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Dynamic 3D online modelling from ITT Interconnect Solutions unleashes creativity in connector design

15th September 2010

ES Admin

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ITT Interconnect Solutions has announced a new capability on its website which allows design engineers to dynamically create virtual 3D connector models, even designs which have yet to be manufactured. This new online facility builds on ITT ICS’s existing web-based configurator technology and unique single field search to enable users to utilize a single interface to search for ITT ICS’s industrial, commercial, Military-Specified, and Hi-Rel products. Design engineers are able to select from various output model formats, provided the requested product represents a standard configured item. There are hundreds of thousands of available configurable parts in the ICS online system servicing a wide range of requirements from hi-rel military equipment to space applications and medical products. The new 3D modelling capability is currently available for ITT ICS 38999 Series III connectors with further product lines being added on an ongoing basis.

The service is available to registered users of the ITT Cannon website at www.ittcannon.com. Registration is free and only takes a few minutes. Once signed into the site, customers may directly query their requested standard product using the single search field capability. Within the summarized output, registered users may directly request the generation of a 3D solid model. A number of industry-standard formats are available. The downloadable file is obtained via a system supplied e-mail link. The customer simply clicks through the link to download the design package as a .zip file, which is then easily imported into their own CAD system for prototyping in products.

Keith Teichmann, Global Marketing Director at ITT ICS comments: “This new 3D web-based modelling makes the task of design engineers easier and allows them to import different fully-assembled connector solutions straight into prototype designs, giving them the flexibility to try out different solutions. It should help speed selection of the optimum interconnect and therefore reduce time to market for new products.”