Communications
Switch ICs support transmission speeds up to PCIe Gen3
The TC7PCI3212MT and TC7PCI3215MT SPDT switch ICs, which support transmission of a signal speed up to PCIe Generation 3 (8Gb/s), have been released by Toshiba Electronics Europe.
Tracking assets with beacons
Unlike GPS and cellular mobile phone tracking, beacons can locate a position within decimeters, even inside a building, creating numerous application scenarios. By Bernd Hantsche, Marketing Director Wireless, Rutronik Elektronische Bauelemente.
Bringing communications to the factory floor
Communication continues to grow rapidly in the field of industrial and factory automation, as manufacturers seek to improve the capability, efficiency and flexibility of their systems and infrastructure. By Knut Dettmer, Principal Engineer, Smart Factory Marketing, Renesas Electronics Europe.
Beacons build on Bluetooth ubiquity
Bluetooth technology’s widespread adoption in mobiles gives it a major advantage in the burgeoning beacon sector says Geir Langeland, Director of Marketing & Sales, Nordic Semiconductor.
Delivering secure V2V communications
Secure hypervisors are key to delivering safe and intelligent vehicles. By Will Keegan, Technical Director, Software Security, Lynx Software Technologies.
Rotary joint saves space in Ka-band satellite communications
A dual-channel rotary joint, which reduces component count and saves space and weight in antennas are used for Ka-band high-data-rate satellite-on-the-move communication systems, has been released by Link Microtek. Particularly suitable for military or commercial airborne systems such as satcomm uplinks in unmanned aerial vehicles, the AM28RJD features a high-power/low-loss WR28 waveguide transmit channel and a coaxial receive channel.
56Gb/s SerDes targets next-gen switches & routers
Avago has demonstrated a 56Gb/s Pulse-Amplitude Modulation (PAM) 4 SerDes (Serialiser/Deserialiser) across copper backplanes and optical interconnects, targeting next-gen switches and routers. OEM customers are presently designing advanced ASIC SoC solutions in 28nm and 16FF+ process technologies, utilising the Avago PAM4 SerDes cores.
SBC operates at 5-10W thermal design power
A 4” SBC, which features low-power consumption at only 5-10W thermal design power, has been introduced by DFI. The BT253, which expands the company’s Intel Atom E3800 SoC product portfolio, features BGA 1170 packaging technology. LVDS, HDMI, VGA (standard) and DVI-I (optional) interfaces, with dual-independent display capability, enhance onboard graphics capabilities.
EV car charger solution features V2G communication
Microsemi and STMicroelectronics have contributed to the development of an EV car charger solution targeted at IoT system designers. Featuring V2G (Vehicle-to-Grid) communication and support for a wide range of network and application protocols,Tatung's module for EV supply equipment utilises Microsemi’s Le87501 PLC line driver and ST’s ST2100 STreamPlug SoC. The solution, which is supported by the OpenV2G software stack, also ut...
WiFi module enables photo & video capture nano platform
To provide secure, onboard WiFi technology for its ZANO nano drone, an aerial photography and HD video capture nano platform which allows users to capture and share photographs and video content instantly, Torquing Group has tapped Lantronix.