Companies

Baolab Microsystems

  • Institut Politècnic del Campus de Terrassa
    08220 Terrassa
    Spain
  • +34-93-394-17-70
  • http://www.baolab.com
  • +34-93-736-21-37

Baolab Microsystems Articles

Displaying 1 - 4 of 4
Analysis
9th May 2012
Success of 3D NanoCompass will enable Baolab to create low cost, smart, reconfigurable Inertial Measurement Unit

Baolab Microsystems has announced that it expects to be able to modify the structures that it designed for its 3D NanoCompass to build a range of other motion sensors and, ultimately, to create low cost, smart, reconfigurable Inertial Measurement Units (IMUs). These NanoIMUs will use Baolab's patented, award winning NanoEMS technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume ...

Analysis
5th July 2011
Baolab uses its NanoEMS technology to create ultra-low cost 3D Digital MEMS Compasses in CMOS

Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic field concentrators to detect the direction of the Earth’s magnetic field. Baolab Microsystems is first to design a pure CMOS Lorentz force MEMS sensor and, as a result, its new 3D Digital NanoCompass™ matches performance benchmarks for sensitivity, power consumption and package siz...

Analysis
14th December 2010
Baolab wins R&D award in 2010 Elektra Awards

Baolab has won the prestigious Elektra European Electronics Industry Awards 2010 in the R&D category for its innovative NanoEMS™ technology. The established annual highpoint of the electronics industry, the Elektra Awards gives the industry the opportunity to recognise the achievements of individuals and companies across Europe. They are designed to promote best practice in key areas including innovation, sales growth and employee motiv...

Analysis
11th March 2010
Baolab creates nanoscale MEMS inside the CMOS wafer

Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer. This significantly reduces the costs of a MEMS by up to two thirds and even more if several di...

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