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HEITEC AG

HEITEC AG Articles

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Enclosures
25th October 2017
New accessories available for system chassis family

Further extending its range of existing varied design options and possibilities, HEITEC has presented new accessories for its cost-effective, robust and flexible HeiPac Vario chassis family. The HeiPac Vario family is available as a standard subrack system for 19" mounting, in various versions from a height of 3-11 U, in differing widths (42, 63 and 84 HP) and in customised sizes. Versions such as the HeiPac Vario ECO, HeiPac EASY and H...

E-mech
9th October 2017
Chassis technology aids high speed data processing

The combination of data, speech and video, new wireless standards, and the high resolution images used in (U)HDTV means transmission frequencies and bandwidths are constantly increasing. Stephan Leng, Applications Engineer, Electronics Division HEITEC AG explains.

Events News
21st February 2017
HEITEC to showcase system solutions at Embedded World 2017

  HEITEC will be presenting its latest system solutions in Hall 1-booth 340 under the motto 'From the idea to the product' at Embedded World in Nuremberg (March 14-16th, 2017).

Enclosures
12th December 2016
'Do it yourself' with online configurator

After taking over all customer-specific electronic assembly systems from Rittal and rebranding all product names 'from Ri to Hei', HEITEC has presented a comprehensive online configurator for their HeiPac subrack series Vario and Easy. The online Subrack Configurator can be accessed directly on HEITEC’s website. 

Enclosures
5th October 2016
Extension of HEITEC’s HeiCase family

With immediate effect, the electronics division of HEITEC AG offers the opportunity to receive customised versions of its successful modular HeiCase standard enclosures family (formerly RiCase) featuring a height of up to 30U and a depth of up to 900mm. In consequence, these variants are particularly suitable for packaging-intensive applications with a lot of electronics or as a mobile “cabinet replacement” which, in comparison with c...

Events News
9th March 2016
HEITEC at Embedded World 2016

At Embedded World in Nuremberg last month, HEITEC emphasised its expertise in enclosure technology and in customised system integration with two demos ‘Out of the Box'. Various possibilities for the realisation of housing products up to complex system solutions in electronics and software are clearly presented with the 'HEITEC 4.0 TO GO' demo case.

Events News
23rd February 2016
“From the Idea to the Product” at Embedded World

At the Embedded World 2016, HEITEC will use the slogan "From the Idea to the Product". By means of six different exhibits in different integration levels, the company shows its expertise in implementing customised industry solutions in Hall 1, Stand 340. Depending on the requirements, software, mechanical and electronic modules from a single source can be used to realise fast, low risk and cost-effective system solutions.

Events News
15th February 2016
From the idea to the product

At the Embedded World 2016 (February 23rd-25th, 2016) HEITEC will use the slogan 'From the Idea to the Product'. By means of six different exhibits in different integration levels, the company shows its expertise in implementing customised industry solutions in Hall 1, Stand 340.

Enclosures
22nd September 2015
Modular enclosure technology now available on rolls

The Electronics division of HEITEC has expanded its popular RiCase housing range upon customers’ request with enclosures for flexible, modular use and heavy loads. This line, suitable for 19" rack-mount as well as for the mounting of components, meets many market requirements for ultra-stable table-top and system enclosures.

Analysis
29th July 2015
HEITEC horizons widen with Wakefield-Vette pact

HEITEC’s Electronic Business Unit has entered a strategic partnership with Wakefield-Vette to expand its business in North America. "With the newly signed partnership with Wakefield-Vette/USA in place, HEITEC will now be able to serve new and important markets, particularly in North America," said Roland Chochoiek, Executive Vice President Business Unit Electronics at HEITEC.

Enclosures
9th June 2015
Enclosure solution offers multiple design options

  HEITEC presents its Ripac Vario module family extension as a cost-efficient, robust and flexible enclosure solution which offers multiple design options, as well as an off-the-shelf variants for the quick, easy and precise adoption to customer-specific applications.

Enclosures
11th March 2015
Racks address increasing compactness of devices

At Embedded World 2015, HEITEC presented its latest packaging and system solutions as well as design services for embedded solutions themed Fit for Embedded 4.0. The company has expanded its comprehensive housing portfolio with CompactPCI Serial platforms that provide answers to many design requirements.

Events News
4th February 2015
HEITEC to exhibit Embedded World 2015

At Embedded World 2015, HEITEC will present its latest packaging and system solutions, as well as its design services. The company will also host a live demo combining hard- and software elements of embedded systems, controlled by external sensor technology. 

Events News
15th December 2014
M2M solutions exhibited at SPS IPC Drives 2014

At the SPS IPC Drives 2014, which took place from 24th to 26th November in Nremburg, HEITEC exhibited simulation programmes for virtual engineering, M2M communication, and UIs, which are useful for planning, implementing, or upgrading systems, as well as making processes more efficient.

Events News
15th December 2014
Compact electronic housings exhibited at SPS IPC Drives 2014

At the SPS IPC Drives 2014, which took place from 24th to 26th November in Nuremburg, HEITEC demonstrated its latest software, electronic and mechanical components. From its wide range of electronic housings, the company presented two CompactPCI Serial products, which are available with Ethernet Star or Full Mesh backplane technology in scalable designs.

Events News
10th December 2014
Image processing solutions exhibited at SPS IPC Drives 2014

  At SPS IPC Drives 2014, which took place from 24th to 26th November in Nuremberg, Germany, HEITEC exhibited its latest image processing solutions for optical inspection. 

Events News
9th December 2014
Embedded system targets metrological applications

 At SPS IPC Drives 2014, which took place from 24th to 26th November in Nuremberg, Germany, HEITEC exhibited its solutions for the electronics industry. 

Enclosures
30th June 2014
Table-top and system enclosures can be customised

HEITEC has revealed that the company now offers the opportunity to have the standardised RiCase table-top and system enclosures family adapted to the customer's corporate design. While the chassis itself is not colour varnished, the special finishing of the aluminium corner caps and plastic decorative elements now show the customer's colour of choice.

Events News
27th January 2014
Intelligent LED control demo to be showcased at embedded World 2014

At Embedded World 2014 in Hall 1/ Booth 338, design and packaging innovations will be showcased by HEITEC. HEITEC will demonstrate an intelligent control demo for cascading and dimming of multiple LED strings for the interior lighting of an aircraft.

Analysis
6th December 2012
HEITEC acquires Electronic Packaging Systems from Rittal

At the automation fair SPS/IPC/Drives in Nuremberg the German HEITEC AG announced the acquisition of Rittal’s complete line of electronic packaging systems. Effective January 2013, design, production and sales of all serial products and customer specific solutions concerned will be transferred to HEITEC. After taking over the customer specific solutions business from Rittal three years ago, with this agreement HEITEC will now continue to extend...

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