Communications
Ethernet modules eliminate wiring errors
Designed to connect industrial controllers to I/O devices in harsh-duty environments, the Brad HarshIO IP67 Compact Ethernet Modules have been released by Molex. Measuring 30mm, the modules can be configured as inputs or outputs with M8 or M12 connectors, making them suitable for attaching sensing devices or actuators.
2U device provides over 30,000 channels of voice transcoding
Enabling communications service providers to add high density voice and video processing to their networks, a carrier grade media processing acceleration device has been released by Artesyn Embedded Technologies. While reducing power and space requirements, the SharpMedia 2U Platform allows service providers to meet consumers’ increasing demands.
CoM simplifies manufacture of dual interface cards
Designed for official documents, the Dual Interface CoM (Coil on Module) package technology has been released by Infineon Technologies. The manufacture of Dual Interface electronic identification cards, electronic drivers’ licenses or health insurance cards is simplified by the technology.
Panel PC can be embedded for advanced HMI
Panel PCs, which can be embedded in other equipment to provide an advanced HMI, have been introduced by BVM Group. The AFOLUX Gen III PanelPC family offers high-end computing capability and speed in compact, IP65 sealed rugged units. Featuring a 7“ HD 1024x600 projective capacitance screen supporting multi-touch functionality and landscape and portrait screen modes, the AFL3-W07A-BT is the first in the family to be released.
Bluetooth smart module works with or without host MCU
A full-featured, Bluetooth 4.1 compliant smart module that comes equipped with an integrated Bluetooth Low-Energy (BTLE) stack, onboard support for common SIG low-energy profiles is pre-loaded with Microchip’s Low-energy Data Profile (MLDP).The RN4020 Bluetooth Low- Energy Module builds on Microchip’s deep Bluetooth (BT) Classic experience.
CompactFlash card offers long-term availability
The use of the most reliable SLC NAND flash technology available plus integrated power fail safety guarantees data reliability in Swissbit’s C-300 Longevity, a CompactFlash card with long-term availability through to at least 2021. Its feature set includes an optimised random write speed and backward compatibility, making the card suitable for demanding applications in the telecommunications and networking market, as well as applications re...
SyncE solutions simplify complex clock trees
SyncE solutions, which include Synchronous Equipment Timing Sources (SETS) and 3rd gen Universal Frequency Translators (UFT), have been released by Integrated Device Technology. In single board or multi-board architectures with network interfaces operating at up to 100Gb/s, the devices support ITU-T G.8262 SyncE compliance.
COM extends the service life of expiring systems
Powered by the Intel Atom Processor E3800 SoC series, the ETX-BT COM has been released by ADLINK Technology. The processor provides a performance which is scalable from single core at 1.4GHz (Atom E3815) to a quad core at 1.9GHz (Atom E3845), as well as a single SODIMM socket for up to 4GB non-ECC 1333/1066 MHz DDR3L memory.
PLC modem targets smart metering
Smart metering applications will be the target for Renesas Electronics Europe’s new OFDM powerline modem, the second generation of its family of powerline communication (PLC) modem solutions. The new device, an orthogonal frequency division multiplexing (OFDM) solution offers broad-based support for multiple OFDM powerline standards such as G3 and PRIME.
Infotainment companion chip supports 4K multimedia
Supporting hi-res multimedia connectivity and camera devices with ethernet AVB standard, Toshiba has introduced the TC358791XBG automotive companion chip. The AEC-Q100 Grade 3 qualified chip, features differential CVBS interfaces for analogue composite video sources, support for early back-up camera view (CVBS to LVDS) and the ability to relay packetised IQ audio tuner data to the host via USB.