High density backplane connector family available from TTI

2nd January 2008
Source: TTI Inc.
Posted By : ES Admin
High density backplane connector family available from TTI
TTI, Inc has announced the Tyco Z-PACK TinMan Backplane Connector family, a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.
Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Featuring the reliable, redundant contact design on every single contact and with 10+ Gb/s performance, the connector range has 100Ω impedance for differential pair configuration, and several versions meeting standard card slot pitches. The Z Pack TinMan modular system in various column versions, right angle pin header (coplanar -3, -4, -5 pair) and vertical receptacles (parallel port -4 pair) has sequencing for ground and signal contacts, and is RoHS compliant.

You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Mobile World Congress 2017
27th February 2017
Spain Fira Gran Via and Fira Montjuïc
Wearable Technology Show 2017
7th March 2017
United Kingdom ExCel, London
embedded world 2017
14th March 2017
Germany Nürnberg Messe
electronica China 2017
14th March 2017
China Shanghai New International Expo Centre
Southern Manufacturing
21st March 2017
United Kingdom FIVE, Farnborough