Boards/Backplanes

Mini ITX boards based on the AMD Embedded G-series SoC

8th March 2016
Nat Bowers
0

Expanding its D3313-S Mini-ITX board family, Fujitsu has announced that sixth version of the board is equipped with a powerful Quadcore SoC with 2.4GHz. The D3313-S6 is particularly suitable for use with graphics-intensive applications, for example in the field of digital signage and medical technology. As an industrial motherboard the product is designed for 24/7 continuous operation and an extended temperature range from 0 to +60°C.

The configurable TDP allows adjustment of the power consumption to 15 or 25W. The same boards can be used in different system and environment requirements with active or passive cooling: a change to a different variant is not necessary. As with the D3313-S4 and D3313-S5 the boost mode is available in the new version. It can increase the frequency of SoCs dynamically and also includes environmental variables such as temperature and adjusted TDP.

The family includes the first models with three different APUs based on the AMD Embedded G-series processors, codenamed “eKabini”, as well as the boards with the powerful but energy-economical simultaneously SOCs codenamed “Steppe Eagle”. This product portfolio provides a comprehensive platform for the most diverse requirements in terms of power consumption, CPU and graphics performance. The advantage of the SoC lies in the increased computing power at low energy consumption. Little power consumption also means low heat generation; therefore, the D3313-S can also be used in fanless systems. Since the error-prone mechanism of a fan is missing, the embedded system is not only quieter, but also more reliable.

Fujitsu offers an extensive range of accessories with a kit solution for all models of the D3313-S. These include housing, riser cards for expansion cards, Trusted Platform Module (TPM 1.2) by Infineon, a wall mounting kit, feet and various cables. There are also three cooling solutions for various application scenarios available: a passive heatsink for TDP-values of up to 10W, a passive heatpipe cooler for TDP-values of up to 15W and an active cooler with PWM fan control and monitoring for TDP values up to 25W. The D3313-S6 can be cooled with the active and the passive solution. All parts of the kit solution are CE and FCCB certified and climate-tested. This enables customers to easily assemble application-specific systems cost-effectively.

Peter Hoser, Sales Director, OEM, Fujitsu, commented: “The D3313-S is an attractive solution for industrial customers due to its wide range of applications. The Embedded G-series SoCs provide as a single chip solution extensive functions for graphical representation. The R5E Graphics itself is more powerful compared to the first models of this board. In addition, the AMD Eyefinity Support allows to merge multiple monitors to a single picture (Single Large Surface, SLS). By that the board is predestined for the use in digital signage.”

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier