congatec has welcomed the PICMG release of the COM Express 3.0 specification. The revision 3.0 of the specification formally integrates the new Type 7 pinout type which is the basis for congatec's Server-on-Modules. The official release fires the starting shot for the race to a new generation of server designs based on standardised Server-on-Modules.
The company claims that these products enable the most cost efficient server designs and performance upgrades across all existing and upcoming generations of server class processors and sockets from any vendor. Modular server designs can be started instantly as modules, carrier boards, starter kits, design guides and circuit schematics are readily available.
"Server farms need constant upgrades to improve the performance and energy efficiency per rack. With the new Server-on-Modules, operators can execute these upgrades by simply exchanging standardised modules instead of complete and costly server boards or even rack systems," explained Christian Eder, Editor of the PICMG COM Express 3.0 specification and Marketing Director at congatec.
Server-on-Modules are also a suitable fit for all the various embedded and IoT server designs in harsh industrial environments where space is restricted and dedicated high-bandwidth interfaces are essential to connect the various controls in the industry 4.0 fields. Here, Server-on-Modules can improve design efficiency. This is of major significance for embedded design engineers as recent studies report that they are facing the challenge to constantly manage more projects within a given or even shorter time frame, leading to massive time pressure for executing each project. Server-on-Modules can deliver the vital design efficiency improvements by providing an application ready server core instead of only a hand full of individual components.
COM Express Type 7 Server-on-Modules, carrier boards and starter kits can be requested by customers for the evaluation of the new generation of modules. congatec's recent Server-on-Module designs offer server-grade performance and functionality with their Intel Xeon D processors, 2x 10 GbE and 32 PCIe lanes. The latter can be used for powerful intrasystem expansions such as GPGUs and NVMe based ultra-fast storage devices as well as multi-module configurations on one single carrier board for high performance computing designs.