Boards/Backplanes

COM Express module boasts improved graphics capability

29th July 2015
Mick Elliott
0

A first COM Express Basic Size Type 6 module incorporating the latest Intel Xeon E3-1200 processor and Intel Core i7 processor (formerly codenamed “Broadwell”) with Intel QM87 Chipset has been launched by Adlink Technology. It features improved graphics and processing performance compared to previous generation processors.

The module is suited for carrier-grade edge device solutions that demand intense graphics performance and multitasking capabilities in a space-constrained environment, such as industrial cloud and media servers performing real-time video transcoding for Content Delivery Networks (CDNs), Network Functions Virtualisation (NFV), and medical imaging applications.

Video-on-demand streaming services can leverage the transcoding capabilities of the Express-BL for on-the-fly compression of video streams to reduce data transfer costs and provide users with the best resolution for their viewing devices (e.g. 240p, 360p, 480p, 720p, 1080p). Intel Media SDK and OpenCL provide system developers with the necessary tools to implement these streaming solutions.

In ultra-high resolution ultrasound systems requiring intensive 3D imaging calculations, the module can utilise its integrated GPU as a coprocessor with the use of an OpenCL software layer. The Intel Xeon processor with Iris Pro Graphics 6300 feature set avoids the need for a discrete coprocessor, reducing complexity and cost.

The ADLINK module supports up to 32GB of dual channel DDR3L memory at 1600MHz and features Intel Iris Pro Graphics 6300 integrated in the processor (dependent on the processor selected).

It provides three DDI channels, as well as LVDS and VGA display outputs, enabling it to support up to three independent displays at 4K resolution and drive multiple HD screens without the need for a discrete graphics card. In addition, Embedded DisplayPort (eDP) is optionally available to support next generation displays.

The Express-BL also provides rich, high-bandwidth I/O, including one PCI Express x16, seven PCI Express x1, Gigabit Ethernet, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0. A wide range of operating systems is supported, including Linux, Windows 7 and 8.1 Update, Windows Embedded Standard 7, Windows Embedded 8.1 Industry and VxWorks. In addition, the Express-BL is available in an Extreme Rugged version featuring an operating temperature range of -40°C to +85°C.

The module is equipped with ADLINK’s Smart Embedded Management Agent (SEMA) to provide access to detailed system activities at the device level, including temperature, voltage, power consumption and other key information, and allows operators to identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime.

ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud solution to enable remote monitoring, autonomous status analysis, custom data collection and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available from any place, at any time via encrypted data connection.

 

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