Heatsink material reduces footprint & increases efficiency
A range of low profile, air cooled heat sinks has been introduced by Versarien Technologies. The heat sinks feature the company’s VersarienCu material, a copper foam which features fine, open, interconnected pores that emulate structures commonly found in nature. These pores increase the surface area of the heat sinks, which allows them to be reduced in size and provide an improved thermal performance.
The copper foam is coated with a thin, hard layer of high temperature copper oxide, which improves its emissivity and therefore further improves heat sink thermal performance. The material, which is the result of metallurgy research at the University of Liverpool’s Department of Engineering, allows the heat sinks to provide a thermal efficiency of up to 6ºC/W cooler than competing devices. This increased efficiency allows the heat sinks to be air cooled rather than fan cooled and increases the lifespan of components by reducing overheating.
Suitable applications include power ICs, high temperature components and transistors, STBs, AP routers, cable modems, optical networks, LED TVs and flat panel displays.
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APV1111GVY
Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
