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congatec

congatec Articles

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Analysis
17th November 2014
congatec benefits from embedded computer expertise

  congatec has entered into a distribution agreement with ies, for the German-speaking market. ies brings know-how in embedded computer technology, particularly in the development of custom-specific solutions, to the partnership.

Boards/Backplanes
17th November 2014
Low-power motherboard allows for easy customisation

  congatec has introduced its first industrial Thin Mini-ITX motherboard, the conga-IC87. Based on 4th gen Intel Core single-chip processors (codenamed Haswell), the motherboard features a low power consumption of just 15W TDP and long-term availability of seven or more years.

Boards/Backplanes
17th November 2014
SBC's powerful graphics & fast data transmission suit POS

Congatec has added to its successful product range with an industrial Mini-ITX motherboard based on the Intel Atom E3800 series (codenamed Bay Trail). The conga-IA3 is an extremely low-power, high-performance SBC with embedded qualities. Rugged computer boards are available in the popular Thin Mini-ITX form factor, suited for 24/7 operation.

Communications
17th November 2014
‘Headless’ CoM suits deeply embedded IoT applications

congatec is expanding its successful Qseven product series with the first ‘Headless’ CoM. Based on the Intel Atom processor E3805 (1M Cache, 1.33GHz, 3W TDP), the congatec Qseven Headless module is a cost-effective, energy efficient solution for deeply embedded systems that require no graphics output.

Analysis
17th November 2014
Embedded design & manufacturing support package cuts costs

  congatec is expanding its successful value chain with Embedded Design & Manufacturing (EDM) services. Customers benefit from congatec's rich experience as a manufacturer of high quality computer modules with synergistic effects, leading to reduced development time and costs.

Communications
15th October 2014
Modules integrate ECC memory for safety & security

Offering designers the safety and security of ECC memory, the conga-MA3E COM Express Mini Type 10 module has been released by congatec AG. Based on the Intel Atom E3800 series of processors, the module succeeds the companies conga MA3. To correct errors, ECC modules check and adjust the data flow. The correction mode of ECC modules differ from the ‘parity bit’, as it detects and corrects both single and double bit errors. 

Communications
7th August 2014
Why the transport sector is adopting modular computing

  The transport industry requires systems to comply with the highest standards of robustness, reliability and availability. By Christian Eder, Director of Marketing, congatec.

Communications
20th June 2014
Computer modules offer greater performance per watt

congatec AG has expanded its Qseven and COM Express product range with modules based on 2nd generation AMD Embedded G-Series SOC (System-on-Chip) processors. Compared to the current AMD Embedded G-Series SOC platform, they provide higher performance and a lower power draw thanks to an improved Jaguar+ CPU architecture and AMD Radeon 8000 graphics core.

Boards/Backplanes
19th June 2014
First congatec Mini-ITX

congatec AG extends its successful board-level product range with the first industrial Mini-ITX motherboard. The new embedded motherboards will meet the same standards and quality as the established Computer-On-Modules from congatec. Additional services include 7+ years availability, global technical support, extended manuals, specifications and customized design services.

Communications
17th June 2014
Qseven module certified for the Internet of Things

Based on the Intel Atom processor E3800 family, the conga-QA3 Qseven module from congatec is certified for the Intel Gateway Solutions for the Internet of Things (IoT). By combining the Qseven module with the validated solution stack of the Intel Gateway Solutions for IoT, congatec offers a pre-integrated and open platform to quickly bring secure IoT solutions to market.

Analysis
3rd June 2014
congatec opens subsidiary in Shanghai

Continuing its path of globalization, congatec AG has opened a subsidiary in China. Based in Shanghai, the subsidiary will be able to provide quick customer service and technical support to congatec's Chinese partners and customers.

Tech Videos
2nd June 2014
congatec's first industrial Mini-ITX motherboard

congatec extends its successful board-level product range with the company's first industrial Mini-ITX motherboard. The embedded motherboards will meet the same standards and quality as the established Computer-On-Modules from congatec. Additional services include 7+ years availability, global technical support, extended manuals, specifications and customised design services.

Communications
4th March 2014
Qseven COM uses 33% less power than its predecessor

Adding the AMD Embedded G-Series SOC platform, congatec is expanding its Qseven product range. The company's latest Qseven module, designated the conga-QG, this single-chip solution combines the improved processing power of the "Jaguar" processor with the graphics core of AMD Radeon 8000 technology.

Communications
26th February 2014
COM Express offers high scalability in a single-chip design

Based the Intel Atom E3800 series of processors, the conga-MA3 is congatec's first COM Express Mini Type 10 module with a size of 55 x 84mm.  Features of the latest Intel Atom generation include its single-chip design, an L2 cache able to be shared by multiple cores, and a much faster Intel HD graphics engine than the previous generation. The highlights of the module include its ultra-dense design, onboard soldered m...

Communications
16th January 2014
The perfect partnership

The demands from embedded system developers means segmentation still prevails at a hardware and software level. But recent developments in Computer-on-Module platforms point towards a more unified future. By Jochen Dieckfoß, Embedded software expert and Windows Embedded MVP, Adeneo, and Klaus Seufzger, Software Developer, congatec.

Communications
10th October 2013
congatec COM Express module features 4.5 watt SDP

congatec announces the release of the conga-TCA3 COM Express module. The conga-TCA3 is available in seven variants based on the new Intel Atom processors E3800 product family and Intel Celeron processor N2920 (formerly codenamed “Bay Trail”). The COM Express Type 6 compact (95 x 95 mm) module offers a compelling entry price for this form factor, and the Intel Celeron N2920 1.6 GHz quad-core variant features a stunning scenario design ...

Communications
10th October 2013
Qseven module based on the Intel Atom processor E3800

congatec announce the conga-QA3 Qseven module based on the Intel Atom processor E3845. All modules are fitted with ceramic capacitors making them ideal for industrial mobile applications in harsh environments. New features include an ample L2 cache, which can be shared by multiple cores, and a much faster Intel HD graphics unit compared with the previous generation. This turns new applications into visual experiences.

Tech Videos
13th September 2013
conga-TS87 COM Express Type 6 with 4th Gen Intel Core processors

congatec marketing engineer Zeljko Loncaric outlines the features of the new conga-TS87 COM Express Type 6 module with 4th Generation Intel Core processors.

Boards/Backplanes
2nd September 2013
Low-cost entry to 4th Gen Intel Core processors on COM Express

congatec AG announces expanded processor support for the conga-TS87, a pin out Type 6 COM Express module based on the 4th Generation Intel Core 2-chip solution. The most significant innovation is the introduction of Intel Advanced Vector Extensions 2.0 for improved floating point instructions in signal and image processing.

Communications
2nd September 2013
COM Express goes ultra-low power thanks to 4th Generation Intel Core single chip

congatec AG announces immediate availability of the conga-TC87 Type 6 COM Express compact module supporting 4th Generation Intel Core processors. It is a low-power single-chip solution, codenamed Haswell-ULT, with integrated chipset (PCH) and graphics. Despite increased performance, the maximum thermal design power is a mere 15 watts.

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