Cabinets/Enclosures

Displaying 1 - 974 of 974

Matrix trays safely & securely contain components

Matrix trays safely & securely contain components
R.H. Murphy's RAPIDTRAY custom manufactured JEDEC matrix outline trays provide safe, secure containment of ICs, modules, sensors, MEMS, switches and connectors, without the cost or lead time for tooling. RAPIDTRAY component trays offer ESD and mechanical protection in an industry standard format. Precision injection moulding and CNC machining combine to create custom designs without tooling.
26th March 2015

Rack solution targets branch & remote IT locations

A pre-engineered integrated rack solution designed for deployment at the edge of IT networks and remote locations has been introduced by Emerson Network Power. The SmartCabinet is a compact, rapidly deployable solution, which supports local data storage and processing in a single-cabinet unified infrastructure that provides secure remote monitoring and manageability.
26th March 2015

Designer suspension arm is elegant & ergonomic

Designer suspension arm is elegant & ergonomic
ROLEC has unveiled its latest range of profiPLUS designer suspension arms. Elegant and ergonomic, the profiPLUS modular system offers a huge range of couplings, joints and sections to create the suitable suspension arm solution. ROLEC profiPLUS is quick and easy to install, either vertically, horizontally or on the floor. It offers alignment of the complete system in a horizontal direction through a single set screw. ROLEC has applied for a patent for this clever solution.
25th March 2015


Digital printing services offered for front panels & enclosures

Digital printing services offered for front panels & enclosures
OKW’s metal enclosures division, METCASE, is pioneering the use of digital printing for front panels, rack cases and instrument housings, saving customers time and money. METCASE’s new state of the art digital technology means legends, logos and complex photo quality graphics can be printed on front panels and enclosures quickly and easily.
25th March 2015

Energy-efficient enclosure cooling in dusty environments

Energy-efficient enclosure cooling in dusty environments
  Rittal has recently claimed that air-to-air heat exchangers are highly effective at lowering the temperature inside enclosures in cool environments. They are cost-effective and energy efficient while also being well suited to dirty or dusty settings, unlike traditional fan-and-filter units.
24th March 2015

Whitepaper explores data security & vehicle technologies

Whitepaper explores data security & vehicle technologies
Andy Billingham, MD, EMKA, has written a whitepaper which discusses how a range of advanced technologies have come together under the EMKA umbrella to meet the needs of applications such as data security and vehicle manufacturers – which nonetheless share many common areas of background expertise.
20th March 2015

TO suits thermoelectrically cooled 10Gb/s laser diodes

TO suits thermoelectrically cooled 10Gb/s laser diodes
SCHOTT has expanded its design portfolio of TO packages for the 10Gb/s range to suit high-frequency, actively cooled applications. SCHOTT's latest TEC TO package enables the development of high-speed data transfer in the telecomms and datacomms markets and suits 10Gb/s laser diodes that require a ThermoElectric Cooler (TEC), enabling its application in middle to long distances.
16th March 2015

Loop heat pipe cools mobile devices with capillary action

Fujitsu has announced the development of the world's first thin cooling device designed for small, thin electronic devices. Smartphones, tablets, and other similar mobile devices are increasingly multifunctional and fast. These spec improvements, however, have increased heat generated from internal components, and the overheating of localised parts in devices has become problematic.
13th March 2015

x86 building block system copes with environmental extremes

x86 building block system copes with environmental extremes
Rugged computing is a must for IoT, M2M and Big Data applications deployed in extreme environmental conditions, but hardly any embedded hardware is equipped to operate underwater, or in temperatures of -60°C, let alone -100°C. To enable passively cooled hardware to operate in such extreme environments, ICOP Technology has developed the ICE Box.
13th March 2015

Zipper fin heat sinks offer lightweight performance

Zipper fin heat sinks offer lightweight performance
Advanced Thermal Solutions' Zipper Fin heat sinks protect components from the dangers of excess heat, at low cost. Zipper fins are machined from thin sheet metal, typically aluminium or copper, and are formed into custom shapes. The sheets are designed to interlock with a narrow space between their layers. The fin assembly is wave soldered to a metal base, forming a rigid, light heat sink.
11th March 2015


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