Communications
MCU core features sophisticated on-chip peripherals
Digital Core Design has introduced the D6811E IP Core, a redefined 8-bit MCU IP Core with highly sophisticated, on-chip peripheral capabilities, aimed at IoT sensors and beacons. Thanks to its binary compatibility with Motorola’s 68HC11 MCU, the core can be implemented in barcode readers, hotel card key writers, robotics, and various embedded systems.
SoC enables IoT developers to use SIGFOX’s two-way network
AXSEM’s AX8052F143 SoC, which integrates the company’s AX8052 MCU, has been certified SIGFOX Ready for two-way connectivity. AXSEM’s IC, library and development system enables IoT developers to use SIGFOX’s long-range, two-way wireless Internet-dedicated network with its lowest-power radio technology.
Bluetooth & NFC ICs target wearable healthcare
Supporting BLE communications and NFC Type 3 Tag functions, Toshiba Electronics Europe has launched a low power consumption, dual-function IC. The TC35670FTG is suitable for use in Bluetooth Smart devices including wearable healthcare devices, touch-and-start smartphone accessories, sensors and toys.
Motion controller delivers multi-axis distributed control
A line of motion controllers and EtherCAT masters, comprised of a powerful processor and two EtherCAT ports supporting ring topology, has been released by ACS Motion Control. Claimed to expand the capabilities of new and previously installed SPiiPlus controllers and EtherCAT masters, the SPiiPlusEC is high performing, yet economical.
ARM & TSMC announce 64bit ARM-based processors on 10FinFET
ARM and TSMC have announced a multi-year agreement that will deliver ARMv8-A processor IP optimised for TSMC 10FinFET process technology. Due to the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies to tape-out 10FinFET designs in late 2015.
AdvancedTCA carrier accepts any PCIe edge-type module
An AdvancedTCA carrier for one PCIe Gen 3 card has been released by VadaTech. The ATC121 features an Xeon E3-1268L V3 processor, quad-core at 2.3GHz or turbo frequency at 3.3GHz. To accept any standard PCIe edge-type module, the carrier has an x16 PCIe Gen 3 slot.
Module measures less than 2mm with solder paste
A 3A µModule step-down regulator, offered in an ultrathin 1.8mm profile LGA package with a 6.25x6.25mm footprint, has been released by Linear Technology. Measuring less than 2mm with solder paste, the LTM4623 meets the height restrictions of many PCIe and AMC for AdvancedTCA carrier cards in embedded computing systems.
Wireless APs aim to enhance scalability of backbone networks
In line with the increasing adoption of wireless equipment in industrial applications, ORing has launched a series of compact, cost-effective industrial wireless APs (Access Points). The APs aim to reduce cabling costs and enhance the scalability of backbone networks.
Realising the Smart City
RISC processors, rugged platforms and standardised software solutions are helping manufacturers meet the opportunity of a more connected world. By Aaron Su, Director Embedded Core Group, Advantech.
Fanless embedded system provides outstanding computing capability
EC200-BT is DFI’s first Intel Atom E3800 SoC processor-based fanless embedded system, designed to provide outstanding computing capability as well as low-power consumption. The black chassis is made of iron and is combined with a metallic grey aluminium alloy which has an anodic surface coating, providing a stylish and elegant aesthetic impact.