High density backplane connector family available from TTI

2nd January 2008
News Release from: TTI Inc.
Written by : ES Admin
High density backplane connector family available from TTI
TTI, Inc has announced the Tyco Z-PACK TinMan Backplane Connector family, a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.
Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Featuring the reliable, redundant contact design on every single contact and with 10+ Gb/s performance, the connector range has 100Ω impedance for differential pair configuration, and several versions meeting standard card slot pitches. The Z Pack TinMan modular system in various column versions, right angle pin header (coplanar -3, -4, -5 pair) and vertical receptacles (parallel port -4 pair) has sequencing for ground and signal contacts, and is RoHS compliant.

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