RFMD's RF323x power platform addresses the challenges confronting handset manufacturers as they seek to meet the increasing global demand for affordable smartphones. Using RFMD’s RF323x power platform, designers of entry-level 3G smartphones can achieve the optimum balance of cost, performance and flexibility in the RF front end while satisfying critical requirements for quality and reliability in high-volume handset manufacturing.
Eric Creviston, president of RFMD's Cellular Products Group (CPG), said, Our customers see cost as a key driver in the entry-level 3G segment and want flexible front end solutions that scale easily to address multiple operator and regional requirements. Our high-efficiency 3G entry power platforms provide a full array of tiered options at compelling price points, setting the benchmark for ease of implementation and current consumption in a single, scalable reference design.
RFMD's RF323x power platform features the high-efficiency PowerStar®-based RF323x 2G transmit module with pin-compatible options supporting either one or two bands of WCDMA. The pin-compatible WCDMA PAs are available in two product family options. The first option, the RF724x family of WCDMA power amplifiers, addresses all major frequency bands and delivers industry-leading peak efficiency and DG.09 as low as 13 mA through the use of multi-bias control. The second option, the RF722x family of WCDMA power amplifiers, also addresses all major frequency bands and is optimized for chipsets using 3-mode control schemes.
RFMD's RF323x power platform for entry-level 3G handsets is compatible with major chipset providers including Qualcomm, Mediatek, Broadcom and ST Ericsson. Samples are available now, and volume production is anticipated in the March 2011 quarter.