Interconnect system eases installation in backplane applications
TTI is now selling Molex’s VITA 66.1 ruggedised optical MT backplane interconnect system enables simple installation and maintenance for rugged embedded VPX MIL/AERO backplane applications. The interconnect system targets high-density aerospace, defence and commercial embedded system applications and is fully compliant with the ANSI-ratified 66.1 specification.
The interconnects are based on an innovative MT ferrule-carrier design and reduce installation and maintenance time, plus associated costs, by enabling field servicing without requiring hand tools even in densely populated systems.
The optical MT interconnect system meets the defined requirements outlined by VITA 66.0 for blind mate fibre optic interconnects used with VITA 46 backplanes and plug-in modules. Available with 8, 12 or 24 fibres in standard single mode or multi mode and VersaBeam (expanded beam) MT ferrule options for design flexibility, the VITA 66.1 interconnects feature a robust aluminium housing to withstand extreme temperature ranges from -50 up to +105degrees Celsius, as well as shock and vibration environments.
The anodized aluminium-based housings provide a rugged solution for use in the designated VPX card space as determined by the standard, or can be used as a stand-alone solution outside of the VPX architecture.
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