Sullins Connector Solutions' New IDC Socket & Plug Series

Posted By : ES Admin
Sullins Connector Solutions, Inc extended their comprehensive portfolio of Insulation Displacement Connectors to include the 0.100” (2.54 mm) contact centerline SFH IDC Series Socket and SIP IDC Series DIP Plugs. The new precision-engineered devices, along with Sullins’ 0.050” (1.27 mm) and 0.079” (2.00 mm) pitch IDC sockets, provide OEMs and ODMs with an easy and inexpensive solution to reduce the time and applied costs of wiring installations. The SFH devices simply and quickly mass terminate single-layer, 0.050” (1.27 mm) 28 AWG flat ribbon cable in one step. Sockets may be ordered with strain relief to promote long life and with polarizing keys to ensure proper mating alignment. The sockets mate with Sullins’ SBH11 Series Box Headers, as well as most other 0.100” pitch IDC box headers.
Specifically designed to ensure durable board-to-cable interconnections in high-reliability, low-power applications, Sullins’ IDC devices are well suited for a wide array of high-density, space-constrained consumer, commercial and industrial equipment. They are commonly employed in household appliances, HVAC equipment, gasoline pumps, and vending machines as well as in telecom and datacom applications.

The IDC devices have a current rating of 1 A per contact, and are offered in 3/6 through 32/64 dual positions. Parts’ materials are UL94V-0 rated, and are supplied with glass-filled polyester insulator material and phosphor bronze contacts. Additional specifications include a dielectric voltage of 500 VAC, and a maximum contact resistance of 30 milliohms. Offered with a broad choice of plating options, customers may choose from gold flash overall, gold flash on contact with 50 microinch nickel on termination, 15 microinch gold on contact with either gold flash or 50 microinch nickel on termination, or with 100 microinch overall matte tin. Operating temperature is -40 degrees C to +105 degrees C. Plugs are provided with straight or kinked solder tails to further support design flexibility.

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