Emerson Network Power Rugged Processing Blade Now Verified by Cisco for Secure Unified Communications in Federal and Defense Applications

26th April 2012
News Release from: Emerson Network Power
Written by : ES Admin
Emerson Network Power Rugged Processing Blade Now Verified by Cisco for Secure Unified Communications in Federal and Defense Applications
Emerson Network Power today announced that its rugged 3U CompactPCI processing blade is now verified by Cisco for secure unified communications solutions in federal and defense applications. The CPCI7203, running VMware virtualization software, has completed interoperability verification testing for the Cisco Unified Communications Manager, enabling a new generation of scalable and highly available collaborative communication platforms for government agencies and network-centric defense applications.
“Validation of the Emerson Network Power CPCI7203 processing blade will enable quicker and easier transition from legacy deployed PBX systems and simplify maintenance to help reduce total cost of ownership,” said Paul Virgo, marketing director for the Embedded Computing business of Emerson Network Power. “In today’s security-conscious environment, the ability to collaborate with encrypted communications is more important than ever. Emerson is pleased to expand its capabilities in this area and receive this affirmation from Cisco.”

Cisco Unified Communications Manager Release 8.6.1 is completing certification at the Joint Interoperability Test Command (JITC), which allows it to operate on U.S. Department of Defense communications networks. It enables defense agencies to manage their communications quickly and conveniently in order to focus on mission-critical tasks.

The Emerson Network Power CPCI7203 single-board computer uses the Intel Core i7 integrated dual-core processor in the 3U form factor for high performance applications in space-constrained applications. Emerson's leading edge thermal and rugged solution makes the CPCI7203 ideal for harsh environments. On-board memory includes up to 8GB soldered ECC DDR3 memory and the air cooled variants also support 256KB non-volatile memory and 4GB MicroSD flash. Conduction cooled variants offer a high density 1.8” SSD storage solution.

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