Communications
First USB 3.1 platform-to-platform Host-Device IP data transfer achieved
The industry's first SuperSpeed USB 10 Gbps (USB 3.1) platform-to-platform Host-Device IP data transfer has been achieved by Synopsys. The IP realized 10 Gbps USB 3.1 effective data rates of more than 900 MBps between two Synopsys HAPS-70 FPGA-based prototyping systems while using backward-compatible USB connectors, cables and software.
3.5“ SBC powered by 'Bay Trail' SoC
DATA MODUL have announced the ECM-BYT, a new 3.5“ SBC powered by the latest Intel Atom processor E3800 product family or Intel Celeron N2920/J1900 processor - a System-on-Chip (SoC) formerly codenamed “Bay Trail”. Designed for intelligent systems and applications with low power consumption and high performance requirements, the ECM-BYT is based on the 22nm Silvermont microarchitecture.
AS-i modules provide easy PLC connections
Connecting Rockwell Logix control systems to an AS-interface network has never been simpler with the introduction of Molex's new Brad SST Actuator Sensor Interface Modules. The AS-i modules provide an open fieldbus solution enabling an easy connection between the PLC backplane and simple field I/O devices such as actuators, sensors, rotary encoders, analogue inputs and outputs, push buttons, and valve position sensors.
Meeting the demands of infotainment
Innovative circuit design is leading to more flexibility in power system design for automotive entertainment systems. By Nathan Hanagami, Design Engineer, Steve Knoth, Senior Product Marketing Engineer, & Marty Merchant, Applications Engineer, all from the Power Products Group of Linear Technology.
SATA eSSDs for use in tiered server storage systems
Available in capacities of 120GB, 240GB and 480GB, the new HK3R eSSDs signal an expansion of Toshiba's range of Enterprise-class SSDs. Designed for use in tiered server storage systems, the new eSSDs are ideal for use in read-intensive applications such as fast boot drives and for cache and error logging.
A blessing or a curse?
Examining the importance of industry standards in wireless communication applications. By Cees Links, CEO & Founder of GreenPeak Technologies.
Seamless in-car connectivity with Android devices
Broadcom is enabling seamless in-car connectivity with Android-powered devices thanks to its new Automotive Bluetooth software stack. Enabling automotive manufacturers to respond to new trends and reach the market more quickly, Broadcom's Android Automotive Bluetooth software ensures seamless, end-to-end interoperability between in-car applications and mobile Android devices.
A guide to DAS optimisation
The optimisation of an in-building distributed antenna system (DAS) can provide flexible network designs which right-size the solution to the requirement, while reducing costs. Moti Shalev, Director of Product Management at Axell Wireless, explores more in this ES Design magazine article.
New TI interface IC supports 3D resolution at 120fps
Texas Instruments is supporting the industry's highest screen resolution up to 4K2Kp60 with the new SN65DSI86 interface IC. Providing an MIPI DSI bridge between the graphics processor and embedded DisplayPort panel, the new interface IC features its dual MIPI DSI channels in a 20% smaller 5 mm x 5mm package. Offering greater design flexibility for space-constrained mobile applications, this makes the SN65DSI86 ideal for tablets, clamshell noteboo...
Bluetooth Smart SoC for wearable devices and the IoT
With the BCM20736 Bluetooth Smart system-on-a-chip, Broadcom has expanded its Wireless Internet Connectivity for Embedded Devices family. Addressing the rapidly growing market segments for wearables and the Internet of Things, the new BCM20736 WICED Smart chip supports A4WP wireless charging and enhanced data security modes.