported third quarter 2009 revenue of $216 million, compared to revenue of $232 million reported for the same period in 2008. On a GAAP basis, Cadence recognized a net loss of $14 million, or $(0.05) per share on a diluted basis, in the third quarter of 2009, compared to a net loss of $171 million, or $(0.67) per share on a diluted basis in the same period in 2008. SMIC and Cadence Announce 65-Nanometer Low power Reference Flow 4.0Cadence Design Systems has announced that it has delivered a comprehensive low-power design flow for engineers targeting the 65-nanometer process at Semiconductor Manufacturing International Corporation . Based on the Cadence Low-Power Solution, the flow enables faster design of leading-edge, low-power semiconductors using a single, comprehensive design platform. |
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