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Nexcom Launches new Com-Express Platforms

25th June 2010
ES Admin
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Nexcom has launched two new embedded boards which are based on the Computer On Module (COM Express) form factor, a format which reduces the design cycle lead times and provides other benefits such as trouble-free maintenance, installation and upgrades.
ICES 252 is a Com Express Module that features the Intel Atom D510 1.66GHz CPU and ICH8M chipset in an ultra compact footprint. This embedded computing board therefore offers users a combination of high-computing power, low power consumption, and exceptional reliability.

ICES 252 has numerous features which make it suitable for today’s embedded applications, these include support for Intel® PCI Express GbE 82574L, 3 x SATA HDD, 1 x IDE HDD and 8 x USB. ICES 252 will support DDR2 667 and 800 SO-DIMM memory up to 2GB.

For added versatility Nexcom have also launched ICES 251 which shares the same features of the ICES 252 but is based on the Intel® Atom™ N450 1.66GHz CPU. Both platforms will find applications within medical equipment, Panel PC’s (POS), media-rich gaming platforms, Real-time Data Analysis within Industrial Automation and Unmanned Vehicles & Training Simulators for military usage.

NEXCOM understands that one of the main factors in a successful COM project is the availability of design-in services to help customers develop carrier boards. Whether it is the Customer’s own carrier board design, NEXCOM’s customized carrier board developed according Customer’s specifications, or the Customer’s existing carrier board; NEXCOM COM Competence Center (CCC) provides a series of services designed to help partners win embedded projects.

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