Connectors enable high power PCBs with a small footprint
Enabling single point power delivery of 150, 200 and 300A in less than one linear inch of a PCB edge, the RadFin power connectors have been released by Amphenol Industrial Products Group. To meet the demand for high power PCBs with a small footprint, the connectors utilise RADSOK contact technology.
The connectors, which enable a variety of layout choices, are suitable for data centre equipment manufacturers and power supply manufacturers, as well as in energy storage systems. The heat dissipating design of the RadFin connectors helps to dramatically reduce T-rise, with minimal air-flow required.
The connectors are offered in right angle mating planes as single-point contact terminals, making them particularly suitable when component placement is crucial. Compared to traditional power connectors, the RadFin connectors are claimed to provide superior current density.
Configured for board-to-board, wire-to-board or busbar-to-board mounting, the connectors are available in solder tail, complaint pin and screw attach, and mates with 6, 8 and 10mm diameter pins.
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APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
