Communications

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Industry's first integrated chip for the virtual CPE market

Broadcom has announced what it claims is the industry's first fully integrated SoC for the virtual Customer Premise Equipment (vCPE) market. The BCM88312 integrated and programmable device can be seamlessly connected to the operator's network to deliver vCPE services. It is designed to provide carriers with flexibility to add new services in a dynamic, multi-vendor environment.
27th February 2015

Minimodules suit ICUs, M2M & IoT gateways

TQ has announced the TQMa7x (below image, left) and TQMa5xxx (below image, right), two Minimodules based on ARM Cortex-A7 and ARM Cortex-A15 processors. TQ has specifically selected this technology on a forward-looking basis, so that it can continue to support its customers with innovative ARM products.
26th February 2015

Rugged SBC provides performance & I/O versatility

Rugged SBC provides performance & I/O versatility
At Embedded World 2015, Diamond Systems unveiled its rugged, integrated ARIES PC/104-Plus SBC based on the Intel E3800 ‘Bay Trail’ processor family. Highlights of the Aries SBC include excellent CPU performance / power consumption ratio, high feature density in a compact size, integrated high-quality data acquisition, versatile I/O expansion and conduction cooling.
26th February 2015


SoC & FPGA combine to offer performance & low power

SoC & FPGA combine to offer performance & low power
Altera has announced its 2nd gen family of Arria 10 SoCs, the industry’s only programmable devices that combine ARM processors with a 20nm FPGA fabric. Arria 10 SoCs bring across-the-board improvements to enable higher performing, lower power, and more feature rich embedded systems compared to previous generation SoC FPGAs.
25th February 2015

microSD card meets US government computer security standards

microSD card meets US government computer security standards
Swissbit has expanded its PS-100u Security series of secure microSD storage cards with the PS-100u FE which is suitable to protect US governmental and enterprise mobile communication. An integrated smart card fulfils FIPS (Federal Information Processing Standard) 140-2 level 3, a US government computer security standard that is used to accredit cryptographic modules.
25th February 2015

2.5" HDD achieves world’s highest areal density

2.5" HDD achieves world’s highest areal density
Toshiba Electronics Europe has announced that is as achieved an areal density of one terabit per square inch within a 2.5" client HDD. This disk drive innovation delivers a 3TB capacity using a 750GB per platter in a 15mm 2.5" HDD and increases areal density over Toshiba’s prior generation of client HDDs by 40%.
25th February 2015

SD cards incorporate NFC & wireless for file sharing

SD cards incorporate NFC & wireless for file sharing
Toshiba Electronics Europe has introduced what it claims is the world's first SDHC memory card with built-in NFC and an improved version of the company’s popular FlashAir Wireless SD card. The NFC SDHC card allows users to preview card content and spare capacity with just the touch of a smartphone, while FlashAir III cards can serve as their own WLAN access point.
25th February 2015

EVE ICs support up to 800x600px for larger displays

EVE ICs support up to 800x600px for larger displays
FTDI Chip has expanded its Embedded Video Engine (EVE) portfolio for advanced HMI implementation with four ICs supporting higher maximum screen resolutions than previously possible. The FT81xQ series supports up to 800x600px, increasing from the 512x512px of the FT800Q/801Q series, in order to address the larger displays (7" and above) used in point-of-sales units, information kiosks, etc.
24th February 2015

Compact embedded module combines CPU & FPGA

Compact embedded module combines CPU & FPGA
DAVE Embedded Systems will unveil BORA Xpress, a Dual ARM Cortex-A9 + FPGA CPU module, based on the Xilinx Zynq XC7Z015/XC7Z030 application processor, from 24th to 26th February 2015 at Embedded World 2015, Nuremberg, hall 4, stand 481. BORA Xpress is suitable for applications such as medical instrumentation, advanced communication systems, critical real-time operations and safety.
24th February 2015

Contact smart card interface operates in 3V supply domain

NXP Semiconductors has announced the launch of a contact smart card interface, the TDA8037. Optimised for next-gen pay TV applications worldwide, the TDA8037 offers high levels of card protection, including short circuit detection and ESD protection. The ability of the TDA8037 to operate in a 3V supply domain suits it for situations where power efficiency and performance reliability are paramount.
23rd February 2015


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