X-ES Unveils Convection-Cooled Sub-½ ATR Box for Rugged Military Applications

Both 3U CompactPCI and 3U VPX backplanes are supported by the XPand5200. Meeting the rigorous MIL-STD-810 standards, the XPand5200 is a sub-½ ATR solution for deployed systems in the harshest environments.



The XPand5200 features include:

• ½ ATR natural convection-cooled and conduction-cooled chassis (reduced height and length)

• Four conduction-cooled 0.8-inch slots

• Physical dimensions of 4.88 in. (W), 5.65 in. (H), 10.30 in. (L)

• 3U VPX and cPCI backplanes available

• Up to three D38999 front panel I/O connectors (configurable)

• Integrated MIL-STD-704-compliant, 28V DC power supply

• MIL-STD-461 E/F EMI filtering

• Optional internal holdup of up to 100 ms at 70 W

• Foldable front panel handle

• Environmentally sealed

• Integration services with third-party modules available



The XPand5200 rounds out X-ES’s sub-1/2 ATR systems for 3U conduction-cooled payload modules to provide customers with a full range of rugged systems deployed in harsh environments:

• Conduction-cooled XPand3200: 4.88 in. (W), 5.62 in. (H), 8.75 in. (L)

• Forced air-cooled XPand4200: 4.88 in (W), 6.0 in (H), 13.5 in (L)

• Convection-cooled XPand5200: 4.88 in. (W), 5.65 in. (H), 10.30 in. (L)



“We have seen demand for XPand5200-based systems as rugged Network Attached Storage (NAS) appliances; since solid state storage generates very little heat, it is well suited to natural convection-cooling,” states Bret Farnum, VP Sales. “We can provide a total of 3.5 TB of solid state Network Attached Storage in our XPand5200 populated with an Intel or Freescale SBC.”