Communications

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Bluetooth smart module works with or without host MCU

Bluetooth smart module works with or without host MCU
A full-featured, Bluetooth 4.1 compliant smart module that comes equipped with an integrated Bluetooth Low-Energy (BTLE) stack, onboard support for common SIG low-energy profiles is pre-loaded with Microchip’s Low-energy Data Profile (MLDP).The RN4020 Bluetooth Low- Energy Module builds on Microchip’s deep Bluetooth (BT) Classic experience.
27th October 2014

CompactFlash card offers long-term availability

The use of the most reliable SLC NAND flash technology available plus integrated power fail safety guarantees data reliability in Swissbit’s C-300 Longevity, a CompactFlash card with long-term availability through to at least 2021. Its feature set includes an optimised random write speed and backward compatibility, making the card suitable for demanding applications in the telecommunications and networking market, as well as applications requiring maximum longevity due to time-consuming and cost-intensive re-qualification processes.
27th October 2014

SyncE solutions simplify complex clock trees

SyncE solutions simplify complex clock trees
SyncE solutions, which include Synchronous Equipment Timing Sources (SETS) and 3rd gen Universal Frequency Translators (UFT), have been released by Integrated Device Technology. In single board or multi-board architectures with network interfaces operating at up to 100Gb/s, the devices support ITU-T G.8262 SyncE compliance.
27th October 2014


COM extends the service life of expiring systems

COM extends the service life of expiring systems
Powered by the Intel Atom Processor E3800 SoC series, the ETX-BT COM has been released by ADLINK Technology. The processor provides a performance which is scalable from single core at 1.4GHz (Atom E3815) to a quad core at 1.9GHz (Atom E3845), as well as a single SODIMM socket for up to 4GB non-ECC 1333/1066 MHz DDR3L memory.
27th October 2014

PLC modem targets smart metering

PLC modem targets smart metering
Smart metering applications will be the target for Renesas Electronics Europe’s new OFDM powerline modem, the second generation of its family of powerline communication (PLC) modem solutions. The new device, an orthogonal frequency division multiplexing (OFDM) solution offers broad-based support for multiple OFDM powerline standards such as G3 and PRIME.
26th October 2014

Server system can enable up to 4.0Tb/s aggregate bandwidth

Server system can enable up to 4.0Tb/s aggregate bandwidth
Claimed to be the industry’s most powerful AdvancedTCA (ATCA) open-standard server system, the Centellis 8840 has been released by Artesyn Embedded Technologies. The server system, which supports power and cooling for up to 600W per blade, features a 160G aggregate bandwidth capacity per blade today and will feature a 400G capacity in the future.
23rd October 2014

Secure element ICs enhance cloud services security

Designed for accessing consumer cloud services, FIDO U2F secure element ICs have been released by NXP Semiconductors. For secure sign-in, Google have recently announced support for FIDO U2F Security Keys. Offering online users secure login to cloud services such as email, shopping, financial and social sites from both their desktop and mobile devices, the FIDO U2F ecosystem consists of web browsers, applications, hardware authentication devices and authentication servers. 
23rd October 2014

5G library allows designers to jump start research

The 5G topic is gathering momentum and Keysight Technologies has put its shoulder to the wheel by introducing the Keysight EEsof EDA 5G Baseband Exploration Library. Providing ready-to-use reference signal processing intellectual property (IP) for 5G technology research, this industry-first library dramatically increases the productivity for system architects and baseband physical layer (PHY) designers.
21st October 2014

Chipset powers Gigabit performance over cable into home

Broadcom has introduced a new chipset that will enable operators and service providers to deliver Gigabit performance over currently installed twisted pair copper cabling. The BCM65200 DSP and BCM65900 analogue front end family of chipsets are a high density G.fast solution, providing a critical step in paving the path to Gigabit-speed services over copper to the home.
21st October 2014

Voice line termination chip uses 50% less stand-by power

Voice line termination chip uses 50% less stand-by power
Manufactured for customer premise equipment (CPE) designs, the DUSLIC XS next-gen voice line termination chip has been released by Lantiq. According to the company, the chip enables CPE manufacturers to use fewer external components than competing devices and reduces the cost for manufacturers to provide wideband-capable voice telephony. Compared to competing ICs, Lantiq claims that the chip uses 50% less stand-by power, at 20mW. 
21st October 2014


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