Communications
DFI Introduces 2 New COM Express Basic Modules with 3rd Generation Intel Core Processors
DFI today launches 2 new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel Core processors. The supported processors are built on Intel’s 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors.
The The low power module boards take full advantage of the mobile Intel QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.
The Intel HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. Targeted at multimedia and medical applications, CR901-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, DisplayPort, and SDVO) allowing you to choose the best combination to suit various applications requirements. CR900-B on the other hand supports VGA and LVDS interfaces for dual independent display with resolution up to 1920x1200 @ 60Hz.
The module boards support the same high performance I/O expansion except for CR901-B which supports the new USB 3.0 that is capable of processing more data load.
The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.