TSV’s added-value is important, says Yole

“TSV’s added-value is important: increased performance and functionality, more compact devices, more efficient utilisation of the silicon space (See for example Sony's Exmor RS)”, explains Yole Développement.

Moreover, even if 3D TSV process steps are adding cost at the device manufacturing level, these technologies enable cost-saving in other parts of the supply chain.

Rozalia Beica, CTO & Business Director, Advanced Packaging and Semiconductor Manufacturing, Yole, comments: “No more doubts about adoption of 3D TSV platform across a wider range of applications: all key players added 3D TSV into their roadmaps, engineering samples have already started to ship and preparation is on-going for entering volume manufacturing."

This year, the industry witnessed several memory product announcements for high-end applications, with transfer to volume production planned in the near future. “Driven by the demand to further increase in performance, 2015 will be the year for the implementation of 3D TSV technology in high volume production,” explains Rozalia.

TSV in a nutshell

Yole’s vision on further 3D TSV technology adoption will be presented during the European 3D TSV Summit 2015 in Grenoble. The company is partnering with SEMI to support the European TSV Summit, which will take place 19th to 21st January, 2015, in Grenoble, France. The European 3D TSV Summit is organised by SEMI Europe.

At the European 3D TSV Summit, Jean-Christophe Eloy, President and CEO, Yole will moderate the panel discussion: 'From TSV Technology to Final Products - What is the Business for 3D Smart Systems?', taking place on Tuesday 20th, at 5:20 PM. Jean-Christophe will highlight 3D TSV market trends and technology challenges, especially its integration for 3D smart systems application. He will welcome the following panelists: Ron Huemoeller, Senior VP Advanced Product/Platform Development, AMKOR; Martin Schrems, VP of R&D, ams; Bryan Black, Senior Fellow, AMD; and Mustafa Badaroglu, Senior Program Manager, Qualcomm.

In parallel, Rozalia Beica will be part of the Market Briefing Symposium, on Monday 19th. Her presentation is titled: 'From Development to Manufacturing: An Overview of Industry's 3D Packaging Activities'.

“We are excited to have a group of highly qualified market experts, such as Yole Développement, joining us this year for the European 3D TSV Summit,” stated Anne-Marie Dutron, Director of SEMI Europe’s Grenoble office. “To highlight the adoption of 3D TSV technology in several market applications and to answer the demand from our members, we have given the business aspects of the 3D TSV industry more importance in this 2015 edition.”

During this web conference, SEMI plans to open relevant discussions and provide an overview of TSV technologies. Rozalia Beica, Yole Développement; Jean Michailos, STMicroelectronics; and Martin Schrems, ams, will be participating in this web session.

After the two successful editions that each brought over 300 participants from over 20 countries, SEMI will renew the Summit in 2015 with the theme: 'Enabling Smarter Systems', focusing on the critical chip integration that 3D TSVs now play in business strategies and the latest technology advancements.

European 3D TSV Summit will feature more than 20 presentations by invited executives and experts including design houses, IDMs, OSATs, equipment & materials suppliers. Its program is composed of panel discussions, market briefing, business meetings and exhibition areas.