New extruded SMD Heatsinks give 3x the cooling capability
Ohmite has added two new extrusion forms to their popular DA/DV line of SMD heatsinks to provide customers with even more flexibility. Now offered in three extrusion forms and two surface finishes, this product family is designed to provide cooling for TO-252, TO-263, and TO-268 devices.
One drawback of the original heatsink design was the need to fix Kapton Tape on the top to facilitate its use with pick and place equipment. The tape was then removed after soldering, a timewasting, costly operation
The two new Ohmite extrusions do not require Kapton Tape as a flat area has been designed into the top centre of each heatsink to provide an easy surface to grip. Then, rather than losing the surface area provided by these missing fins, the new designs have inverted fins on the underside of the heatsink, thereby maintaining the surface area for heat dissipation.
Protecting and extending the life of costly active devices is highly dependent on maintaining a low baseplate temperature and unlike simple, stamped out aluminum heatsinks which are often used for this application, the extruded Ohmite DA/DV Series can provide up to three times the cooling capability of similar parts. The heatsinks are provided in 250 piece reels or in 10 piece packs.
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Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
