SEHO announces that Gus Mavrou will present a paper titled “How Detailed Design Guidelines Can Improve Soldering Quality and Reduce Costs in Selective Through-Hole Soldering Processes” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session MFX5, titled “Developing a Robust Selective Solder Process,” which will take place Wednesday, October 19, 2011 from 2-3:30 p.m. in Room 202D.
For companies producing electronic equipment, it is of existential importance to reduce production costs while maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is unacceptable due to the required quality and the requested reproducibility of the whole manufacturing process.
Additionally, densely populated multilayer boards and miniaturized, high-pin-count, fine-pitch devices cannot be efficiently repaired with high quality. Hidden costs, such as productivity rates, operator training and damaged assembly costs have to be taken into consideration as well. Special focus must be given to lead-free applications as manual repair soldering processes can cause enormous thermal problems. Therefore, the target is a zero-fault soldering process that applies particularly for the soldering of single through-hole components after reflow.
With many practical examples, this presentation provides a detailed explanation of the individual points that should be found in the selective soldering process with regard to the assembly design and solder nozzle technology.