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congatec

congatec Articles

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Boards/Backplanes
20th April 2017
Type 7 Server-on-Modules conform to PICMG standard

  congatec has welcomed the PICMG release of the COM Express 3.0 specification. The revision 3.0 of the specification formally integrates the new Type 7 pinout type which is the basis for congatec's Server-on-Modules. The official release fires the starting shot for the race to a new generation of server designs based on standardised Server-on-Modules.

Wireless
10th April 2017
Cloud API simplifies orchestration of wireless sensor networks

A best practice design solution for the simplified orchestration of wireless sensor networks was showcased by congatec at embedded world 2017. It is based on the new, application ready congatec Cloud API (Application Programming Interface) for IoT gateways that is capable of integrating any local sensor networks into any cloud solution.

Boards/Backplanes
28th March 2017
congatec further standardises interface setup for SMARC 2.0

  congatec has introduced a SMARC 2.0 module supporting powerful USB-C connectivity. The utilisation of the USB-C specification makes USB interconnects even more universally applicable, further standardising the interface setup of SMARC 2.0-based embedded devices.

Boards/Backplanes
10th March 2017
Motherboard is designed for IoT connected devices

  congatec has introduced the conga-IC175, a thin industrial-grade motherboard family featuring the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices. The new boards are suited for space-constrained, high-performance, low-power IoT designs.

Analysis
1st February 2017
Module specialist strengthens UK presence

Martin C. Frederiksen has recently been appointed as the new congatec Sales Director for Northern Europe to strengthen the company’s sales and support organisation in the UK and in Scandinavia. Together with the appointment of Martin Frederiksen, the Northern European sales team has been extended further with the addition of Anders Rasmussen and Jon Moseley as Key Account Managers. Additionally, congatec has recently created a new, wholly o...

IoT
1st February 2017
congatec announces comprehensive support of Windows 10 IoT

  Comprehensive support of the IoT editions of Windows 10 has been announced by congatec. These full versions of Windows 10 are characterised by their extended security functions and lockdown options for IoT-connected appliances. 

Micros
4th January 2017
COM Express modules have Gen 7 Intel Core processors

congatec has released COM Express Compact modules in time with the launch of the 7th generation of Intel Core SoC processors. The conga-TC175 Computer-on-Modules (COMs) with Intel's Skylake successor -the second variant of the current 14nm microarchitecture - are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fas...

Micros
4th January 2017
Boosting module-based high-end embedded computing

congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.

Micros
8th December 2016
COM Express Mini module offers more than any module before

congatec has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel Atom, Celeron and Pentium processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small COM Express Mini module.

Analysis
7th December 2016
congatec strives to become embedded go-to provider in France

congatec has founded a new subsidiary in France with offices in Paris and Toulouse to strengthen its sales and support organisation in France and the French speaking regions of Belgium and Switzerland. The aim of the new congatec France SAS is the intensified roll-out of the congatec brand as the natural go-to provider for embedded modules and SBCs in France, as congatec is in Germany. Luc Beugin will manage our office in Paris. Stephane Mai...

Boards/Backplanes
15th November 2016
Mini-ITX and Pico-ITX boards feature security enhancements

The conga-PA5 Pico-ITX single board computer and the conga-IA5 Thin Mini-ITX motherboard, two industrial-grade, long-term available computing platforms featuring the latest Intel Atom, Celeron and Pentium processors, has been introduced by congatec. System engineers can immediately deploy them to upgrade existing Pico-ITX and Mini-ITX designs and benefit from approximately 30% more processing power and 45% more graphics performance compared to th...

Analysis
15th November 2016
Quick Starter Kit for SMARC 2.0 aids Intel Atom processors

congatec presents the SMARC 2.0 Quick Starter Kit for Intel Atom processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel Atom processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wir...

Communications
26th October 2016
Low power processor modules available for every budget

congatec has released COM Express Compact and Qseven Computer-on-Modules in time with the launch of Intel’s low-power processors (code name Apollo Lake). The modules with Intel Atom, Celeron and Pentium processors feature the powerful Intel Gen 9 graphics and deliver an impressive performance per watt improvement, enabling the implementation of even more powerful designs with even lower energy consumption.

Communications
13th October 2016
First COM Express Type 7 modules with Intel Xeon D processors

Parallel to the preview release of the COM Express Type 7 specification, congatec is introducing new Server-on-Modules with Intel Xeon D processors (codename Broadwell). Based on the COM Express Basic standard form factor (95x125mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48GB of DDR4 ECC RAM.

IoT
17th August 2016
IoT gateway is flexible for rapid field deployment

Application ready and easily customisable for rapid field deployment, congatec has introduced its highly flexible IoT gateway system. The gateway offers extreme levels of flexibility in terms of processing performance and software integration, able to host up to eight wireless antennas that can be connected to three mini PCI Express slots and six internal USB based slots for wireless and wired connectivity modules.

IoT
1st July 2016
Embedded COM tech supports new module specification

Full support of the new SMARC 2.0 specification, which was released by the Standardisation Group for Embedded Technologies e.V. (SGET) just a few days ago has been announced by congatec. This major technology adaption extends congatec’s leading and extensive COM portfolio to include a brand new solution which is perfectly positioned between Qseven and COM Express.

Communications
9th June 2016
Server-on-Modules enable real-time media processing

congatec has introduced two Server-on-Modules based on the latest Intel Xeon E3-1578L and E3-1558 processors, which have been designed for real-time media processing. The conga-TS170 modules feature integrated Intel Iris Pro Graphics accelerated by 128MB fast eDRAM and double graphics base frequency for outstanding transcoding and video processing performance.

Communications
19th May 2016
Modules integrate most cost efficient Intel Celeron processor

congatec increases the scalability of its COM Express Computer-on-Modules with two entry-level models based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The Intel Celeron processor-based COM Express Basic and Compact modules combine cost efficient dual-core CPU performance with state of the art features such as 4k multiscreen support, high-speed DDR4 RAM with increased bandwidth and four USB 3.0 ports.

Communications
2nd March 2016
A roadmap for SMARC 2.0, Qseven 2.1 & COM Express 3.0

  congatec has announced that it fully supports the upcoming new SGET and PICMG CoM specifications SMARC 2.0, Qseven 2.1 and COM Express 3.0. Modules complying with these standards are already in development and will be announced in time with the launch of the next processor generations.

Communications
2nd March 2016
COM Express module is based on AMD G-series SoC

Expanding its COM Express portfolio, congatec has launched a module based on the AMD G-Series SOC (called Brown Falcon). Compared to modules based on the previous generation of AMD Embedded G-series SOCs, the conga-TR3 with dual-core AMD GX-217GI processor provides up to 30% more graphics performance and 15% more overall system performance.

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