Cables/Connecting

SO-DIMM sockets suited for consumer & medical electronics

11th March 2014
Staff Reporter
0

With the CN111S and CN112S series, Yamaichi is bringing socket versions for DDR2 and DDR3 SO-DIMM memory modules to the market. With these two new series, Yamaichi is expanding its large family of production use and Test & Burn-in sockets. 

The two new sockets are for production usage. The CN111S socket was developed especially for modules that meet the DDR2 (Double Data Rate) standard in the SO-DIMM version (Small Outline Dual Inline Memory Module). It is a 200 pin 1.8V version with an installation height of 5.2 mm. The contacts are gold-plated as standard.

The counterpart to the memory chip module available on the market since 2010 that meets the DDR3 standard is Yamaichi's CN112S series. Equipped with 204 gold-plated contacts (1.5V) and a low installation height of 5.2 mm, the CN112S also meets the requirements of the SO-DIMM classification.

Both series are particularly remarkable due to their contact design. It proved possible to strike a balance between optimum engaging forces and high contact forces. This ensures that the contacts always make a stable connection to the module. The design also ensures that the contact force is continuous even in environments that include dust or contamination.

The module is reliably inserted by means of two lateral rails that support and guide it. Both the CN111S and the CN112S have been developed and tested in accordance with the JEDEC standard. Both versions were developed for processing on the surface of the PCB. Installation can be as simple as removing them from the T&R and SMT soldering.

Due to their low installation height, the CN111S and CN112S are perfect for applications in notebooks in a wide variety of markets, like consumer electronics, medical technology and even the industrial PC sector. Both new series provide high quality at an attractive price.

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