Optimized COM Express Cooling Solutions allow 60°C Ambient Temperature

The passive cooling solution is designed for applications with sufficient airflow around the computer-on-module, for example, by an internal system fan. The aluminum heat sinks are available in various heights and in sizes of 125mm x 95mm for the CXB-GM45 module family and with dimensions of 95mm x 95mm for the more compact CXC-GS45 modules. If there is a need for active cooling, various fan kits for mounting on the heat sinks are available. In this case, an 80mm x 80mm fan is offered for the CXB-GM45 modules and fans with dimensions of 70mm x 70mm are used for the smaller CXC-GS45 modules.

Furthermore, MSC provides heat spreaders with dimensions of 95mm x 95mm for the CXC-GS45 COM Express™ modules. These heat spreaders have a direct thermal contact to the components with the highest power dissipation.

Depending on the customer’s requirements, MSC ships the powerful CXB-GM45 and CXC-GS45 COM Express™ modules with different single and dual core 45nm processor types. Full desktop computing performance can be achieved with the CXB-GM45 module based on the Intel® Core™ 2 Duo CPU T9400 with 2.53GHz and 1066MHz front side bus. The dual channel DDR3 memory (two SO-DIMM sockets) with a total capacity of up to 8 GB provides high computing performance and low power consumption on this COM Express™ board. The Intel® GM45 chipset integrates the 4500MHD Mobile Intel® Graphics Media Accelerator with Intel® Clear Video Technology supporting DirectX10 and OpenGL 2.0. The Intel® GS45 small form factor chipset used on the CXC-GS45 modules consists of the Graphics and Memory Controller Hub (GMCH) and Intel® Enhanced I/O Controller Hub (ICH9-M) can drive two displays with a maximum resolution of 2048 x 1536 pixels.