Boards/Backplanes

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Raspberry Pi dives deeper into embedded design

Raspberry Pi dives deeper into embedded design
Three new products – Raspberry Pi Compute Module 3, Raspberry Pi Compute Module Lite and Raspberry Pi Compute Module Development kit have been launched by Farnell element14. The Raspberry Pi Compute Module 3 (CM3) and Compute Module 3 Lite (CM3L) are DDR2-SODIMM-mechanically-compatible System on Modules (SoMs) containing processor, memory, eMMC Flash (CM3 only) and support power circuitry.
16th January 2017

'Level up' faster with next-gen motherboards

'Level up' faster with next-gen motherboards
The full line-up for BIOSTAR's 2nd-gen RACING series motherboards has been announced, featuring support for Intel’s 7th-gen Core processors. Following the announcement last week of the RACING Z270GT9, BIOSTAR has now announced the different level products of the new RACING series family.
16th January 2017

Raspberry Pi adds embedded design ingredient

Raspberry Pi adds embedded design ingredient
Seen at its launch as an educational tool, Raspberry Pi is now flexing its muscles in the industrial arena and today (January 16) added extra punch with the launch of the Raspberry Pi 3 Compute Module aimed at embedded systems designers. It is available now at RS Components in Europe and Asia/Pacific and Allied Electronics in the Americas.
15th January 2017


Micro-ATX suits self-service applications

Micro-ATX suits self-service applications
Advantech introduces AIMB-505, a vertical domain Micro-ATX motherboard based on the Intel H110 chipset supporting the latest 6th generation Intel Core I /Pentium/Celeron processors. Providing high computing and graphic performance and rich expansion capability, AIMB-505 is an ideal platform for a multitude of applications in self-service, kiosks, control centers, automatic device centers and much more.
11th January 2017

Embedded board features 7th generation Intel Core processor

Embedded board features 7th generation Intel Core processor
Axiomtek has launched the CAPA500, its 3.5” embedded board featuring the LGA1151 socket 7th generation Intel Core processor family (codename: Kaby Lake) with 35W TDP (Thermal Design Power), as well as the Intel H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-1867 SO-DIMM with a memory capacity up to 16GB for extensive storage.
10th January 2017

I/O rich motherboard suitable for graphics rich environments

I/O rich motherboard suitable for graphics rich environments
BVM Limited's range of Mini-ITX motherboards has increased with the addition of the KINO-AQ170. It supports Intel’s 6th generation Skylake 14nm Core i7/i5/3, Pentium and Celeron processors, which offer enhanced performance at the lowest power levels ever, delivering up to two and a half times better computing performance than previous generations, according to the company.
10th January 2017

Evaluation module aids inductive touch designs

Evaluation module aids inductive touch designs
Mouser Electronics says it is the first distributor is first to offer the LDC2114 Evaluation Module (EVM) for the LDC2112 and LDC2114 inductive touch solutions from Texas Instruments (TI). A new addition to TI’s sensing solutions, the LDC2114EVM demonstrates the use of inductive sensing to detect and measure the presence of conductive objects to implement inductive touch buttons.
9th January 2017

Compact SBC comes with Edge-Connect

Compact SBC comes with Edge-Connect
ADL Embedded Solutions has announced its compact ADLE3800SEC SBC with Edge-Connect. This ultra-compact 75mm x 75mm form factor is a full-featured, standalone SBC for rugged, embedded applications. The Edge-Connect architecture allows for added I/O expansion and connectors in a variety of baseboard/breakout board configurations for rugged, portable/mobile applications such as unmanned systems, robotics, remote datalogging, wearable computing or portable medical devices.
9th January 2017

Prototyping made easy with sensor evaluation kit

Prototyping made easy with sensor evaluation kit
  A sensor evaluation kit (expansion board) has been announced by ROHM which is equipped with seven sensors (i.e. accelerometer, barometric pressure, magnetic field), designed for use with existing open-source prototyping platforms such as Arduino and mbed.
6th January 2017

No boundaries for boundary scan at IPC Apex 2017

No boundaries for boundary scan at IPC Apex 2017
  JTAG Technologies return to San Diego this year to premiere several new hardware products for PCB testing and In-System [Device] Programming and -to introduce their new collaborative product with Altium – JTAG Maps. 
5th January 2017


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Mobile World Congress 2017
27th February 2017
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14th March 2017
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electronica China 2017
14th March 2017
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