Cables/Connecting

Molex and OIF members showcase High-Speed Interconnect Solutions at ECOC 2012

13th September 2012
ES Admin
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Molex and other Optical Internetworking Forum members will join in showcasing 100Gb/s interconnect speeds at the OIF interoperability live demonstrations during the ECOC 2012 Exhibition being held September 17-19 at the RAI Convention Centre in Amsterdam, The Netherlands. ECOC Exhibition is the largest European optical communications event for professionals in the fibre optic technology industry.
Two of the ECOC demonstrations showcase Molex zQSFP+ interconnects – the world’s first QSFP-based interconnects to achieve data rates in excess of 100Gb/s – operating in the demonstrations at up to 25.78Gb/s per lane. Supporting OIF’s CEI-28G-VSR interfaces, 100Gb/s Ethernet and 100Gb/s Inifiniband Enhanced Data Rate applications, the zQSFP+ Active Optical Cable and zQSFP+ electrical interconnects transmit rates up to 4km with excellent cooling, unparalleled signal integrity, superior EMI protection and the lowest power consumption in the optical industry.

“By successfully demonstrating interoperability of a high-speed multi-channel system, Molex and its OIF partners help pave the way for next-generation, high-speed connectivity,” said Scott Sommers, group product manager, Molex. “This is a critical step in meeting the high-performance needs of future bandwidth-intensive communications systems.”

As host of the exhibition’s multi-vendor demonstrations, OIF marks the initial European demonstration of the 28Gb/s interconnects with retimers and a Molex zQSFP+ Active Optical Cable. Live demonstrations will operate continuously while the show is open. The OIF physical and link layer interoperability demonstrations featuring the Molex zQSFP+ and Active Optical Cable and other OIF partner technologies are scheduled at OIF booth #269 during ECOC 2012 exhibition hours.

Tom Marrapode, fibre optics global marketing director, Sommers and other Molex industry experts will be on hand at OIF booth demonstrations and during exhibit hours at the ECOC 2012 Molex booth #512 to discuss the company’s comprehensive portfolio of industry-leading, end-to-end high-speed interconnect solutions designed for next-generation applications.

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