The boards utilize a common 50mm footprint for both the LuxiGen LZC 12 die and LZP 24 die series of high flux density emitters, helping OEMs to standardize fixture designs around a single form factor. The low thermal resistance MCPCBs mean that heat is effectively conducted away from the LEDs, so that the emitters can be driven up to 1000mA / die to maximize flux density without adversely affecting operating life or reliability. The boards feature mounting holes for LuxiGen TIR lens-holder legs for easy integration with secondary optics. There are mounting-screw cutouts to facilitate easy attachment of a heatsink, further simplifying the assembly process. The boards include one connector for the LED and one for an on-board thermistor to be used with common constant current sources with thermal feedback option.
Materials and components are selected to meet UL requirements.