Miniature enclosures optimised for USB interconnect

20th June 2016
Source: Hammond
Posted By : Nat Bowers
Miniature enclosures optimised for USB interconnect

When USB3.0 was introduced, offering theoretical data signalling rates of 5Gb/s compared with the 480Mb/s available from USB2.0, the protocol became significantly more useful across a variety of applications. The latest standard to be published, USB3.1, further increases performance to 10Gb/s and reduces line encoding overhead.

All varieties use a Type A standard plug as the interface to the host machine. To house small PCBs using USB as the external power and signal interconnect, Hammond Electronics has extended its popular 1551 miniature family with three new sizes: 35, 50 or 65mm long, 20, 25 or 30mm wide, respectively, all 15.5mm high. The sizes have been chosen after customer consultation to provide prototype builders and small volume OEMs generous room for their PCB.

The 1551USB IP54 ABS enclosures are a traditional lid and base design. All versions feature a dedicated cut-out for a standard USB Type A plug in one end and have a recess in the lid for an inlay, label or HMI keypad. The two smaller units have two PCB standoffs moulded into the base; the largest one has four.

Each size is available in five colours with a satin texture finish as standard: RAL 9011 black, RAL 7035 grey, translucent clear, translucent smoke and translucent red. Custom colours can be supplied and, to reduce time-to-market and modification costs, all 1551USB enclosures are available factory modified with machining and silk screening to the user’s specification. To help with the design process, AutoCAD and PDF dimensioned drawings are available on Hammond's website.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPS IPC Drives 2017
28th November 2017
Germany Nuremberg
Cyber Security - Oil, Gas, Power 2017
29th November 2017
United Kingdom London
AI Tech World
29th November 2017
United Kingdom Olymipa, London
Maker Faire 2017
1st December 2017
Italy Rome
Virtual & Augmented Reality Creative Summit 2017
5th December 2017
United Kingdom Picturehouse Central, London