Cables/Connecting
A reliable coax connection even in challenging environments
Harwin announces a range of standard layout, multiport coaxial Datamate connectors with 6GHz, 50Ω contacts, suitable for RG178 cables in high reliability applications. The ganged connectors are available from stock with two, four, six or eight contacts.
Discrete insulated spring-loaded pins feature insulator sleeve
Due to customers’ demand, Mill-Max has expanded its line of discrete insulated spring-loaded pins. Its original 807 series are SMT insulated pins in seven heights from 0.100 to 0.236” with working travel from 0.012 to 0.0275”. The SMT pins, 0907 series, are available in ten heights from 0.255 to 0.430” with a working travel of 0.0275”.
DSEI 2015: High speed connector enables minimal RF noise
A rugged high speed connector has been added to its D-Sub Series by Smiths Connectors. This line of high-impedance connectors is offered with 150ohm Quadrax contacts. It has been designed to ground the outer shield Quadrax directly to the shell of the connector, providing minimal RF noise, a compelling differentiator amongst D-Sub products.
DSEI 2015: Connector covers hi-rel SATA applications
An innovative SATA (Serial Advanced Technology Attachment) solution will be showcased at DSEI 2015 by Smiths Connectors. The Nebula Series is a highly reliable SATA 6.0 Gbps connector for high-speed data rates with 100ohm impedance matching and minimal losses. The connector utilises the industry standard PCB soldering footprint ensuring no need for change or modification of SATA drive layouts.
Connector system delivers 50% space savings for car makers
The new Mini50 Unsealed Connector System from Molex is now available in Europe at TTI. Designed to meet the demand for smaller interconnects from car manufacturers, the Molex Mini50 has smaller terminals to fit more signals into vehicle interiors and delivers 50% space savings over traditional USCAR 0.64mm connectors. It is approved as the industry’s only USCAR 050 interface.
HSMC & FMC connectivity options suit FPGA-based designs
To encourage the use of its easy-to-implement next gen USB interfacing technology, FTDI Chip has unveiled a family of evaluation/development modules. The company’s FT600/1Q USB 3.0 SuperSpeed ICs, which are already in full volume production, are backed up by the UMFT60XX offering. This module family is made of 4 models, which provide different FIFO bus interfaces and data bit widths.
Connectors are 'fastest & easiest' to install
Switchcraft has expanded its innovative AAA series XLR and Tini-QG Mini-XLR connectors, adding white as a colour option in addition to the existing black and nickel. The AAA series represents nearly 70 years of experience making XLR connectors and with no screws and only two pieces to assemble it is the fastest and easiest to install connector available. Already a favorite of the lighting industry, the white option opens new possibilities.
IDC connectors expand Harwin's 1.27mm pitch family
Harwin is expanding its’ popular 1.27mm pitch Archer M50 portfolio with the addition of new IDC connectors. The Archer family is distinguished in three ways: price, parts are several percentage points more cost-effective than the competition; instant availability, devices are stocked in depth for immediate dispatch at Harwin and its distribution channel; and reliability and high quality.
You were made for me?
Connectors come in all shapes and sizes depending on environment and application. There are literally thousands of options, sometimes for the same job. Inevitably, this can cause a lot of confusion. To make sure you find the best product for every job, there are a few questions you might want to ask yourself before making a purchase. Here Amy Wells, Business Development Manager, Electroustic, poses the questions you need to be asking when specify...
Connector and cable assemblies free up PCB space
Connector and cable assemblies from TE Connectivity which offer a footprint that is up to 50 percent smaller than current SFP+ interconnects are in stock at Mouser Electronics. The assemblies help designers increase faceplate density while freeing additional PCB space. The products’ designs have been enhanced to improve signal routing, minimise electromagnetic interference (EMI), and optimise automated manufacturing processes.