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Backplanes and Patchpanels
Molex Signs Amphenol as Second-Source for Backplane Interconnect Family
High density backplane connector family available from TTI
Headlines
CoWare and Agility Team to Accelerate the Simulation of Complex DSP Algorithms
TI's newest VoIP gateway solutions allow higher channel densities with improved voice quality
Mouser Electronics Expands Offering of Neutrik’s PowerCon Connectors
Toshiba SoC solutions support DS2 in developing low-cost powerline communications chipset for consumer market
Advanced Power Components has distribution agreement with Catalyst Semiconductor
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